Claims
- 1. A solid electrolytic multilayer capacitor comprising a multilayer capacitor element comprising a plurality of stacked single plate capacitor elements comprising
an anode substrate comprising a plate-like valve-acting metal having on the surface thereof an oxide dielectric film layer, wherein an edge part of the anode substrate acts as an anode part and an area of said oxide dielectric film layer where a solid electrolyte layer and an electrically conducting layer are sequentially formed acts as a cathode part, said plurality of single plate capacitor elements are stacked such that the anode parts are stacked and fixed on a lead frame in an anode side while aligning the respective anode parts toward the same direction, the cathode parts are stacked and fixed on a lead frame in a cathode side through an electrically conducting adhesive layer to have an unfolded fan-like shape spreading out toward the distal end of the cathode part from the anode part side, and the plate-like valve-acting metal of each single plate capacitor element in the area having said solid electrolyte layer lies almost parallel with the lead frame in the cathode side.
- 2. A solid electrolytic multilayer capacitor comprising two multilayer capacitor elements each comprising a plurality of stacked single plate capacitor elements comprising
an anode substrate comprising a plate-like valve-acting metal having on the surface thereof an oxide dielectric film layer, wherein an edge part of the anode substrate acts as an anode part and an area of said oxide dielectric film layer where a solid electrolyte layer and an electrically conducting layer are sequentially formed acts as a cathode part, said plurality of single plate capacitor elements are stacked such that the anode parts are stacked and fixed on a lead frame in an anode side while aligning the respective anode parts toward the same direction, the cathode parts are stacked and fixed on a lead frame in a cathode side through an electrically conducting adhesive layer to have an unfolded fan-like shape spreading out toward the distal end of the cathode part from the anode part side, the cathode parts on the electrically conducting layers of two multilayer capacitor elements are bonded and fixed through the lead frame in the cathode side to lay in different directions respective to the anode parts.
- 3. A solid electrolytic multilayer capacitor each comprising a plurality of stacked single plate capacitor elements comprising
an anode substrate comprising a plate-like valve-acting metal having on the surface thereof an oxide dielectric film layer, wherein an edge part of the anode substrate acts as an anode part and an area of said oxide dielectric film layer where a solid electrolyte layer and an electrically conducting layer are sequentially formed acts as a cathode part, said plurality of single plate capacitor elements being stacked such that the anode parts of respective single plate capacitor elements are alternately aligned toward opposing directions, the anode parts aligned toward the same direction of alternately stacked elements are stacked and fixed on a lead frame in the anode side, and the cathode parts are stacked and fixed to one another by an electrically conducting adhesive layer, with at least one electrically conductive adhesive layer being fixed on a lead frame in the cathode side.
- 4. A solid electrolytic multilayer capacitor comprising a plurality of stacked and fixed single plate capacitor elements each comprising
an anode substrate comprising a plate-like valve-acting metal having on the surface thereof an oxide dielectric film layer, wherein an edge part of the anode substrate acts as an anode part and an area of said oxide dielectric film layer where a solid electrolyte layer and an electrically conducting layer are sequentially formed acts as a cathode part, wherein the single plate capacitor elements stacked are not the same in length as the solid electrolyte layer.
- 5. The solid electrolytic multilayer capacitor as claimed in any one of claims 1 to 4, wherein in the single plate capacitor element, a thickness of a distal end portion of the cathode part is larger than a thickness in a basal portion of the cathode part.
- 6. The solid electrolytic multilayer capacitor as claimed in any one of claims 1 to 4, wherein the electrically conducting adhesive layer is formed over the area from a distal end of the cathode part to 80% of the cathode part length.
- 7. The solid electrolytic multilayer capacitor as claimed in any one of claims 1 to 4, wherein the multilayer layer capacitor element comprises a plurality of stacked single plate capacitor elements stacked under pressure.
- 8. The solid electrolytic multilayer capacitor as claimed in any one of claims 1 to 4, wherein stacking and fixing between respective cathode parts of the plurality of single plate capacitor elements and between a cathode part and the lead frame in the cathode side are performed by means of an electrically conducting adhesive layer and the thickness of the electrically conducting adhesive layer of a single plate capacitor element is larger in a distal end portion of the cathode part than in a basal portion of the cathode part.
- 9. The solid electrolytic multilayer capacitor as claimed in any one of claims 1 to 4, wherein the solid electrolyte layer comprises an electrically conducting polymer.
- 10. The solid electrolytic multilayer capacitor as claimed in claim 9, wherein the electrically conducting polymer is a polymer containing at least one chemical moiety selected from the group consisting of a chemical structure of a polymerizable 5-membered heterocyclic compound, aniline, benzene, p-phenylene vinylene, thienylene vinylene, isothianaphthene, naphtho[2,3-c]thiophene and their substituted derivatives for forming a divalent group.
- 11. The solid electrolytic multilayer capacitor as claimed in claim 10, wherein the polymerizable 5-membered heterocyclic compound is 3,4-ethylenedioxy-thiophene or a substituted derivative thereof.
- 12. The solid electrolytic multilayer capacitor as claimed in any one of claims 1 to 4, wherein the number of stacked single plate capacitor elements stacked are from 2 to 20.
- 13. The solid electrolytic multilayer capacitor as claimed in claim 1, 2 or 4, wherein the stacking and fixing the single plate capacitor elements on a lead frame in the anode side while aligning the anode parts in the same direction is by spot welding.
- 14. The solid electrolytic multilayer capacitor as claimed in claim 3, wherein the stacking and fixing the anode parts aligned in the same direction on a lead frame in the anode side is by spot welding or laser welding.
- 15. A solid electrolytic multilayer capacitor having a CV value per unit volume, of 7.1×103 V·F/m3 or more.
- 16. The solid electrolytic multilayer capacitor as claimed in any one of claims 1 to 4, wherein the CV value per one unit volume is 7.1×103 V·F/m3 or more.
- 17. A process for fabricating a solid electrolytic multilayer capacitor comprising the steps of:
stacking a plurality of single plate capacitor elements while aligning anode parts stacked and fixed on a lead frame in an anode side toward the same direction, and stacking and fixing cathode parts on a lead frame in a cathode side through an electrically conducting adhesive layer to obtain an unfolded fan-like shape spreading out toward the distal end of the cathode part from the anode part side.
- 18. A process of fabricating a solid electrolytic multilayer capacitor comprising the steps of
stacking a plurality of single plate capacitor elements while aligning anode parts stacked and fixed on a lead frame in an anode side toward the same direction, and stacking and fixing cathode parts on a lead frame in a cathode side through an electrically conducting adhesive layer to obtain an unfolded fan-like shape spreading out toward the distal end of the cathode part from the anode part side to lay in different directions respective to the anode parts.
- 19. A process of fabricating a solid electrolytic multilayer capacitor comprising the steps of
stacking a plurality of single plate capacitor elements while alternately aligning anode parts stacked and fixed on a lead frame in the anode side in opposing directions and toward the same direction, and stacking and fixing cathode parts to one another by an electrically conducting adhesive layer, with at least one electrically conductive adhesive layer fixed on a lead frame in the cathode side.
Priority Claims (2)
Number |
Date |
Country |
Kind |
HEI. 11-352360 |
Dec 1999 |
JP |
|
P2000-206902 |
Jul 2000 |
JP |
|
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is an application filed under 35 U.S.C. §111(a) claiming benefit pursuant to 35 U.S.C. §119(e)(1) of the filing date of Provisional Application No. 60/218,804 filed Jul. 18, 2000 pursuant to 35 U.S.C. §111(b).
Provisional Applications (1)
|
Number |
Date |
Country |
|
60218804 |
Jul 2000 |
US |