1. Field of the Invention
The present invention relates to a solid preparation packaging apparatus which is installed, for example, in hospitals or dispensing pharmacies in order to charge packaging sheets or bottles with solid preparations specified in a prescription (hereinafter, the solid preparation will be referred to all the solidified preparations such as medical tablets, capsules, pills, and troches).
2. Description of the Related Art
Conventionally, in hospitals and the like, solid preparation packaging apparatuses are used to separately wrap a dose (the amount to be taken at a time) of multiple types of medical tablets or capsules (which will be referred to as solid preparations) prescribed by the physician for each patient and then provide the dose to the patient (see Patent Literature 1).
This solid preparation packaging apparatus 1 is configured such that a solid preparation accommodating unit 3 with a number of vertically-elongated prism-shaped tablet cases 6 disposed in an array so as to accommodate solid preparations by type is located at an upper portion, and a discharge and count unit which functions to discharge and count the accommodated solid preparations is included under each of the tablet cases 6. Below the solid preparation accommodating unit 3, there is disposed a transfer mechanism 10 which is made up of a hopper and a conveyor. The transfer mechanism 10 receives the solid preparations discharged from the tablet cases 6 and guides the solid preparations to the charging port formed by the lower hopper member so that the solid preparations are collected to one place. Below the transfer mechanism 10, there is disposed a solid preparation packaging mechanism 14, which separately packs (referred to as separate wrapping) a dose (the amount to be taken at a time) of solid preparations collected to the charging port of the lower hopper member.
In the solid preparation packaging apparatus 1, with various types of solid preparations stored by type in the tablet cases 6, the operator inputs prescription data based on a prescription at an input unit such as a personal computer electrically connected to the solid preparation packaging apparatus 1 and then starts the solid preparation packaging apparatus 1. The controller of the solid preparation packaging apparatus 1 is then operated to actuate the discharge and count unit for a predetermined tablet case 6; a dose (the amount to be taken at a time) of solid preparations is discharged; and the solid preparations collected by the transfer mechanism 10 into the lower hopper member are introduced into the solid preparation packaging mechanism 14. In the solid preparation packaging mechanism 14, a pouch for the amount to be taken at a time is formed by a heat-sealing mechanism from a sequentially transferred packaging sheet 20, and then a dose (the amount to be taken at a time) of solid preparations collected into the lower hopper member is separately wrapped by being accommodated and then sealed in one pouch.
In the solid preparation packaging apparatus 1 which operates in this manner, the printing mechanism prints required information such as the timing of taking the dose and the name of the patient on each pouch. Accordingly, the controller incorporated into the solid preparation packaging apparatus 1 includes various types of electronic circuit boards on which formed are electronic circuits for exchanging information with the input unit as well as for controlling the discharge and count unit of the solid preparation accommodating unit 3, the conveyor of the transfer mechanism 10, the feed mechanism for the packaging sheet 20 in the solid preparation packaging mechanism 14, the heat-sealing mechanism, the printing mechanism and the like. The electronic circuit boards mainly include a central processing unit circuit board (also referred to as the CPU circuit board) for exchanging information with the input unit and for providing collective control to the solid preparation packaging apparatus 1, and a printing circuit board for the printing mechanism. Furthermore, the solid preparation packaging apparatus 1 also includes a power supply for supplying power to these circuit boards, power to the motor of the conveyor of the transfer mechanism 10, power to the motor of the feed mechanism for the packaging sheet 20 in the solid preparation packaging mechanism 14, and power to the driving portion and the heater of the heat-sealing mechanism.
Like the solid preparation packaging apparatus 1 disclosed in Patent Document 1, the main body may include the solid preparation accommodating unit 3 disposed at an upper portion, the transfer mechanism 10 disposed below the solid preparation accommodating unit 3, and the solid preparation packaging mechanism 14 disposed below the transfer mechanism 10. In this case, by taking the ease of loading solid preparations into the tablet cases 6 into account, the solid preparation accommodating unit 3 at the upper stage is capable of being pulled out or pushed back in the back-and-forth direction, while by taking inspection and repair into account, the transfer mechanism 10 and the solid preparation packaging mechanism 14 at the lower stages are capable of being simultaneously pulled out or pushed back in the back-and-forth direction. In this case, the printing circuit board and the power supply are accommodated near the solid preparation packaging mechanism 14 at a lower stage; however, the central processing unit circuit board is a fairly large flat plate, and thus by taking heat radiation into account, disposed vertically on the outer surface of the rear wall of the solid preparation packaging apparatus 1.
It is thus difficult to inspect or repair the solid preparation accommodating unit 3, the transfer mechanism 10, and the solid preparation packaging mechanism 14. In particular, it is cumbersome to incorporate, inspect, repair, or replace the wiring to each circuit board and the wiring to the power supply in the solid preparation packaging apparatus. Furthermore, since the central processing unit circuit board is disposed on the outer surface of the rear wall of the solid preparation packaging apparatus 1, the circuit board has to be covered with a cover in order to prevent the human body from touching the circuit board or dust particles from being adhered thereto. This leads to an increase in costs.
In view of these problems, the present invention provides a solid preparation packaging apparatus which facilitates the inspection and repair of the solid preparation accommodating unit, the transfer mechanism, and the solid preparation packaging mechanism as well as facilitates the incorporation, inspection, repair, and replacement of the wiring to each circuit board and the wiring to the power supply. Accordingly, since the fairly large flat central processing unit circuit board is disposed inside the solid preparation packaging apparatus, the technique of the present invention is configured to provide the solid preparation packaging apparatus at the lowest portion thereof with an electrical component chamber where the central processing unit circuit board and the power supply are accommodated, thereby facilitating the incorporation, inspection, repair, and replacement of the wiring to the central processing unit circuit board and the power supply. Furthermore, the provision of the electrical component chamber at the lowest portion of the solid preparation packaging apparatus makes it possible to provide a lowered center of gravity to the solid preparation packaging apparatus and thereby an improved effect of preventing the solid preparation packaging apparatus from being toppled over when the solid preparation accommodating unit, the transfer mechanism, and the solid preparation packaging mechanism are configured to be capable of being pulled out or pushed back in the back-and-forth direction.
Furthermore, in order that the solid preparation packaging apparatus which is operated with a voltage of 100 volt in Japan can also be used abroad or operated with a voltage higher than 100 volt (for example, at 120 volt), the power supply is additionally provided with a transformer as one component. For example, since the transformer to be employed to step down 120 volt to 100 volt is generally 5 to 6 kg in weight, the transformer can be placed at the center of the rear portion in the electrical component chamber. When this weight is used for the solid preparation accommodating unit, the transfer mechanism, and the solid preparation packaging mechanism to be capable of being pulled out or pushed back in the back-and-forth direction, the technique provides an effect of preventing the solid preparation packaging apparatus from being toppled over.
The solid preparation accommodating unit, the transfer mechanism, and the solid preparation packaging mechanism are configured to be capable of being pulled out or pushed back in the back-and-forth direction. In this case, when these components are drawn out or the number of tablet cases in the solid preparation accommodating unit increases, the solid preparation packaging apparatus would tend to be more easily unbalanced, causing concerns to rise over the danger of the apparatus being toppled over with the solid preparation accommodating unit kept drawn out. Accordingly, when the solid preparation packaging apparatus is used in Japan, a dedicated balance weight may be included. In this case, this balance weight leads to increase in costs because the weight is specially made and requires mounting holes to be provided on the mounting flanges. In this context, attention is focused on the fact that the aforementioned transformer for general-purpose use, which is comparatively inexpensive, can be employed at low costs as the balance weight. With a prediction that the solid preparation packaging apparatus should be able to be used in a given higher-voltage region as described above, the aforementioned transformer is incorporated into the solid preparation packaging apparatus being produced. When the solid preparation packaging apparatus is used in Japan, the wiring will detour around the transformer, which acts only as the balance weight, thereby providing, at low costs, the effect of preventing the apparatus from being toppled over. On the other hand, in the case when the solid preparation packaging apparatus is used abroad where a transformer must be used, the solid preparation packaging apparatus into which the transformer is incorporated can be exported. Thus, the technique of the present invention makes it possible to make the solid preparation packaging apparatus available abroad as well as in Japan and implement at low costs the effect of preventing the apparatus from being toppled over.
Furthermore, the solid preparation packaging apparatus is additionally provided at the lowest portion thereof with the electrical component chamber where the central processing unit circuit board and the power supply are accommodated. In this case, the technique of the present invention makes the inventive solid preparation packaging apparatus greater in height than a conventional solid preparation packaging apparatus, thereby facilitating the incorporation, inspection, repair, and replacement of the wiring associated with the central processing unit circuit board and the power supply. Furthermore, the technique also makes it possible to provide the solid preparation packaging apparatus with a lowered center of gravity and thereby an improved effect of preventing the apparatus from being toppled over when the solid preparation accommodating unit, the transfer mechanism, and the solid preparation packaging mechanism are configured to be capable of being pulled out or pushed back in the back-and-forth direction.
Furthermore, the specific solid preparation supply unit may be disposed on the upper surface of the solid preparation packaging apparatus so that specific solid preparations are loaded from above into the buckets of the specific solid preparation supply unit. In this case, the solid preparation packaging apparatus provided by the present invention makes the inventive solid preparation packaging apparatus greater in height than a conventional solid preparation packaging apparatus so as to facilitate the loading of the specific solid preparations from above into the buckets.
Furthermore, treating foreign characters other than Japanese characters and English letters as text data would require high costs for creating and processing the data. In order to solve this problem, the present invention provides a solid preparation packaging apparatus which can treat the text data as image data for printing and which includes a specific character printing circuit board, for providing control to printing, in the electrical component chamber at the lowest portion of the apparatus, thereby facilitating the mounting of the circuit board and the wiring to the circuit board.
A first aspect of the present invention relates to a solid preparation packaging apparatus, in a main body of which a solid preparation accommodating unit having a plurality of tablet cases disposed in an array is disposed at an upper portion, each of the tablet cases accommodating solid preparations by type, the solid preparation accommodating unit having a discharge mechanism for discharging the accommodated solid preparations; a transfer mechanism unit for receiving the solid preparations discharged from the tablet cases and collecting the solid preparations into a charging port is disposed below the solid preparation accommodating unit; and a solid preparation packaging mechanism unit for forming a pouch on a strip of packaging sheet and for charging each pouch with the solid preparations collected in the charging port and sealing the pouch is disposed below the transfer mechanism unit. The solid preparation packaging apparatus is configured such that
the solid preparation accommodating unit, the transfer mechanism unit, and the solid preparation packaging mechanism unit are each individually accommodated in the main body so as to be capable of being pulled out or pushed back in the back-and-forth direction;
the solid preparation packaging mechanism unit includes a printing mechanism unit for printing on the pouch;
the main body is provided with an electrical component chamber below the solid preparation packaging mechanism;
the electrical component chamber is provided with a central processing unit circuit board (also referred to as a CPU circuit board) for providing collective control to the solid preparation packaging apparatus, and a power supply for supplying power to the solid preparation accommodating unit, the transfer mechanism unit, and the solid preparation packaging mechanism unit; and
a flexible wiring cover which is continually curved as the solid preparation packaging mechanism unit is pulled out of or pushed back into the main body is mounted across the electrical component chamber and the solid preparation packaging mechanism unit in order to pass, through the flexible wiring cover, the wiring of the solid preparation packaging mechanism unit to the central processing unit circuit board and the power supply.
A second aspect of the present invention relates to a solid preparation packaging apparatus, in a main body of which a solid preparation accommodating unit having a plurality of tablet cases disposed in an array is disposed at an upper portion, each of the tablet cases accommodating solid preparations by type, the solid preparation accommodating unit having a discharge mechanism for discharging the accommodated solid preparations; a transfer mechanism unit for receiving the solid preparations discharged from the tablet cases and collecting the solid preparations into a charging port is disposed below the solid preparation accommodating unit; and a solid preparation packaging mechanism unit for forming a pouch on a strip of packaging sheet and for charging each pouch with the solid preparations collected in the charging port and sealing the pouch is disposed below the transfer mechanism unit. The solid preparation packaging apparatus is configured such that
the solid preparation accommodating unit, the transfer mechanism unit, and the solid preparation packaging mechanism unit are each individually accommodated in the main body so as to be capable of being pulled out or pushed back in the back-and-forth direction;
the solid preparation packaging mechanism unit includes a printing mechanism unit for printing on the pouch;
the main body is provided with an electrical component chamber below the solid preparation packaging mechanism;
the electrical component chamber is provided with a central processing unit circuit board (also referred to as a CPU circuit board) for providing collective control to the solid preparation packaging apparatus, and a power supply for supplying power to the solid preparation accommodating unit, the transfer mechanism unit, and the solid preparation packaging mechanism unit, the electrical component chamber being further provided with an image printing circuit board required for the printing mechanism unit to print based on image data; and
a flexible wiring cover which is continually curved as the solid preparation packaging mechanism unit is pulled out of or pushed back into the main body is mounted across the electrical component chamber and the solid preparation packaging mechanism unit in order to pass, through the flexible wiring cover, the wiring of the solid preparation packaging mechanism unit to the central processing unit circuit board, the image printing circuit board, and the power supply.
A third aspect of the present invention relates to the solid preparation packaging apparatus according to the first and second aspects of the invention, wherein the printing circuit board of the printing mechanism unit is disposed at the solid preparation packaging mechanism unit.
A fourth aspect of the present invention relates to the solid preparation packaging apparatus according to any one of the first to third aspects of the invention, wherein a step-down transformer is provided as a component of the power supply, and the transformer is mounted at a weight balance position at the center of a rear portion in the electrical component chamber.
A fifth aspect of the present invention relates to the solid preparation packaging apparatus according to any one of the first to fourth aspects of the invention, wherein
the main body is provided at a top front portion thereof with a specific solid preparation supply unit for supplying, to the transfer mechanism unit, specific solid preparations accommodated in a plurality of buckets each having an upper opening,
on a top surface region of the main body behind the specific solid preparation supply unit, a flat surface is formed to place thereon an input unit such as a personal computer for transmitting and receiving information to/from the central processing unit circuit board; and
a flat-shaped lid to cover the buckets can be removably placed on the specific solid preparation supply unit.
According to the first aspect of the present invention, the solid preparation accommodating unit, the transfer mechanism, and the solid preparation packaging mechanism can be each individually configured to be pulled out or pushed back in the back-and-forth direction, and can be thus inspected and repaired with ease. Furthermore, the solid preparation accommodating unit, the transfer mechanism, and the solid preparation packaging mechanism are each individually capable of being pulled out or pushed back in the back-and-forth direction. Additionally, the main body of the solid preparation packaging apparatus is provided at the lowest portion thereof with the electrical component chamber, where the central processing unit circuit board and the power supply are accommodated. Accordingly, when compared with a conventional solid preparation packaging apparatus which has the central processing unit circuit board disposed on the outer surface of the rear wall thereof, the central processing unit circuit board provided inside the main body of the solid preparation packaging apparatus eliminates the need for covering the same with a special cover in order to prevent the circuit board from being touched by the human body or prevent dust particles from being adhered to the circuit board. This makes it possible to cut costs as compared with the aforementioned conventional one.
Furthermore, the main body is provided at the lowest portion thereof with the electrical component chamber, where the central processing unit circuit board and the power supply are accommodated. When compared with the conventional one, this structure facilitates the incorporation, inspection, repair, and replacement of the wiring to the central processing unit circuit board and the power supply. Furthermore, the provision of the electrical component chamber at the lowest portion of the solid preparation packaging apparatus makes it possible to provide a lowered center of gravity to the solid preparation packaging apparatus. This structure can provide an improved effect of preventing the solid preparation packaging apparatus from being toppled over when the solid preparation accommodating unit, the transfer mechanism, and the solid preparation packaging mechanism are configured to be capable of being pulled out or pushed back in the back-and-forth direction.
Furthermore, the flexible wiring cover which is continually curved as the solid preparation packaging mechanism unit is pulled out or pushed back is mounted across the electrical component chamber and the solid preparation packaging mechanism unit. This structure allows, as a matter of course, the solid preparation packaging mechanism unit to be smoothly pulled out or pushed back while the wiring is protected. Additionally, in this structure, the electrical wiring from the electrical component chamber at the lowest portion to the solid preparation packaging mechanism unit disposed above the same can be inspected and repaired with ease because the flexible wiring cover portion can be visually checked with the solid preparation packaging mechanism unit kept drawn out.
According to the second aspect of the present invention, the electrical component chamber is provided, in addition to the central processing unit circuit board and the power supply, with the image printing circuit board required for the printing mechanism unit to print based on image data. The flexible wiring cover mounted across the electrical component chamber and the solid preparation packaging mechanism unit is configured such that the wiring of the solid preparation accommodating unit, the transfer mechanism unit, and the solid preparation packaging mechanism unit is passed through the flexible wiring cover to the central processing unit circuit board, the image printing circuit board, and the power supply. This structure, including the wiring from the electrical component chamber to the image printing circuit board, can provide the same effects as those of the aforementioned first aspect of the invention.
According to the third aspect of the present invention, the printing mechanism unit and the printing circuit board are provided in conjunction with the solid preparation packaging mechanism unit, whereby the wiring for connecting between the printing mechanism unit and the printing circuit board can be reduced in length. Furthermore, the printing circuit board and the central processing unit circuit board can be laid through the flexible wiring cover, whereby the same effects as those of the aforementioned first aspect of the invention can be provided.
According to the fourth aspect of the present invention, in order that the solid preparation packaging apparatus which is operated with a voltage of 100 volt in Japan can also be used abroad or operated with a voltage higher than 100 volt (for example, at 120 volt), the power supply is additionally provided with a transformer as one component. In this case, for example, a transformer for general-purpose use which is to step down 120 volt to 100 volt is typically 5 to 6 kg in weight. Accordingly, the transformer can be incorporated into the solid preparation packaging apparatus in advance so that the user can choose whether to use the apparatus in Japan or abroad. It is thus possible to preferably prevent the solid preparation packaging apparatus from being toppled over, without a costly special balance weight.
Concerning the fifth aspect of the present invention, while the main body is provided on the top front portion thereof with the specific solid preparation supply unit for accommodating specific solid preparations in the buckets and supplying the specific solid preparations to the transfer mechanism unit, information including information on the specific solid preparations accommodated in the buckets may be transmitted/received using an input unit such as a personal computer to/from the central processing unit circuit board. In this case, manipulating this input unit placed on a desk or the like installed near the solid preparation packaging apparatus would require the place for the desk and is inconvenient. Accordingly, to allow the input unit to be used on the solid preparation packaging apparatus, a flat area for placement of the input unit is formed on the top surface region of the main body behind the specific solid preparation supply unit. On the other hand, the buckets of the specific solid preparation supply unit have to be covered with a lid for hygienic reasons. Conventionally, since this lid was of an open/close type, the input unit placed behind the lid could not be operated with the lid open. The fifth aspect of the invention provides a solid preparation packaging apparatus which solves these problems at one stroke by placing the flat-shaped lid, for covering the buckets, so as to be removably placed on the specific solid preparation supply unit, whereby the input unit can be manipulated with ease.
The present invention provides a solid preparation packaging apparatus, in the main body of which a solid preparation accommodating unit having a plurality of tablet cases disposed in an array is disposed at an upper portion, each of the tablet cases accommodating solid preparations by type, the solid preparation accommodating unit having a discharge mechanism for discharging the accommodated solid preparations; a transfer mechanism unit for receiving the solid preparations discharged from the tablet cases and collecting the solid preparations into a charging port is disposed below the solid preparation accommodating unit; and a solid preparation packaging mechanism unit for forming a pouch on a strip of packaging sheet and for charging each pouch with the solid preparations collected in the charging port and sealing the pouch is disposed below the transfer mechanism unit. The solid preparation packaging apparatus is configured such that
the solid preparation accommodating unit, the transfer mechanism unit, and the solid preparation packaging mechanism unit are each individually accommodated in the main body so as to be capable of being pulled out or pushed back in the back-and-forth direction;
the solid preparation packaging mechanism unit includes a printing mechanism unit for printing on the pouch and a printing circuit board for the printing mechanism unit;
the main body is provided with an electrical component chamber below the solid preparation packaging mechanism;
the electrical component chamber is provided with a central processing unit circuit board (also referred to as a CPU circuit board) for providing collective control to the solid preparation packaging apparatus, and a power supply for supplying power to the solid preparation accommodating unit, the transfer mechanism unit, and the solid preparation packaging mechanism unit; and
a flexible wiring cover which is continually curved as the solid preparation packaging mechanism unit is pulled out of or pushed back into the main body is mounted across the electrical component chamber and the solid preparation packaging mechanism unit in order to pass, through the flexible wiring cover, the wiring of the solid preparation accommodating unit, the transfer mechanism unit, and the solid preparation packaging mechanism unit to the central processing unit circuit board and the power supply. The embodiment thereof will now be described below.
The solid preparation packaging apparatus according to the present invention is installed, for example, in hospitals or dispensing pharmacies in order to charge a solid preparation specified in a prescription (hereafter, the solid preparation will be referred to all types of solidified preparations such as medical tablets, capsules, pills, and troches) into packaging sheets, bottles or the like. The embodiment to be described below relates to a solid preparation packaging apparatus which is configured to charge a solid preparation into a pouch formed on a packaging sheet shaped in an elongated strip.
As shown in
The solid preparation accommodating unit 3 is provided with a plurality of tablet cases 6 in an array, each for accommodating solid preparations, i.e., solidified medicines such as the medical tablets, capsules, pills, and troches, according to the type thereof. Below each of the tablet cases 6, there is disposed a discharge mechanism 6A for discharging solid preparations one by one. The discharge mechanism 6A includes a motor-driven discharge drum thereinside and is provided with a discharge and count unit such as a photo-sensor. The discharge drum is constructed to allow solid preparations to be received vertically in one line in a plurality of grooves formed on the side thereof. Then, the discharge drum is configured to rotate and thereby drop the solid preparations one by one from each groove, and the number of the solid preparations is detected and counted by the discharge and count unit. As shown in
As shown in
The tablet cases 6 are drawable in the back-and-forth direction in this manner, which allows for replenishing the tablet cases 6 with solid preparations or replacing the tablet cases 6 themselves without requiring any space above the solid preparation packaging apparatus 1. This allows for saving space.
Furthermore, as shown, for example, in
The specific solid preparation supply unit 7 is detachably provided on the main body 2. The specific solid preparation supply unit 7 is configured to include, on the main body 2, a motor 8 and a pulley 9 which is coupled to the motor 8 by means of a belt 8A, allowing a shaft 9A of the pulley 9 to fit into one of the pulleys 44 on one end side of the specific solid preparation supply unit 7. Then, when driven by the motor 8, the timing belt 46 is driven to rotate.
Furthermore, as shown in
Furthermore, the bottom surface of each of the buckets 47 is provided with an open/close bucket lid 47A which is pivotably supported so as to be opened downwardly in the travel direction. When the bucket 47 comes to an opening 7C in the drop passageway 7B, the bucket lid 47A is opened downwardly so that the specific solid preparation in the bucket 47 is allowed to drop through the drop passageway 7B as indicated with arrow P in
This structure allows the specific solid preparations in each of the buckets 47 to be discharged only by means of the motor 8 without requiring other driving units, and thus the entire structure is simplified. Note that the bucket lid 47A is hit and then closed by the main body 2 after the buckets 47 passed through the opening 7C.
As shown in
The conveyor 52 includes right and left rotational rollers 55, and an elastic sheet 61 looped over these rollers 55 with a predetermined tension. The conveyor 52 is driven by a motor (not shown) so that the upper surface travels in the transfer direction or from left to right as denoted by arrow Q in
There is provided a shutter unit 71 on the lower side of the lower hopper member 41. The shutter unit 71 allows a controller 35 (to be discussed later) to control a solenoid (not shown), so that right and left shutter plates 72 and 73 (to be discussed later) are driven to open or close the charging port 13, allowing the solid preparation in the lower hopper member 41 to be delivered downward.
The solid preparation packaging mechanism unit 14 is provided with a printing mechanism unit 15, a first heat-sealing mechanism unit 28, a second heat-sealing mechanism unit 29, and transfer means for the packaging sheet 20 (to be discussed later), which are each disposed on a flat-shaped table 96 along a transfer passageway through which the packaging sheet 20 is transferred in the form of an elongated strip. The solid preparation packaging mechanism unit 14 is configured such that the table 96 can be pulled out of and pushed back into the main body 2 in conjunction with the front door 43 along rail units 97 which are provided on both the right and left sides in the main body 2.
The solid preparation packaging mechanism unit 14 is provided with the transfer means for the packaging sheet 20 as described above. The transfer means for the packaging sheet 20 includes: feed means for feeding the packaging sheet 20 in the form of an elongated strip from a packaging sheet roll 20R around which an elongated strip of the packaging sheet 20 is wound in a roll shape; guide means for guiding the fed packaging sheet 20 to a predetermined position; and pull-in means for pulling the leading end of the packaging sheet 20. As shown in a partially enlarged perspective view in
Here, a description will be made to the packaging sheet 20. The packaging sheet 20 serves to receive and pack the solid preparation and the specific solid preparation, and is made of a thin heat-sealable paper material with a heat-sealable material, such as polyethylene dissolved at a predetermined temperature, employed as an supplemental medium. A longitudinally elongated strip of the packaging sheet 20 of a predetermined width is wound around the hollow shaft 21 in a roll shape. Furthermore, the packaging sheet 20 is folded into two generally at the center in the width direction so as to form a double sheet. Thus, the packaging sheet 20 has a fold 20A or the lower end of the folded double sheet and an opening 20B defined by both ends of the folded double sheet (the upper ends opposite to the fold 20A). The packaging sheet 20 is wound around the hollow shaft 21 and forms the packaging sheet roll 20R while kept in the form of the folded double sheet, and is provided with a hard portion 20C at an extreme end of the packaging sheet roll 20R, i.e., at the leading end of the packaging sheet 20.
The hard portion 20C is formed in a predetermined size from the leading end of the packaging sheet 20 so as to prevent the packaging sheet 20 from being easily deformed when loaded up to pull-in rollers 30 through the printing mechanism unit 15, the first heat-sealing mechanism unit 28, and the second heat-sealing mechanism unit 29, to be discussed later. The hard portion 20C is formed, for example, by heat-sealing the entire range of the predetermined size from the leading end of the packaging sheet 20 (the trailing end of the winding of the packaging folded double sheet 20 which is wound around the hollow shaft 21). This allows the packaging sheet 20 to be loaded in a normal condition up to the pull-in rollers 30 without the leading end of the packaging sheet 20 being easily bent. The pull-in rollers 30 are equivalent to the aforementioned pull-in means which pulls the leading end of the packaging sheet 20, and as shown in
Furthermore, the packaging sheet roll 20R wound in a roll shape reaches the pull-in rollers 30 through the transfer passageway having a straight passageway portion and a curved passageway portion while being drawn in the shape of an elongated strip. The curved passageway portion has a guide roller disposed as appropriate, while the straight and curved passageway portions have a guide wall disposed as appropriate. These guide roller and guide wall constitute the guide means which guides the fed packaging sheet 20 to a predetermined position, thereby allowing the packaging sheet 20 to smoothly pass through the curved passageway.
As shown in
Furthermore, as shown in
The first heaters 28A and 28B sandwich and heat the packaging sheet 20 on the both sides thereof to thereby perform transverse heat-sealing 27A on the leading side of the packaging sheet 20 in the feed direction. On the other hand, the second heaters 29A and 29B sandwich and heat the packaging sheet 20 on the both sides thereof to thereby perform transverse heat-sealing 27B on the trailing side of the packaging sheet 20 in the feed direction subsequently to the heat-sealing 27A, and also perform heat-sealing 27B on the opening 20B at the upper portion. As indicated with arrow R in
Furthermore, the second heaters 29A and 29B form a plurality of perforated holes 37 generally along the center of the width of a heat-sealed portion 27B (from the fold 20A to the opening 20B) when heat-sealing from the fold 20A to the opening 20B of the packaging sheet 20 above the transverse heat-sealing 27A performed by the first heaters 28A and 28B. This allows the three sides of the packaging sheet 20 other than the fold 20A to be heat-sealed to provide a rectangular pouch 36 with the entire perimeter closed, and the pouches 36 can be separated from each other by being torn off along the perforated holes 37.
Such a structure allows the packaging sheet roll 20R to be rotated by the feed motor 18 and the packaging sheet 20 to be thereby fed, so that the hard portion 20C formed at the leading end of the packaging sheet 20 travels toward the pull-in rollers 30 sequentially through the transfer passageway. Then, as shown in
When the packaging sheet 20 has been fed to the pull-in rollers 30, both the rubber rollers 33A and 33B of the pull-in rollers 30, while in pressure contact with each other, pull the packaging sheet 20 in the opposite direction (toward the right in
Here, the feed motor 18 and the pull-in motor 31 are rotated in a manner such that the amount of travel of the packaging sheet 20 pulled in between the pull-in rollers 30 is greater than the amount of travel of the packaging sheet 20 fed from the roll-shaped packaging sheet 20R, so as to provide a predetermined tension between the roll-shaped packaging sheet 20R and the pull-in rollers 30, thereby allowing the packaging sheet 20 to be transferred with stability.
When the roll-shaped packaging sheet roll 20R is loaded in a predetermined condition, the condition is detected by a switch (not shown). When the solid preparation packaging apparatus 1 is turned on under that condition, the count of the number of dropped solid preparations is reset. Furthermore, it is assumed that the sub-heater 28 and the main heater 29 have been heated to a predetermined temperature and the conveyor 52 has been energized and thereby driven.
On the basis of a physician's prescription, the operator enters the prescription data on an input unit PC (such as a personal computer), which is electrically connected to the solid preparation packaging apparatus 1, and then presses the start key. This causes the discharge drum of the tablet cases 6, in which the solid preparation is stored, to be rotationally driven, so that the solid preparation of the type that is specified by the prescription data is dropped one by one into the hopper 51 or onto the conveyor 52. Furthermore, the solid preparation fed from the specific solid preparation supply unit 7 is also allowed to drop onto the conveyor 52 in the same manner by a user's given operation.
For example, as shown in
The number of solid preparations being dropped from the tablet cases 6 is counted by the controller 35 on the basis of the output from the photo-sensor. When the count of dropped solid preparations agrees with the number of solid preparations specified by the prescription data, the operation of the discharge mechanism 6A is stopped to finish dropping the solid preparation.
At this time, the solid preparation from the tablet cases 6 above the lower hopper member 41 will directly drop into the lower hopper member 41. Furthermore, the solid preparation dropped onto the upper hopper member 53 drops into the lower hopper member 41 due to the inclination of the upper hopper member 53. The solid preparation dropped onto the upper hopper member 53 drops onto the elastic sheet 61 of the conveyor 52 due to the inclination of the upper hopper member 53. Then, the solid preparations are fed into the lower hopper member 41 in conjunction with those that have been directly dropped onto the elastic sheet 61.
Here, since the conveyor 52 is inclined, the solid preparation on the elastic sheet 61 is fed to the lower hopper member 41 by means of this inclination and the transfer power of the conveyor 52 itself. In particular, the inclination of the conveyor 52 can prevent or retard cylindrical tablets or the like from being rotated where they are on the elastic sheet 61.
Then, the solid preparations collected in this manner in the lower hopper member 41 are temporarily retained on the shutter unit 71. As shown in
Since the solid preparations are loaded into the pouch 36A by wide opening the opening 20B by the shutter plates 72 and 73 in this manner, the solid preparations can be charged into the pouch 36A of the packaging sheet 20 smoothly with reliability. Furthermore, since the shutter plates 72 and 73 also serve to temporarily retain the solid preparation dropped with the charging port 13 closed, it is possible to reduce parts count.
As shown in
The required information is printed by the printing mechanism unit 15 on the pouch 36 on the basis of the prescription data in this manner. At the same time, a given number of solid preparations of the type based on the prescription data are automatically packed in the pouch 36, so that a strip of the package with a series of the pouches 36 in which the solid preparations are packed is fed to the pull-out port 77. When the predetermined packaging work is completed in this manner, the operation of the solid preparation packaging apparatus 1 is stopped. The user of the solid preparation packaging apparatus 1 tears off the strip of the package with the series of the pouches 36 along the last perforated holes 37 thereof, takes the strip of the package out of the pull-out port 77, and then passes the package to the patient.
The present invention provides the aforementioned solid preparation packaging apparatus 1 with a structure which facilitates wiring to each circuit board constituting the controller 35 and the incorporation, inspection, repair, and replacement of the wiring in the power supply. The present invention also provides an improved technique for preventing the solid preparation packaging apparatus 1 having a lowered center of gravity from being toppled over when the solid preparation accommodating unit 3, the transfer mechanism 10, and the solid preparation packaging mechanism 14 are constructed to be pulled out or pushed back in the back-and-forth direction. Now, a description will be made to this technique.
The controller 35 refers to the entire control circuit which consists of a central processing unit circuit board (also referred to as the CPU circuit board) 90 as a main component and a printing circuit board 91 of the printing mechanism unit 15 electrically connected to the CPU circuit board 90. The CPU circuit board 90 has a central processing unit (CPU) circuit which exchanges information with the input unit PC such as a personal computer electrically connected to the solid preparation packaging apparatus 1 and which is responsible for collective control over the solid preparation packaging apparatus 1.
The aforementioned solid preparation packaging apparatus 1 provides the following collective control: exchange of information with the input unit PC; ON/OFF control of the solid preparation packaging apparatus 1; feed control of the solid preparation from the solid preparation accommodating unit 3; feed control of the specific solid preparation from the specific solid preparation supply unit 7; detection of the attachment condition of the packaging sheet roll 20R; control over the feed means for feeding the packaging sheet 20 in the shape of a strip, the guide means for guiding the fed packaging sheet 20 to a predetermined position, the pull-in means for pulling the leading end of the packaging sheet 20, the conveyor 52, the shutter unit 71, and the first heat-sealing mechanism unit 28 and the second heat-sealing mechanism unit 29 which form the pouch 36 on the packaging sheet 20; control on printing by the printing mechanism unit 15 onto the packaging sheet 20; and control on displaying on a display unit 100. This collective control is provided so that the operation of each component of the solid preparation packaging apparatus 1, such as the solid preparation accommodating unit 3, the specific solid preparation supply unit 7, the transfer mechanism 10, and the solid preparation packaging mechanism 14, is executed with predetermined timing and in a given step.
For example, as shown in
To smoothly lay electrical wiring 95 from the solid preparation packaging mechanism unit 14 to the central processing unit circuit board 90 and the power supply 92, a flexible wiring cover 93 which is continuously curved as the solid preparation packaging mechanism unit 14 is pulled out of or pushed back into the main body 2 is laid between the electrical component chamber 80 and the solid preparation packaging mechanism unit 14. The flexible wiring cover 93 is disposed in close proximity to the inner surface of the sidewall of the main body 2 on one of the right and left sides of the electrical component chamber 80 and the solid preparation packaging mechanism unit 14.
The flexible wiring cover 93 is well-known as disclosed, for example, in Japanese Patent Application Laid-Open No. 2004-242481, and configured such that a plurality of links 94 are coupled to each other to be rotationally moved, and the wiring 95 is inserted into the coupled links 94 with the wiring 95 kept flexible. Thus, the flexible wiring cover 93 having such a function would not be limited to a particular structure.
As shown in
As shown in
Then, as shown in
On the other hand, to accommodate the solid preparation packaging mechanism unit 14 in the main body 2, the front door 43 is pushed back and thereby the table 96 supported on the rail units 97 is pushed back at the same time. At that time, the flexible wiring cover 93 serves to smoothly push back the solid preparation packaging mechanism unit 14 by allowing the wiring 95 passing through the links 94 to be curved while the position of the curved portion 93A is moved as the coupled links 94 rotationally move one after another.
The printing mechanism unit 15 includes the printing circuit board 91 which is necessary for the printing mechanism unit 15 to print pre-set characters (Japanese characters in this example), and the printing circuit board 91 is covered with a cover 98 that is detachably screwed onto the table 96. Note that to dissipate heat from the solid preparation packaging apparatus 1 including the solid preparation packaging mechanism unit 14, there is provided a heat radiation fan 105 on the table 96 or on the rear wall of the main body 2 corresponding to the heat radiation hole formed on the rear wall of the main body 2 associated with the solid preparation packaging mechanism unit 14.
The wiring 95 extending from the electrical component chamber 80 through the flexible wiring cover 93 to the area of the solid preparation packaging mechanism unit 14 includes the wiring related to the solid preparation packaging mechanism unit 14: the power supply lines from the power supply 92 to the printing mechanism unit 15, the first heat-sealing mechanism unit 28, the second heat-sealing mechanism unit 29, and the transfer means of the packaging sheet 20, which constitute the solid preparation packaging mechanism unit 14; a signal communication line from the central processing unit circuit board 90 to the printing circuit board 91; and a signal communication line to an image printing circuit board 103 (to be discussed later) and the printing mechanism unit 15. Note that it is preferable that the power supply lines from the power supply 92 to the solid preparation accommodating unit 3, the transfer mechanism unit 10, and the specific solid preparation supply unit 7 pass through the flexible wiring cover 93. Furthermore, as shown in
As described above, to dispose the central processing unit circuit board 90 or a fairly large flat-shaped board inside the solid preparation packaging apparatus 1, the solid preparation packaging apparatus 1 is provided at the lowest portion thereof with the electrical component chamber 80, where the central processing unit circuit board 90 and the power supply 92 are accommodated, thereby facilitating the incorporation, inspection, repair, and replacement of the wiring to the central processing unit circuit board 90 and the power supply 92. Furthermore, the provision of the electrical component chamber 80 at the lowest portion in the solid preparation packaging apparatus 1 makes it possible to provide a lowered center of gravity to the solid preparation packaging apparatus 1 and thereby an improved effect of preventing the apparatus 1 from being toppled over when the solid preparation accommodating unit 3, the transfer mechanism unit 10, and the solid preparation packaging mechanism unit 14 are configured to be capable of being pulled out or pushed back in the back-and-forth direction.
Furthermore, the flexible wiring cover 93 that is continually curved as the transfer mechanism unit 10 is pulled out of or pushed back into the main body 2 is mounted across the electrical component chamber 80 and the transfer mechanism unit 10 in order to allow the wiring 95 to pass from the solid preparation accommodating unit 3, the transfer mechanism unit 10, and the solid preparation packaging mechanism unit 14 to the central processing unit circuit board 90 and the power supply 92. As a matter of course, this structure allows the transfer mechanism unit 10 to be smoothly pulled out or pushed back while protecting the wiring 95. Additionally, when compared with the solid preparation packaging apparatus 1 which has a conventional two-stage structure (with the solid preparation accommodating unit in the first stage, and the transfer mechanism unit and the solid preparation packaging mechanism unit in the second stage) as well as the apparatus 1 which has a conventional three-stage structure (with the solid preparation accommodating unit in the first stage, the transfer mechanism unit and the solid preparation packaging mechanism unit in the second stage, and the backup chamber in the third stage), the main body 2 of the solid preparation packaging apparatus 1 may be increased in height and the specific preparation supply unit 7 may be disposed on the front top of the solid preparation packaging apparatus 1. In this case, the height can be designed so as to facilitate loading of specific solid preparations into the specific preparation supply unit 7, also allowing the input unit PC to be placed on the upper surface of the solid preparation packaging apparatus 1 so as to be always operated with ease.
On the other hand, to adapt the solid preparation packaging apparatus 1 for use abroad, it is necessary to print characters (to be referred to as specific characters) based on the language of the country. In this case, to treat the language of the country as text data, a great deal of time and costs may be required for the development of software. In order to avoid such a situation, the present invention treats the language of such a country not as text data but as image data, so that the image data may be used by the printing mechanism unit 15 to print required information, such as the product name of and the timing of taking the solid preparation, on the outer surface of the portion equivalent to the pouch 36. The characters to be treated as the specific characters include, for example, Arabic characters and Chinese characters other than Japanese characters and English letters.
Thus, according to the present invention, the text representative of the required information such as the product name of and the timing of taking the solid preparation to be printed on the outer surface of the pouch 36 is pre-stored in a memory device as image data, so that at the time of printing, the image data is read for printing. Accordingly, the image printing circuit board 103 which constitutes the memory device for storing image data in this manner and a control circuit associated therewith is disposed in the electrical component chamber 80. A signal communication line connects between the image printing circuit board 103 and the central processing unit circuit board 90, a circuit of the image printing circuit board 103 is operated in response to an operation command from the central processing unit circuit board 90, and then the printing mechanism unit 15 prints the characters based on the image data on the outer surface of the pouch 36.
In this case, the signal communication line between the image printing circuit board 103 and the central processing unit circuit board 90 is also included in the wiring 95 from the electrical component chamber 80 through the flexible wiring cover 93 to the region of the solid preparation packaging mechanism unit 14. In this case, as with the aforementioned case, the solid preparation packaging apparatus 1 is provided with a lowered center of gravity and thus can be prevented from being toppled over. Moreover, the apparatus 1 allows the specific solid preparation to be handled with ease and the input unit PC to be placed and operated always with ease on the upper surface of the solid preparation packaging apparatus 1.
Furthermore, in order that the solid preparation packaging apparatus 1 which is operated with a voltage of 100 volt in Japan can also be used abroad or operated with a voltage higher than 100 volt (for example, at 120 volt), the power supply 92 is additionally provided with a transformer 104 as one component. For example, since the transformer 104 to be employed to step down 120 volt to 100 volt is generally 5 to 6 kg in weight, the transformer 104 can be placed at the center of the rear portion in the electrical component chamber 80 in order to balance the weight distribution. When the solid preparation accommodating unit 3, the transfer mechanism 10, and the solid preparation packaging mechanism 14 are configured to be capable of being pulled out or pushed back in the back-and-forth direction, the weight of the transformer 104 provides a great effect of preventing the possibility of the solid preparation packaging apparatus 1 being toppled over frontward.
Furthermore, as the number of tablet cases 6 in the solid preparation accommodating unit 3 increases, the solid preparation packaging apparatus 1 would tend to be more easily unbalanced, causing concerns to rise over the danger of being toppled over with the solid preparation accommodating unit 3 kept drawn out. Accordingly, when the apparatus 1 is used in Japan, a dedicated balance weight may be included. In this case, this balance weight leads to an increase in costs because the weight is specially made and requires mounting holes to be provided on the mounting flanges. In this context, attention is focused on the fact that the aforementioned transformer 104 for general-purpose use, which is comparatively inexpensive, can be employed at low costs as the balance weight. With a prediction that the apparatus 1 should be able to be used at a given higher voltage as described above, the aforementioned transformer 104 is incorporated into the solid preparation packaging apparatus 1 being produced. When the solid preparation packaging apparatus 1 is used in Japan, the wiring will detour around the transformer 104, which acts only as the balance weight, thereby providing, at low costs, the effect of preventing the apparatus 1 from being toppled over. On the other hand, in the case when the solid preparation packaging apparatus is used abroad where a transformer must be used, the solid preparation packaging apparatus 1 into which the transformer 104 is incorporated in advance has only to be exported.
Furthermore, as described above, the present invention is configured such that the top surface region of the main body 2 behind the specific solid preparation supply unit 7 serves as the planar placement area 2A for the input unit PC, and the flat-shaped lid 7B to cover the bucket portion 47 can be removably placed on the specific solid preparation supply unit 7. While a lid to cover the bucket portion 47 is formed to be openable backwardly by means of a hinge assembly, the specific solid preparation may be loaded into the bucket portion 47 with the lid open and at the same time, the information thereof may be checked or entered on the input unit PC placed on the planar placement area 2A. In this case, the opened lid serves as an obstacle, so that the input unit PC can be manipulated from the front of the solid preparation packaging apparatus 1 with difficulty. To avoid this situation, the input unit PC must be unpreferably placed on a desk or table near the solid preparation packaging apparatus 1. However, the present invention has solved such a problem because the input unit PC placed on the top surface region of the main body 2 can be manipulated with ease.
Various modifications may be made to the solid preparation packaging apparatus according to the present invention without departing from the technical scope of the present invention, and all such modifications may fall within the scope of the present invention. The solid preparation packaging apparatus is not limited to the structure illustrated in the aforementioned embodiment but may also encompass various modes within the scope of the solid preparation packaging apparatus which can provide the same effects as those described above.
Number | Date | Country | Kind |
---|---|---|---|
2011-195443 | Sep 2011 | JP | national |