Claims
- 1. A solventless liquid nitrile compound comprising:
a liquid nitrile rubber; and a curing agent selected from the group consisting of sulfur, sulfur donors, and mixtures thereof, where the curing agent is present in an amount of at least about 3% by weight of the compound; the compound containing substantially no solvent.
- 2. A compound according to claim 1 wherein the curing agent is present in an amount between about 3% and about 10% by weight of the compound.
- 3. A compound according to claim 1 wherein the liquid nitrile rubber is present in an amount of at least about 40% by weight of the compound.
- 4. A compound according to claim 1 additionally comprising a solid nitrile rubber having a Mooney value of not more than about 75, wherein the solid nitrile rubber is present in an amount of not more than about 49% by weight of the total rubber.
- 5. A compound according to claim 1 which is readily flowable between about 23° C. and about 150° C.
- 6. A compound according to claim 1 which can be curable at room or elevated temperature.
- 7. A compound according to claim 1 which is used as a curing material for a sealing member.
- 8. A compound according to claim 1 which is used as a curing material for a gasket selected from the group consisting of cure in place gasketing (CIPG), inject in place gasketing (IJPG), and form in place gasketing (FIPG).
- 9. A compound according to claim 1 which is used as a molding material selected from the group consisting of liquid injection molding (LIM), transfer molding (TM), and injection molding.
- 10. A solventless liquid nitrile compound comprising:
a liquid nitrile rubber; and a nonsulfur curing agent present in an amount of at least about 5% by weight of the compound; the compound containing substantially no solvent.
- 11. A compound according to claim 10 wherein the curing agent is present in an amount between about 5% and about 12% by weight of the compound.
- 12. A compound according to claim 10 wherein the curing agent is a peroxide.
- 13. A compound according to claim 10 wherein the liquid nitrile rubber is present in an amount of at least about 40% by weight of the compound.
- 14. A compound according to claim 10 additionally comprising a solid nitrile rubber having a Mooney value of not more than about 75, wherein the solid nitrile rubber is present in an amount of not more than about 49% by weight of the total rubber.
- 15. A compound according to claim 10 which is readily flowable between about 23° C. and about 150° C.
- 16. A compound according to claim 10 which can be curable at room or elevated temperature.
- 17. A compound according to claim 10 which is used as a curing material for a sealing member.
- 18. A compound according to claim 10 which is used as a curing material for a gasket selected from the group consisting of cure in place gasketing (CIPG), inject in place gasketing (IJPG), and form in place gasketing (FIPG).
- 19. A compound according to claim 10 which is used as a molding material selected from the group consisting of liquid injection molding (LIM), transfer molding (TM), and injection molding.
- 20. A solventless liquid nitrile compound comprising:
a liquid nitrile rubber present in an amount of at least about 40% by weight of the compound; and a peroxide curing agent present in an amount of at least about 5% by weight of the compound; the compound containing substantially no solvent; and the compound being readily flowable between about 23° C. and about 150° C.
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefit of U.S. provisional application serial No. 60/342,235, filed Dec. 21, 2001.
Provisional Applications (1)
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Number |
Date |
Country |
|
60342235 |
Dec 2001 |
US |