The present disclosure is related to soluble water scavenger molecules, and more particularly to soluble water scavenger molecules for use with dielectric fluids.
Systems and methods for removing water molecules from a dielectric fluid may involve external apparatuses for treating the dielectric fluids. However, the use of external apparatuses may be inconvenient for a user, particularly in circumstances where a dielectric fluid needs to be periodically treated to remove water molecules. An in-situ solution for removing water molecules from a dielectric fluid may thus be critical to ensure convenient periodic treatment of dielectric fluids to remove water molecules.
The detailed description is set forth with reference to the accompanying drawings. The drawings are provided for purposes of illustration only and merely depict exemplary embodiments of the disclosure. The drawings are provided to facilitate understanding of the disclosure and shall not be deemed to limit the breadth, scope, or applicability of the disclosure. In the drawings, the left-most digit(s) of a reference numeral may identify the drawing in which the reference numeral first appears. The use of the same reference numerals indicates similar, but not necessarily the same or identical components. However, different reference numerals may be used to identify similar components as well. Various embodiments may utilize elements or components other than those illustrated in the drawings, and some elements and/or components may not be present in various embodiments. The use of singular terminology to describe a component or element may, depending on the context, encompass a plural number of such components or elements and vice versa.
This disclosure relates to, among other things, soluble water scavenger molecules for use with dielectric liquids. In one or more embodiments, a dielectric fluid-based composition for reducing water content in a dielectric fluid may include a water-scavenging agent disposed within a dielectric fluid. In some embodiments, the water-scavenging agent may be soluble in the dielectric fluid. In some embodiments, the water-scavenging agent may be configured to react with water molecules in the dielectric fluid.
In one or more embodiments, the dielectric fluid-based composition described herein may improve upon current methods for reducing water content in a dielectric fluid by using soluble water-scavenging molecules. By adding soluble water-scavenging molecules to a dielectric fluid, the water content in the dielectric fluid may be reduced without the use of external apparatuses. This may mitigate the need for external apparatuses and may be more convenient for periodic treatment of a dielectric fluid over time. This technical solution thus allows for an in-situ solution for reducing water content in a dielectric fluid.
In one or more embodiments, the dielectric fluid-based composition may include a water-scavenging agent that is an organic substance. In one or more embodiments, the water-scavenging agent may be one of an enamine, an orthoester, an alkoxysilane, or an oxazolidine. In one or more embodiments, the enamine may be one of 1-morpholinocyclohexene, 1-morpholinocyclopentene, 1-piperidinocyclohexene, 1-pyrrolidino-1-cyclohexene, or 1-pyrrolidino-1-cyclopentene. In one or more embodiments, the water-scavenging agent may have a flash point of at least about 68 degrees Fahrenheit (about 20 degrees Celsius).
In one or more embodiments, the dielectric fluid may be an oil. In one or more embodiments, the oil may be one of an n-alkane-based paraffinic mineral oil, a cycloalkane-based naphthenic mineral oil, an aromatic-based mineral oil, a natural ester-based oil, a synthetic ester-based oil, or a silicone-based oil. In one or more embodiments, the dielectric fluid may further include at least one additive for anti-oxidation or acid-scavenging.
In one or more embodiments, the water-scavenging agent may be further configured to react with water molecules in at least one solid insulation material that is in operational contact with the dielectric fluid.
In one or more embodiments, a system disclosed herein may include electrical equipment immersed in oil. The electrical equipment may include a dielectric fluid, at least one solid insulation in operational contact with the dielectric fluid, and a water-scavenging agent disposed within the dielectric fluid. In some embodiments, the water-scavenging agent may be soluble in the dielectric fluid. In some embodiments, the water-scavenging agent may be configured to react with water molecules in at least a portion of the at least one solid insulation and the dielectric fluid.
In one or more embodiments, the electrical equipment may be a power transformer. In one or more embodiments, the at least one solid insulation may include cellulose paper.
In one or more embodiments, a method for reducing water content in a dielectric fluid may be disclosed herein. In one or more embodiments, the method may include adding a first predetermined volume of a water-scavenging agent into a second predetermined volume of a dielectric fluid. In one or more embodiments, the method may further include dissolving the first predetermined volume of the water-scavenging agent in the second predetermined volume of the dielectric fluid to form a concentrate. In one or more embodiments, the method may further include diluting the concentrate with a third predetermined volume of the dielectric fluid until a predetermined concentration of the water-scavenging agent is reached, wherein the third predetermined volume of the dielectric fluid is disposed within an electrical equipment. In other embodiments, the method may include adding a predetermined volume of the water-scavenging agent directly to a volume of the dielectric fluid which was previously added to the electrical equipment. In one or more embodiments, the method may further include causing at least one reaction between the water-scavenging agent and at least one water molecule disposed within the dielectric fluid, wherein the at least one reaction results in the at least one water molecule and the water-scavenging agent being irreversibly transformed into at least one byproduct.
In one or more embodiments, the method may further include causing at least one reaction between the water-scavenging agent and at least one water molecule in at least one solid insulation that is in operational contact with the dielectric fluid.
In one or more embodiments, an electrical equipment 102 may include dielectric fluid 104 and at least one solid insulation 106. Over time, water molecules may accumulate in the dielectric fluid 104. The water molecules may accumulate in the dielectric fluid 104 based at least in part due to water molecules from the at least one solid insulation 106 and water molecules from the atmosphere entering the dielectric fluid 104.
In one or more embodiments, the dielectric fluid 104 may be channeled into an external apparatus 108 in order to treat the dielectric fluid 104 to remove water molecules. In some embodiments, the dielectric fluid 104 may be channeled away from the electrical equipment 102 through a first tube 110. The dielectric fluid 104 may be passed through a chamber 112 having a solid water sorbent. The water molecules in the dielectric fluid 104 may then be removed when the dielectric fluid 104 is passed through the solid water sorbent, and the treated dielectric fluid 104 may then be channeled back into the electrical equipment 102 via a second tube 114. In some embodiments, the solid water sorbent may be, for example, a zeolite.
In one or more embodiments, the water treatment system 100 may require external apparatuses in order to remove water molecules from the dielectric fluid 104.
In one or more embodiments, a water treatment system 200 may include a vacuum and heating technique. In one or more embodiments, the existing water treatment system 200 may include an external apparatus. For example, the water treatment system 200 may involve a low-frequency heating converter 202 that is connected to a high voltage side of a transformer 204. The low voltage side of the transformer 204 may be short circuited. The transformer 204 may include spray nozzles 206 that are connected to an oil treatment plant 208. The transformer 204 may be further connected to a vacuum control valve 210 that is connected to at least one vacuum pump 212.
In one or more embodiments, the water treatment system 200 may require external apparatuses and the application of additional heat in order to remove water molecules from a dielectric fluid.
In one or more embodiments, the electrical equipment 300 may be immersed in oil (or another dielectric fluid) 302 during service. This may result in the existence of water in the oil (or another dielectric fluid) 302 due to water ingress from environments to which the oil (or another dielectric fluid) is exposed, diffusion, or extraction of water from any solid insulation into the oil (or another dielectric fluid), or from thermal degradation of any solid insulation present in the oil (or another dielectric fluid) 302, or any combination thereof. The existence of water in the oil (or another dielectric fluid) 302 may then result in a reduction in breakdown voltage of the oil (or another dielectric fluid) 302. Thus, in one or more embodiments, in-situ drying of the oil (or another dielectric fluid) 302 may be performed in order to reduce the quantity of water in the oil (or another dielectric fluid) 302.
In one or more embodiments, soluble water scavenger molecules 304 may be added to the oil (or another dielectric fluid) 302 in order to perform drying. Soluble water scavenger molecules 304 may improve the reduction in breakdown voltage of the oil (or another dielectric fluid) 302 by reducing the quantity of water in the oil (or another dielectric fluid) 302, reduce the rate of degradation of the solid insulation by reducing the rate of hydrolysis, and, in some embodiments, reducing the acidity of the oil (or another dielectric fluid) 302 and the solid insulation, thus additionally stabilizing the electrical equipment. In some embodiments, the quantity of water may be correlated to the quantity of soluble water scavenger molecules 304 that have been added. In some embodiments, the quantity of water may be reduced by at least about 50%. In some embodiments, the quantity of water may be reduced by at least about 70%. In some embodiments, the quantity of water after the addition of the soluble water scavenger molecules 304 may be reduced to under about 200 ppm, and preferably under about 100 ppm for ester oils and under about 10 ppm for mineral oils. In some embodiments, the breakdown voltage may be improved by the addition of the soluble water scavenger molecules 304, such that the breakdown voltage may be approximate to the breakdown voltage of dried oil (or another dried dielectric fluid). Additionally, the use of the soluble water scavenger molecules 304 may remove the moisture in the solid insulation that is in contact with the oil (or another dielectric fluid) 302. Furthermore, the use of the soluble water scavenger molecules 304 may remove the need for using additional equipment to dry an electric insulation system.
In one or more embodiments, the soluble water scavenger molecules 304 may each be comprised of two or more atoms held together by chemical bonds. The soluble water scavenger molecules 304 may have a neutral charge. In some embodiments, the soluble water scavenger molecules 304 may be a chemical without any repeat units. In other embodiments, the soluble water scavenger molecules 304 may be a chemical with two repeat units, which may be known as a dimer. In other embodiments, the soluble water scavenger molecules 304 may be a chemical with more than two repeat units, which may be known as a macromolecule.
As depicted in
In one or more embodiments, the electrical equipment 300 may further include at least one solid insulation 306 in operational contact with the oil (or another dielectric fluid) 302. In some embodiments, the at least one solid insulation 306 may comprise a cellulose paper. In some embodiments, the soluble water scavenger molecules 304 may also react with water molecules in the at least one solid insulation 306 in order to reduce the quantity of water molecules present in the at least one solid insulation 306.
In one or more embodiments, a concentrate may be first formed by dissolving the soluble water scavenger molecules 304 in a first amount of the oil (or another dielectric fluid) 302. This concentrate may then be subsequently diluted with another amount of the oil (or another dielectric fluid) 302 in order to reach a desired concentration of the soluble water scavenger molecules 304. The process of dilution may occur when the concentrate is added to the oil (or another dielectric fluid) 302 that the electrical equipment 300 is immersed in. In some embodiments, the soluble water scavenger molecules 304 may be added with heat. In other embodiments, a predetermined amount of the soluble water scavenger molecules 304 may be added directly to the oil (or another dielectric fluid) 302 that already has the electrical equipment 300 immersed in it. These particular embodiments may be particularly suited for soluble water scavenger molecules 304 that are miscible in the oil (or another dielectric fluid) 302. When the soluble water scavenger molecules 304 react with water molecules in the oil (or another dielectric fluid) 302, for example, in reaction 308 as depicted in
In one or more embodiments, the soluble water scavenger molecules 304 may be added at regular or irregular time intervals in order to reduce the existence of water in the oil (or another dielectric fluid).
In one or more embodiments, the electrical equipment 300 may be a high voltage application such as a power transformer, a capacitor, an electric machine, power electronics, high voltage cables, a switchgear, or other suitable electrical equipment.
In one or more embodiments, the oil (or another dielectric fluid) 302 may be an electrically non-conductive liquid that has a relatively high resistance to electrical breakdown when subjected to a high voltage over a wide service temperature range. In some embodiments, the service temperature may range from about −40 degrees Fahrenheit to about 356 degrees Fahrenheit. In other embodiments, the service temperature range may range from about −4 degrees Fahrenheit to about 302 degrees Fahrenheit. In some embodiments, examples of oils 302 include an n-alkane-based paraffinic mineral oil, a cycloalkane-based naphthenic mineral oil, an aromatic-based mineral oil, a natural ester-based oil, a synthetic ester-based oil, or a silicone-based oil. In some embodiments, the oil (or another dielectric fluid) 302 may further include at least one additive for anti-oxidation (or oxygen-scavenging) or acid-scavenging (or acid-intercepting) purposes.
In one or more embodiments, the soluble water scavenger molecules 400 that may be used to reduce the quantity of water in an oil (or another dielectric fluid) may include enamines, orthoesters, alkoxysilanes, oxazolidines, structures that comprise these chemical units, or mixtures thereof. In some embodiments, a variety of soluble water scavenger organic enamine molecules may be used to reduce the quantity of water in an oil or another dielectric fluid, for example, the oil or another dielectric fluid in electrical equipment 300, as depicted in
In one or more embodiments, the soluble water scavenger molecules 400 may be configured to react with water irreversibly at room temperature and temperatures higher than room temperature. In some embodiments, the chemical reaction involving the soluble water scavenger molecules 400 may have an equilibrium constant of greater than about 10. In one embodiment, the soluble water scavenger molecules 400 may be involved in a hydrolysis reaction such that water molecules are consumed as a reactant. Such an irreversible hydrolysis reaction may result in two smaller molecules being formed.
In one or more embodiments, the dielectric fluid and the soluble water scavenger molecules 400 may form a dielectric fluid composition. The soluble water scavenger molecules 400 may be soluble in the dielectric fluid, and the soluble water scavenger molecules 400 may be configured to react with water molecules in the dielectric fluid. In one or more embodiments, the concentration of soluble water scavenger molecules 400 may vary based on the dielectric fluid present. The concentration of soluble water scavenger molecules 400 may be configured to prevent a reduction in breakdown voltage, thermal conductivity, or flash point of the dielectric fluid composition by more than approximately about 10% at room temperature when compared to the dielectric fluid that does not comprise the soluble water scavenger molecules 304 but is otherwise exposed to the same conditions. The concentration of soluble water scavenger molecules 400 may be further configured to prevent the pour point from increasing beyond a predetermined minimum temperature. For example, if the dielectric fluid is a mineral oil, the pour point may be configured to not exceed −40 degrees Fahrenheit (−40 degrees Celsius). As another example, if the dielectric fluid is a natural ester oil, the pour point may be configured to not exceed about −4 degrees Fahrenheit (−20 degrees Celsius). In some embodiments, if the dielectric fluid is a mineral oil, the concentration of soluble water scavenger molecules 400 may be configured to be approximately 0.5% by weight. In other embodiments, if the dielectric fluid is a mineral oil, the concentration of soluble water scavenger molecules 400 may be configured to be approximately 0.25% by weight. In some embodiments, if the dielectric fluid is a natural ester oil, the concentration of soluble water scavenger molecules 400 may be up to approximately 5% by weight. In other embodiments, if the dielectric fluid is a natural ester oil, the concentration of soluble water scavenger molecules 400 may be approximately 2% by weight. In some embodiments, the concentration of soluble water scavenger molecules 400 may be approximately 2.5 molar equivalents as compared to the concentration of water present in the dielectric fluid. In other embodiments, the concentration of soluble water scavenger molecules 400 may be approximately 10 molar equivalents as compared to the concentration of water present in the dielectric fluid.
The method 500 may further include causing at least one reaction between the water-scavenging agent and at least one water molecule in at least one solid insulation in operational contact with the dielectric fluid.
In one or more embodiments, the dielectric fluid and the water-scavenging agent may form a dielectric fluid-based composition. The water-scavenging agent may be soluble in the dielectric fluid, and the water-scavenging agent may be configured to react with water molecules in the dielectric fluid.
In one or more embodiments, the water-scavenging agent may be an organic substance. The water-scavenging agent may be an enamine, an orthoester, an alkoxysilane, or an oxazolidine. If the water-scavenging agent is an enamine, the enamine may preferably be 1-morpholinocyclohexene, 1-morpholinocyclopentene, 1-piperidinocyclohexene, 1-pyrrolidino-1-cyclohexene, or 1-pyrrolidino-1-cyclopentene.
In one or more embodiments, the water-scavenging agent may have a flash point of at least 68 degrees Fahrenheit.
In one or more embodiments, the dielectric fluid may be an oil. The oil may be an n-alkane-based paraffinic mineral oil, a cycloalkane-based naphthenic mineral oil, an aromatic-based mineral oil, a natural ester-based oil, a synthetic ester-based oil, or a silicone-based oil.
In one or more embodiments, the dielectric fluid-based composition may further include at least one additive for anti-oxidation or acid-scavenging.
In one or more embodiments, the dielectric fluid, at least one solid insulation in operational contact with the dielectric fluid, and a water-scavenging agent disposed within the dielectric fluid may be disposed within an electrical equipment that is immersed in oil. The electrical equipment may be a power transformer. The at least one solid insulation may be cellulose paper.
The operations described and depicted in the illustrative process flow of
One or more operations of the process flow of
Although specific embodiments of the disclosure have been described, one of ordinary skill in the art will recognize that numerous other modifications and alternative embodiments are within the scope of the disclosure. For example, any of the functionality and/or processing capabilities described with respect to a particular device or component may be performed by any other device or component. Further, while various illustrative implementations and architectures have been described in accordance with embodiments of the disclosure, one of ordinary skill in the art will appreciate that numerous other modifications to the illustrative implementations and architectures described herein are also within the scope of this disclosure.
Certain aspects of the disclosure are described above with reference to block and flow diagrams of systems, methods, apparatuses, and/or computer program products according to example embodiments. It will be understood that one or more blocks of the block diagrams and flow diagrams, and combinations of blocks in the block diagrams and the flow diagrams, respectively, may be implemented by execution of computer-executable program instructions. Likewise, some blocks of the block diagrams and flow diagrams may not necessarily need to be performed in the order presented, or may not necessarily need to be performed at all, according to some embodiments. Further, additional components and/or operations beyond those depicted in blocks of the block and/or flow diagrams may be present in certain embodiments.
Accordingly, blocks of the block diagrams and flow diagrams support combinations of means for performing the specified functions, combinations of elements or steps for performing the specified functions, and program instruction means for performing the specified functions. It will also be understood that each block of the block diagrams and flow diagrams, and combinations of blocks in the block diagrams and flow diagrams, may be implemented by special-purpose, hardware-based computer systems that perform the specified functions, elements or steps, or combinations of special-purpose hardware and computer instructions.
The operations and processes described and shown above may be carried out or performed in any suitable order as desired in various implementations. Additionally, in certain implementations, at least a portion of the operations may be carried out in parallel. Furthermore, in certain implementations, less than or more than the operations described may be performed.
The word “exemplary” is used herein to mean “serving as an example, instance, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.
As used herein, unless otherwise specified, the use of the ordinal adjectives “first,” “second,” “third,” etc., to describe a common object, merely indicates that different instances of like objects are being referred to and are not intended to imply that the objects so described must be in a given sequence, either temporally, spatially, in ranking, or in any other manner.
It is understood that the above descriptions are for purposes of illustration and are not meant to be limiting.
Although specific embodiments of the disclosure have been described, numerous other modifications and embodiments are within the scope of the disclosure. For example, any of the functionality described with respect to a particular device or component may be performed by another device or component. Further, while specific device characteristics have been described, embodiments of the disclosure may relate to numerous other device characteristics. Further, although embodiments have been described in language specific to structural features and/or methodological acts, it is to be understood that the disclosure is not necessarily limited to the specific features or acts described. Rather, the specific features and acts are disclosed as illustrative forms of implementing the embodiments. Conditional language, such as, among others, “can,” “could,” “might,” or “may,” unless specifically stated otherwise, or otherwise understood within the context as used, is generally intended to convey that certain embodiments could include, while other embodiments may not include, certain features, elements, and/or operations. Thus, such conditional language is not generally intended to imply that features, elements, and/or operations are in any way required for one or more embodiments.
This invention was made with U.S. government support under DE-AR0001391 awarded by the U.S. Department of Energy. The U.S. government may have certain rights in the invention.