Claims
- 1. A liquid nitnie composition comprising:(a) at least 40 weight percent liquid nitrile rubber; and (b) at least 5 weight percent nonsulfur curing agent; wherein the composition contains at most 2% weight percent solvent.
- 2. A composition according to claim 1 wherein the curing agent is from 5% to 12% by weight of the composition.
- 3. A composition according to claim 1 wherein the curing agent is a peroxide.
- 4. A composition according to claim 1 wherein the liquid nitrile rubber is from 60% to 90% by weight of the composition.
- 5. A composition according to claim 1 additionally comprising:(c) solid nitrile rubber having a Mooney value of at most 75, said solid nitrile rubber providing at most 49 weight percent of said liquid nitrile rubber and said solid nitrile rubber as a combined total weight of rubber in said composition.
- 6. A composition according to claim 1 which is readily flowable from 23° C. to 150° C.
- 7. A composition according to claim 1 which is curable at a temperature of greater than 21 degrees C.
- 8. A composition according to claim 1 having a viscosity sufficient for application to a machine component to provide cure-in-place material for a sealing member of said component.
- 9. A composition according to claim 1 suitable for use in a gasket selected from the group of gaskets consisting of a cure-in-place gasket (CIPG), an inject-in-place gasket (IJPG), and a form-in-place gasket (FIPG).
- 10. A composition according to claim 1 suitable for use as a molding material for a molding process selected from the group of molding processes consisting of an liquid injection molding (LIM) process, a transfer molding (TM) process, and an injection molding process.
- 11. A liquid nitrile composition comprising:(a) at least 40 weight percent liquid nitrile rubber; and (b) at least 5 weight percent peroxide curing agent; wherein the composition contains at most 2% weight percent solvent; and wherein the composition is readily flowable from 23° C to 150° C.
CROSS-REFERENCE TO RELATED APPLICATION
This application claims the benefit of U.S. provisional application Ser. No. 60/342,235, filed Dec. 21, 2001.
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Provisional Applications (1)
|
Number |
Date |
Country |
|
60/342235 |
Dec 2001 |
US |