Claims
- 1. A process for producing a solventless organopolysiloxane resin that is liquid at room temperature, the process including the steps of:
- hydrolyzing, in an aqueous system, by heating a hydrolyzable organo silicon composition comprising at least one compound having the general formula:
- Y.sub.(4-n) Si(OR).sub.n
- where Y is phenyl or methyl, R is an alkyl group having from one to three carbon atoms, and n is an integer from one to four, wherein the ratio of OR groups to silicon atoms in the composition is from about 2.3:1 to 3.1:1, the molar ratio of water/silane being about 1.5:1 to 2.25:1, and the amount of acid present expressed as HCl being about 2.3 to 1192 parts of HCl per million parts of silane and water to form a siloxane partial condensation product,
- concentrating the partial condensation product by heating to cause substantial siloxane formation by condensation and to distill therefrom water and alcohol by-products,
- precuring the concentrated partial condensation product by heating the product to remove volatile material at a temperature equivalent to that of about 140.degree. C. to 160.degree. C. for about 2 hours, and
- cooling the precured product to room temperature to provide a solventless organopolysiloxane that has a viscosity at 25.degree. C. measured by a Brookfield LVT viscometer using a #3 spindle at 60 rpm of at least about 25 cps. but not greater than 10,000 cps, the solventless organopolysiloxane having a water content by weight of less than about 1 percent.
- 2. A process as claimed in claim 1, wherein a coating of the solventless organopolysiloxane resin is applied to a substrate and cured.
- 3. A process as claimed in claim 1, wherein from 2 percent to 25 percent of a particulate filler selected from the group consisting of carbon black, bentonite, clays, fused silica, graphite, metal oxide pigments, carbon, roofing stone and phosphatized carbon is mixed with the solventless organopolysiloxane, and a coating of the resulting mixture is applied to a substrate and cured.
- 4. A process as defined in claim 1 wherein the starting organo silicon compound is methyltriethoxy silane.
- 5. A process as claimed in claim 1 wherein there is an additional step during the precuring stage comprising determining the viscosity of the organopolysiloxane thereby to check the water content thereof, and, if the viscosity is not in said range of about 25 cps to 1200 cps, further precuring the organopolysiloxane until it is in said viscosity range to provide the solventless organopolysiloxane that is liquid at room temperature.
- 6. A process as claimed in claim 1 wherein the starting organo silicon compounds are methyltriethoxy silane, phenyl triethoxy silane and dimethyl diethoxysilane.
- 7. A process as claimed in claim 1 wherein Y is phenyl and methyl and R is ethyl.
- 8. A product made according to the process defined in claim 1 wherein the solventless organopolysiloxane produced is liquid at room temperature.
- 9. A solventless organopolysiloxane resin which is the product of the partial hydrolysis and condensation of a hydrolyzable organo silicon composition comprising at least one compound having the general formula
- Y.sub.(4-n) Si(OR).sub.n
- where Y is phenyl or a primary or secondary alkyl group having from one to four carbon atoms, R is an alkyl group having from one to three carbon atoms, and n is an integer from one to four, and wherein the ratio of OR groups to silicon atoms in the composition is from 2.3:1 to 3.1:1, the molar ratio of water/silane for hydrolysis being about 1.5:1 to about 2.25:1, the amount of acid present during hydrolysis expressed as HCl being from about 2.3 parts to 1192 parts per million parts of water and silane, the hydrolysis product being concentrated to remove water and alcohol by-products and precured at a temperature and time equivalent to that of a precure temperature of about 140.degree. C. to 160.degree. C. for about 2 hours, said solventless organopolysiloxane resin being liquid at room temperature and having a water content less than 1 percent and a viscosity measured by a Brookfield LVT Viscometer using a #3 spindle at 25.degree. C. at least 25 cps but not greater than 10,000 cps.
REFERENCE TO RELATED APPLICATION
This is a continuation of application Ser. No. 384,465 filed June 3, 1982, now abandoned, which application is a continuation in part of application Ser. No. 306,577 filed Sep. 29, 1981, for "Solventless Resin", now abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
3389114 |
Burzynski et al. |
Jun 1968 |
|
4271212 |
Stengle |
Jun 1981 |
|
Continuations (1)
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Number |
Date |
Country |
Parent |
384465 |
Jun 1982 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
306577 |
Sep 1981 |
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