Claims
- 1. Solvent free hot-melt compositions adapted to be extruded for use as sealants, adhesives, caulking compounds, expansion joints and the like consisting essentially of an unreacted mechanical mixture of 100 parts by weight of a polymerized elastomeric polysulfide compound having a molecular weight above about 15,000; with from about 1 to 400 parts by weight of tackifying resin selected from the group consisting of terpene resins, polyterpene resins, phenolic resins, hydrogenated rosin, hydrocarbon resins, and mixtures thereof; from about 15 to 600 parts by weight of plasticizer selected from the group consisting of polybutenes, polyisobutylenes, phosphate esters, dibutyl phthalate, straight chain aliphatic acid esters, parafine oils, coal tars, asphalts, chlorinated polyphenyl, chlorinated biphenyl and mixtures thereof; from about 0.5 to 60 parts by weight of adhesion promoter selected from the group consisting of epoxy resins organic silanes, urethane polyesters and polyethers, ethylene vinyl acetate, phenolic resins and non-reacting mixtures thereof; and from about 5 to 1000 parts of inert filler material; said composition being readily extrudable at temperatures above about 150.degree. while hardening upon cooling without undergoing chemical change, and having a hardness of about 5 to 95 on a Shore A Durometer at room temperature.
- 2. A hot melt composition as defined in claim 1 wherein the adhesion promoter includes an organic silane.
- 3. A hot melt composition as defined in claim 1 having composition in parts by weight;
- ______________________________________Polysulfide polymer 100Dibutyl phthalate 25Chlorinated biphenyl 50Chlorinated polyphenyl 50Stearic acid 2Calcium carbonate 70Carbon black 10Epoxy resin 20.______________________________________
- 4. A hot melt composition as defined in claim 1 having approximately the following composition in parts by weight;
- ______________________________________Polysulfide polymer 100Dibutyl phthalate 25Chlorinated biphenyl 25Chlorinated polyphenyl 50Stearic acid 2Calcium carbonate 70Carbon black 10Epoxy resin 20.______________________________________
- 5. A hot melt composition as defined in claim 1 having approximately the following composition in parts by weight;
- ______________________________________Polysulfide polymer 100Dibutyl phthalate 25Chlorinated biphenyl 10Chlorinated polyphenyl 50Stearic acid 2Calcium carbonate 70Carbon black 10Epoxy resin 20.______________________________________
- 6. A hot melt composition as defined in claim 1 having approximately the following composition in parts by weight;
- ______________________________________Polysulfide polymer 100Dibutyl phthalate 25Chlorinated polyphenyl 50Stearic acid 2Calcium carbonate 70Carbon black 10Epoxy resin 20.______________________________________
- 7. A hot melt composition as defined in claim 1 having approximately the following composition in parts by weight;
- ______________________________________Polysulfide polymer 100Dibutyl phthalate 25Chlorinated polyphenyl 50Stearic acid 2Calcium carbonate 65Titanium dioxide 15Gamma glycidoxyphenyl trimethyl silane 1Epoxy resin 20.______________________________________
Parent Case Info
This application is a continuation-in-part of copending application Ser. No. 460,332, filed Apr. 12, 1974, now U.S. Pat. No. 3,932,341 issued Jan. 13, 1976, which in turn is a continuation of application Ser. No. 256,928 filed May 25, 1972 now abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
3505258 |
Panek et al. |
Apr 1970 |
|
3882091 |
Villa |
May 1975 |
|
Continuations (1)
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Number |
Date |
Country |
Parent |
256928 |
May 1972 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
460332 |
Apr 1974 |
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