This U.S. non-provisional patent application claims priority under 35 U.S.C. §119 of Korean Patent Application No. 10-2012-0134595, filed on Nov. 26, 2012, the entire contents of which are hereby incorporated by reference.
The inventive subject matter relates to solid state imaging devices and methods of operating the same and, more particularly, to solid state imaging devices using single slope analog-to-digital conversion and methods of operating the same.
Solid state imaging devices are widely used in applications such digital photography, scanners, machine vision systems, surveillance cameras, etc. Examples of image sensors include CCD (charge coupled device) image sensors and CMOS (complementary metal oxide semiconductor) image sensors.
Image sensors commonly use a “column parallel” architecture in which pixel sensors are arranged in a square array having rows and columns. Pixel sensors in respective columns are connected to respective column data line and are selected row by row to drive the column data lines.
Image signals generated on the column data lines are typically converted into digital signals by an analog-to-digital conversion (ADC) circuit connected to the column data lines. Various techniques, such as dual correlated double sampling (CDS) using a single slope analog-to-digital conversion technique, may be used to generate a digital value from an analog image signal.
When operating an image sensor, it is often important to establish a signal level corresponding to a “dark” or “black” level, that is, a signal level corresponding to a dark scene (or a black scene). Image signals generated by an image sensor may be controlled based on the dark level established to improve quality of the image. In the case of a pixel output obtained after long exposure time in a low light environment, it may be difficult to perform dark offset compensation.
Some embodiments of the inventive subject matter provide a solid state imaging device including a pixel array including a plurality of photoelectric conversion devices and an analog to digital conversion (ADC) circuit configured to convert an image signal received from the pixel array to a digital signal responsive to a ramp signal and a gain setting. The solid state imaging device further includes a ramp signal generator circuit configured to generate the ramp signal with a slope that varies responsive to a control signal and a dark level offset compensation circuit configured to generate the control signal responsive to the gain setting and a dark level measurement.
The pixel array may include at least one optical black pixel and wherein the dark level measurement is generated from an output of the at least one optical black pixel.
The ADC circuit may include a comparator configured to generate a comparison signal responsive to the image signal and the ramp signal and a counter configured to generate a count signal responsive to the comparison signal. A gain of the comparator may be controlled by the gain setting. The dark level offset compensation circuit may be configured to cause the ramp signal generator to decrease the slope of the ramp signal responsive to a gain setting that increases the gain of the comparator and to increase the slope of the ramp signal responsive to a gain setting that decreases the gain of the comparator is decreased.
Some embodiments provide an apparatus including an analog to digital conversion (ADC) circuit configured to convert an image signal received from a photoelectric conversion device to a digital signal responsive to a ramp signal and a gain setting, a ramp signal generator circuit configured to generate the ramp signal with a slope that varies responsive to a control signal and a control circuit configured to determine the gain setting based on a dark level measurement and a conversion time period of the ADC circuit and to generate the control signal based on the determined gain setting.
Further embodiments provides methods of operating a solid state imaging device including a pixel array including a plurality of photoelectric conversion devices, an analog to digital conversion (ADC) circuit configured to convert an image signal received from the pixel array to a digital signal responsive to a ramp signal and a gain setting and a ramp signal generator circuit configured to generate the ramp signal with a slope and offset that varies responsive to a control signal. The methods include determining a first value for the ramp signal based on a dark level offset, determining a second value for the ramp signal based on a maximum saturation level of the input to the ADC circuit, determining a conversion time period of the ADC circuit, determining a gain for the ADC circuit based on the first value, the second value and the conversion time period, generating the ramp signal with a slope based on the determined gain, and converting the image signal into a digital signal responsive to the ramp signal using the ADC circuit with the determined gain.
Embodiments of the inventive subject matter will be described below in more detail with reference to the accompanying drawings. The embodiments of the inventive subject matter may, however, be embodied in different forms and should not be constructed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive subject matter to those skilled in the art. Like numbers refer to like elements throughout.
Some embodiments of inventive subject matter will be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the invention are shown. This inventive subject matter may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive subject matter to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. Like numbers refer to like elements throughout.
A digital single lens reflex (DSLR) camera having an image sensor may have a bulb mode as one of its shooting modes. A bulb mode may be used to obtain an image which changes with time in low illumination and is often used when shooting a trace image of a star in the sky or a headlight of vehicle. In this case, a shutter of a camera is opened for a user-determined time and a long exposure time may be provided.
In the case of a pixel output of an image sensor obtained after long exposure time, it is desirable to remove a dark offset due to a dark current from the pixel output of the image sensor.
In a typical CMOS image sensor (CIS) that uses a dual CDS single slope ADC, a method of simply subtracting a dark offset from a photo signal has been used to compensate for dark offset. Since the maximum value of the photo signal may be as small as the dark offset, it may be insufficient to compensate the dark offset by only subtracting the dark offset from the obtained photo signal. Subtracting the dark offset from the photo signal may result in analog-to-digital (A/D) conversion of a value larger than the maximum value of the photo signal. The typical dark offset removal method may cause a burden or an overhead for a circuit constituting the image sensor.
Some embodiments of the inventive subject matter can reduce or minimize a burden of the circuit by operating the circuit in a full range of the photo signal considering the dark offset and gain. In some embodiments of the inventive subject matter, the maximum dynamic range may be automatically obtained depending on an operation of the circuit.
Referring to
The pixel array 110, as illustrated in
Referring to
The active pixel area 112 includes a plurality of active pixels 112a, which include photoelectric conversion devices that generate active signals corresponding to wavelengths of light. Each of the active pixels 112a may include a color filter to pass specific wavelengths of light. The color filter may be one of a red filter passing wavelengths of a red region among wavelengths of a visible light region, a green filter passing wavelengths of a green region among wavelengths of a visible light region and a blue filter passing wavelengths of a blue region among wavelengths of a visible light region. The color filter may be one of a cyan filter, a yellow filter and a magenta filter.
The optical black pixel area 114 includes a plurality of optical black pixels 114a, which also include photoelectric conversion devices. Each of the optical black pixels 114a blocks out incident light to generate an optical black signal representing a dark level. At least some of the optical black pixels 114a may include an optical sensing device, such as a photo diode, a pinned photo diode or a photo gate. Some of the optical black pixels 114a may not include the optical sensing device.
Referring back to
The row driver 120 connected to the timing generator 170 drives the pixel array 110 in units of rows. The row driver 120 can generate a row select signal for selecting any one row among a plurality of rows embodied in the pixel array 110.
Each of the plurality of active pixels in the active pixel area 112 senses incident light to output an active signal. Each of the plurality of active pixels in the active pixel area 112 can output an active reset signal.
Each of the plurality of optical black pixels in the optical black pixel area 114 can output an optical black reset signal and an optical black signal.
The current source circuit 130 may include an amplifying transistor and a source follower circuit. The current source circuit 130 is driven in response to a bias voltage to provide a constant current source.
The ramp signal generator 160 generates a ramp signal RS that is compensated for dark offset in response to a control signal CON. The ramp signal RS is applied to the CDS and ADC circuit 140 that performs A/D conversion.
The CDS and ADC circuit 140 receives an output of the pixel array 110 and performs CDS and ADC operations. A CDS circuit in the CDS and ADC circuit 140 can perform a dual correlated dual sampling on the received active reset signal and the received active signal. The CDS circuit can perform a dual correlated dual sampling on the received optical black reset signal and the received optical black signal.
An ADC circuit in the CDS and ADC circuit 140 converts a pixel signal corresponding to a charge accumulated in a photoelectric conversion device into a digital signal. The ADC circuit block compares correlated dual sampled signals being output from the current source circuit 130 with one another on the basis of a ramp signal generated from the ramp signal generator 160. The ADC circuit can output a clock signal responsive to the comparison.
A signal processor 200 includes a digital signal processor (DSP) and processes a digital output signal of the CDS and ADC circuit 140 on a horizontal output line (HOL) to generate a sensor output SOUT. The signal processor 200 generates the control signal CON based on the output signal of the CDS and ADC circuit 140 and applies the control signal CON to the ramp signal generator 160. The signal processor 200 is included in a dark offset compensation circuit compensating a dark offset using a dark offset and a gain setting value so that an input signal is processed only in a full range of an input signal level.
The embodiments shown in
Referring to
In
After the integration time period, if a gate voltage TG of the transfer transistor M11 increases, a charge accumulated in a photo diode region is transferred to the floating diffusion node FD. An electric potential of the floating diffusion node FD changes in proportion to the amount of transferred signal charges, and an electric potential of the source follower transistor M13 is changed.
When a gate voltage SEL of the select transistor M14 increases, the select transistor M14 is turned on. An electric potential of a source of the source follower transistor M13 is applied to a column line COL. The active pixels photoelectric-convert incident light to output a photo signal Vout and optical black pixels not receiving incident light output a reference signal Vref for a dark level compensation. The active pixels may have the same structure as the optical black pixels.
In
A detailed operation of
Referring to
The waveform of the ramp signal illustrated in the period D2 is generated for an ADC of the active pixel when a gain setting value of a comparator COM of
The waveforms of the ramp signal illustrated in the periods D2 and D3 are not generated below a level line L1 not to impose a burden on the circuit, that is, so that an input signal is processed only within a full range of an input signal level.
In some conventional systems, an offset is applied to a ramp signal to remove a dark offset. In this case, only a level of the dark offset is processed to be minus. Depending on a gain value, using a signal greater than ADC saturation, a single slope ADC may be performed. Thus, the circuit may bear a burden.
In the case of
In
In
In
Referring to
The waveform of the ramp signal illustrated in the period D20 is generated for an analog to digital conversion (ADC) of an active pixel when a gain setting value of the comparator COM1 of
Similarly, the waveforms of the ramp signal illustrated in the periods D10 and D20 are not generated below a level line L1 not to impose a burden on the circuit, that is, so that an input signal is processed only within a full range of an input signal level. In the case of
Since the gain setting value is automatically set by the signal processor 200, the dynamic range can be maximally obtained.
In
In
In the case of
Referring to
In
The ramp signal RS illustrated in the period D3 corresponds to the case that a gain setting value of the comparator COM1 of
The waveforms of the ramp signal illustrated in the periods D1 and D3 are not generated below a level line L1 indicating the maximum ADC saturation level of the input signal not to impose a burden on the circuit.
A comparator COM in an ADC block 142 receiving the ramp signal through its non-inverting terminal (+) and an output signal of a CDS block 141 through its inverting terminal performs a comparison operation according to a given gain. In a time period T2 of
In
An effect due to a dark offset may be relatively great on a bulb mode supported in a digital still camera or a digital single-lens reflex (DSLR) camera. The bulb mode opens a shutter for the time that a user wants to provide long exposure time and may be used to shoot a trace image of a star in the sky or a headlight of vehicle that changes with time in low illumination. In some embodiments of the inventive subject matter, by selectively increasing a ramp signal like
Referring to
Referring to
The CMOS image sensor 100 senses an object 2 shot through a lens 10 according to a control of the digital signal processor (DSP) 200. The DSP 200 can process image signals sensed by the image sensor 100 to output the image signals to the display unit 300.
The display unit 300 includes all devices that can output or display the image signals. The display unit 300 may mean a computer, a mobile communication device and an image output termination. The display unit 300 is a liquid crystal having a backlight, a liquid crystal having a LED light source or an OLED and may have a touch screen.
The DSP 200 includes a camera controller 210, an image signal processor (ISP) and an interface unit 230. The DSP 200 may further include a memory. According to a constitution of
Referring to
The lens 810 concentrates an incident light on a light receiving area of the image sensor 820. The image sensor 820 can generate RGB data of a Bayer pattern on the basis of light which entered through the lens 810. The image sensor 820 can provide RGB data on the basis of a clock signal CLK.
The image sensor 820 can interface with the engine unit 840 through a mobile industry processor interface (MIPI) or a camera serial interface (CSI). The motor unit 830 may control a focus of the lens 810 or perform a shuttering in response to a control signal CTRL received from the engine unit 840. The engine unit 840 controls the image sensor 820 and the motor unit 830. On the basis of RGB data received from the image sensor 820, the engine unit 840 may generate UUV data including a luminance component, a difference between the luminance component and a blue component and a difference between the luminance component and a red component or may generate compressed data, for example, joint photography experts group (JPEG).
The engine unit 840 may be connected to a host/application 850 and may provide the YUV data or the JPEG data to the host/application 850 on the basis of a master clock MCLK. The engine unit 840 may interface with the host/application 850 through a serial peripheral interface (SPI) or an inter integrated circuit (I2C).
According to the camera constitution of
Referring to
The image sensor 1060 includes an image sensor performing an offset compensation function in accordance with some embodiments of the inventive subject matter. Although not illustrated in
The processor 1010 can perform specific calculations or specific tasks. According to the embodiments, the processor 1010 may be a micro-processor or a central processing unit (CPU).
The processor 1010 can communicate with the memory device 1020, the storage device 1030 and the input/output device 1040 through an address bus, a control bus and a data bus.
The processor 1010 may be connected to an extension bus such as a peripheral component interconnection (PCI) bus.
The memory device 1020 can store data necessary for an operation of the computing system 1000. The memory device 1020 may includes a DRAM, a mobile DRAM, a SRAM or a nonvolatile memory device.
The nonvolatile memory may be embodied by an electrically erasable programmable read-only memory (EEPROM), a flash memory, a magnetic random access memory (MRAM), a spin-transfer torque MRAM, a conductive bridging RAM (CBRAM), a ferroelectric RAM (FeRAM), a phase change RAM (PRAM) which is called an ovonic unified memory (OUM), a resistive RAM (RRAM), a nanotube RRAM, a polymer RAM (PoRAM), a nanotube floating gate memory (NFGM), a holographic memory, a molecular electronics memory device, or an insulator resistance change memory.
Chips of the memories may be mounted using various types of packages such as PoP (package on package), ball grid array (BGA), chip scale package (CSP), plastic leaded chip carrier (PLCC), plastic dual in-line package (PDIP), die in waffle pack, die in wafer form, chip on board (COB), ceramic dual in-line package (CERDIP), plastic metric quad flat pack (MQFP), thin quad flat pack (TQFP), small outline (SOIC), shrink small outline package (SSOP), thin small outline (TSOP), thin quad flatpack (TQFP), system in package (SIP), multi chip package (MCP), wafer-level fabricated package (WFP) and wafer-level processed stack package (WSP).
The storage device 1030 may include a solid state drive (SSD), a hard disk drive (HDD), a CD-ROM, etc.
The input/output device 1040 may include an input means such as a keyboard, a keypad, a mouse, etc. and an output unit such as a printer and a display. The power supply 1050 can supply an operation voltage necessary for an operation of the computing system 1000.
The image sensor 1060 is connected to the processor 1010 through buses or other communication links to communicate with the processor 1010. As described above, the image sensor 1060 can generate image data having high image quality in an exposure environment of low illumination and long time by compensating a dark level compensation using a dark offset and gain setting information. The image sensor 1060 can be integrated in one chip together with the processor 1010 or the image sensor 1060 and the processor 1010 can be integrated in different chips respectively.
The computing system 1000 may any of a number of different types of computing systems that use an image sensor. The computing system 1000 may include a digital camera, a mobile phone, a personal digital assistant (PDA), a portable multimedia player (PMP), a smart phone, a tablet PC, etc.
Referring to
A CSI host 1112 of the application processor 1110 can perform a serial communication with a CSI device 1141 of the image sensor 1140 through a camera serial interface (CSI).
The CSI host 1112 may include a deserializer (DES) and the CSI device 1141 may include a serializer (SER). A DSI host 1111 of the application processor 1110 can perform a serial communication with a DSI device 1151 through a display serial interface (DSI).
The DSI host 1111 may include a serializer SER and the DSI DEVICE 1151 may include a deserializer. Further, the cellular phone 1100 may further include a radio frequency (RF) chip 1160 that can perform a communication with the application processor 1110. A PHY 1113 of the cellular phone 1100 and a PHY 1161 of the RF chip 1160 can perform a data transmit/receive according to a mobile industry processor interface (MIPI) DigRF.
The application processor 1110 may further include a DigRF MASTER 1114 controlling a data transmit/receive according to the MIPI DigRF of PHY 1161. The cellular phone 1100 may include a global positioning system (GPS) 1120, a storage 1170, a mike 1180, a dynamic random access memory (DRAM) 1185 and a speaker 1190.
The cellular phone 1100 can perform a communication using an ultra wideband (UWB) 1210, a wireless local area network (WLAN) 1220 and a worldwide interoperability for microwave access (WIMAX) 1230. A structure and an interface of the cellular phone 1100 is only an illustration and the inventive subject matter is not limited thereto.
Since the image sensor 1140 has a function compensating a dark offset using a dark offset and a gain setting value according to some embodiments of the inventive subject matter so that an input signal is processed only within a full range of an input signal level, a burden of circuit constitution in the cellular phone system is minimized or reduced. A dynamic range of a circuit operation may be maximized or increased.
The above-disclosed subject matter is to be considered illustrative, and not restrictive, and the appended claims are intended to cover all such modifications, enhancements, and other embodiments, which fall within the true spirit and scope of the inventive subject matter. Thus, to the maximum extent allowed by law, the scope of the inventive subject matter is to be determined by the broadest permissible interpretation of the following claims and their equivalents, and shall not be restricted or limited by the foregoing detailed description.
Number | Date | Country | Kind |
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10-2012-0134595 | Nov 2012 | KR | national |