The present invention relates to solid electrolytic capacitors.
Conventionally, a structure as shown in
An anode lead frame (20) is fastened to this anode lead (16) by resistance welding or the like, and a cathode lead frame (21) is fastened to the cathode lead layer (4) by a conductive adhesive (5). The lead frames (20) and (21) are the boards made of copper or an alloy whose principal component is copper (see JP S63-293147A), in view of conductivity and thermal conductivity. It is possible to make the internal resistance of the capacitor small if the conductivity of the lead frames (20) and (21) is high. A housing (7) made of epoxy resin, for example, covers the outside of the capacitor element (15).
However the above-described capacitor has the following problem: The lead frames (20) and (21) are made of a material with high conductivity and high thermal conductivity. Therefore, when fastening the anode lead (16) by resistance welding, the generated joule heat and the applied current are conducted from the locations to be welded to other locations. As a result, welding strength of the resistance welding is not consistent and the anode lead (16) is easily detached from the anode lead frame (20).
It is an object of the present invention to stabilize the welding strength when the anode lead (16) and the anode lead frame (20) are fastened by resistance welding.
A contact resistance enlarging portion is formed on a junction face (22) of the anode lead frame (20) with the anode lead (16), the area over which the anode lead frame comes into contact with the anode lead being smaller than the portion other than the junction face (22). The contact resistance enlarging portion (52) may be constituted by any one of grooves (30), mottled portions (31), dimple portions (32), and protusions and depressions that are provided on the junction face (22).
In accordance with the present invention, the contact area between the anode lead (16) and the anode lead frame (20) is smaller than conventionally. Therefore the contact resistance increases, joule heat tends to increase and the amount of heat conduction becomes smaller when the parts are fastened by resistance welding. Hence, less heat is released from the welding location, the anode lead (16) and the anode lead frame (20) become easily welded and the welding strength is stabilized.
a) is a bottom view showing a junction face of an anode lead frame with an anode lead, and
a) is a diagram of an underside of a junction face of yet another anode lead frame with the anode lead, and
a) and (b) are bottom views of yet still another anode lead frame.
a) is a lateral view of another anode lead and an anode lead frame and
a), (b), and (c) are bottom views of still further anode leads and anode lead frames.
The overall structure of a solid electrolytic capacitor (8) of the present invention is similar to that of the conventional solid electrolytic capacitor shown in
a) is a bottom view showing a junction face (22) of the anode lead frame (20) that is connected to the anode lead (16) and
Therefore, the contact resistance between the anode lead frame (20) and the anode lead (16) increases. In other words, a contact resistance enlarging portion is formed by providing the grooves (30) on the junction face (22).
For this reason, when performing resistance welding, joule heat tends to increase and the amount of heat conduction becomes smaller. Hence, less heat is released, the anode lead (16) and the anode lead frame (20) are easily welded and the welding strength is stabilized. Because it is possible to perform resistance welding at a lower voltage than in the conventional article, it is possible to reduce the load on the capacitor element (15). By this, capacitor properties such as leakage current can be improved.
Since the grooves (30) are formed by press working the anode lead frame (20), there are protrusion portions (30a) at the edge portions of the grooves (30). However, it is also possible to remove the protrusion portions (30a) by etching, for example.
It should be noted that a mottled portions (31) may be provided on the junction face (22) of the anode lead frame (20) with the anode lead (16), as shown in
It is also possible to provide dimple portions (31) on the junction face (22) of the anode lead frame (20) with the anode lead (16), as shown in
It is further possible to provide protrusions (20b) on the anode lead frame (20) and fasten these protrusions (20b) to the anode lead (16) by resistance welding, as shown in
Also, as the bottom view in
In this embodiment, copper or an alloy whose principal component is copper is used as the anode lead frame (20), but the anode lead frame is not limited to copper or an alloy whose principal component is copper as long as the material has high conductivity and high thermal conductivity. For example, the same effect can be obtained when an aluminum alloy or nickel alloy is used. The grooves (30) of the anode lead frame (20) are not limited to the shape, number, or arrangement shown in
In the embodiment above, the contact resistance enlarging portion is formed on the anode lead frame (20), but in this embodiment, the contact resistance enlarging portion is formed on the plate-shaped anode lead (16).
a) is a lateral view of the anode lead (16) and the anode lead frame (20) and
Also in this structure, the area in which the anode lead frame (20) and the anode lead (16) are in contact is small. Therefore, the contact resistance between the anode lead frame (20) and the anode lead (16) increases, and when performing resistance welding, joule heat tends to increase and the amount of heat conduction becomes smaller. The anode lead (16) and the anode lead frame (20) are easily welded and the welding strength is stabilized.
Also, as
As
Number | Date | Country | Kind |
---|---|---|---|
2003-322935 | Sep 2003 | JP | national |
Number | Name | Date | Kind |
---|---|---|---|
6154358 | Fukaumi et al. | Nov 2000 | A |
6411498 | Nakamura | Jun 2002 | B1 |
6665172 | Kim et al. | Dec 2003 | B1 |
Number | Date | Country |
---|---|---|
63-293147 | Nov 1988 | JP |
5-243100 | Sep 1993 | JP |
2000-12387 | Jan 2000 | JP |
Number | Date | Country | |
---|---|---|---|
20050057889 A1 | Mar 2005 | US |