The disclosed embodiments relate generally to spacers and insulated glass units containing them, and more particularly to insulated glass units including optically switchable devices.
Various optically switchable devices are available for controlling tinting, reflectivity, etc., of window panes or lites. Electrochromic devices are one example of optically switchable devices. Electrochromism is a phenomenon in which a material exhibits a reversible electrochemically-mediated change in an optical property when placed in a different electronic state, typically by being subjected to a voltage change. The optical property being manipulated is typically one or more of color, transmittance, absorbance, and reflectance. One well known electrochromic material is tungsten oxide (WO3). Tungsten oxide is a cathodic electrochromic material in which a coloration transition, transparent to blue, occurs by electrochemical reduction.
Electrochromic materials may be incorporated into, for example, windows for home, commercial, and other uses. The color, transmittance, absorbance, and/or reflectance of such windows may be changed by inducing a change in the electrochromic material; i.e., electrochromic windows are windows that can be darkened or lightened electronically. A small voltage applied to an electrochromic device of the window will cause it to darken; reversing the voltage causes it to lighten. This capability allows for control of the amount of light that passes through the window, and presents an enormous opportunity for electrochromic windows to be used not only for aesthetic purposes but also for significant energy-savings. With energy conservation being foremost in modern energy policy, it is expected that growth of the electrochromic window industry will be robust in the coming years.
Spacers for insulated glass units (IGUs) incorporating electrochromic windows are disclosed herein. The IGUs disclosed herein generally include measures for avoiding electrical shorting between a metal spacer and conductive components of the electrochromic window, such as bus bars, wires, and associated electrical connections.
In one embodiment, a window assembly includes a first substantially transparent substrate having an optically switchable device disposed on a surface of the first substantially transparent substrate. The optically switchable device includes electrodes. A first electrode of the electrodes has a length about the length of a side of the optically switchable device (e.g., the optically switchable device may be rectangular). The window assembly further includes a second substantially transparent substrate and a metal spacer between the first and the second substantially transparent substrates. The metal spacer has a substantially rectangular cross section, with one side of the metal spacer including a recess configured to accommodate the length of the first electrode such that there is no contact between the first electrode and the metal spacer. A primary seal material bonds the first substantially transparent substrate to the metal spacer and bonds the second substantially transparent substrate to the metal spacer.
In another embodiment, a window assembly includes a first substantially transparent substrate having an optically switchable device disposed on a surface of the first substantially transparent substrate. The optically switchable device includes electrodes. A first electrode of the electrodes has a length about the length of a side of the optically switchable device. The window assembly further includes a second substantially transparent substrate and a metal spacer between the first and the second substantially transparent substrates. The metal spacer has a substantially rectangular cross section, with at least one external face of the metal spacer being coated with an electrically insulating coating that prevents electrical communication between the metal spacer and the first electrode. A primary seal material bonds the first substantially transparent substrate to the metal spacer and bonds the second substantially transparent substrate to the metal spacer.
In another embodiment, a window assembly includes a first substantially transparent substrate having an optically switchable device disposed on a surface of the first substantially transparent substrate. The optically switchable device includes electrodes. A first electrode of the electrodes includes a lead. The window assembly further includes a second substantially transparent substrate and a metal spacer between the first and the second substantially transparent substrates. A primary seal material bonds the first substantially transparent substrate to the metal spacer and bonds the second substantially transparent substrate to the metal spacer. The metal spacer and the primary seal material form a barrier between an exterior region of the window assembly and an interior region of the window assembly. A connector key joins with or otherwise connects two ends of the metal spacer, with the lead passing from the first electrode, under the connector key, and into the exterior region of the window assembly. The connector key is not in electrical communication with the lead.
In another embodiment, a window assembly includes a first substantially transparent substrate having an optically switchable device disposed on a surface of the first substantially transparent substrate. The optically switchable device includes electrodes. A first electrode of the electrodes has a length about the length of a side of the optically switchable device. The window assembly further includes a second substantially transparent substrate and a spacer between the first and the second substantially transparent substrates. The spacer includes a metal portion having a substantially rectangular hollow cross section and an electrically non-conductive portion having a substantially rectangular cross section. One side of the rectangular cross section of the electrically non-conductive portion includes a recess that forms a channel along the one side that accommodates the length of the first electrode. A primary seal material bonds the first substantially transparent substrate to the spacer and bonds the second substantially transparent substrate to the spacer.
In another embodiment, a window assembly includes a first substantially transparent substrate having an optically switchable device disposed on a surface of the first substantially transparent substrate. The optically switchable device includes electrodes. A first electrode of the electrodes has a length about the length of a side of the optically switchable device. The window assembly further includes a second substantially transparent substrate and a metal spacer between the first and the second substantially transparent substrates. The metal spacer has a substantially rectangular cross section. A first primary seal material bonds the first substantially transparent substrate to the metal spacer. The first primary seal material includes electrically non-conductive particles that define a spacing between the first substantially transparent substrate and the metal spacer and prevent contact between the metal spacer and the first electrode. A second primary seal material bonds the second substantially transparent substrate to the metal spacer.
These and other features and advantages will be described in further detail below, with reference to the associated drawings.
It should be understood that while the disclosed embodiments focus on electrochromic (EC) windows (also referred to as smart windows), the concepts disclosed herein may apply to other types of switchable optical devices, including liquid crystal devices, suspended particle devices, and the like. For example, a liquid crystal device or a suspended particle device, instead of an electrochromic device, could be incorporated in any of the disclosed embodiments.
An insulated glass unit (IGU) is part of the transparent component of a window. In the following description, an IGU may include two substantially transparent substrates, for example, two glass lites, where at least one lite includes an electrochromic device disposed thereon, and the lites have a spacer disposed between them. One or more of the lites may itself be a laminate structure of lites. An IGU is typically hermetically sealed, having an interior region that is isolated from an exterior region including the ambient environment.
Disclosed herein are various embodiments in which electrochromic windows are incorporated in IGUs with spacers having improved configurations. An electrochromic window includes a transparent substrate (e.g., a glass sheet or lite) on which is provided a thin electrochromic device. Metal spacers conventionally employed in IGUs may not work well with electrochromic windows due to, e.g., shorting issues with the electrical components of the electrochromic device on one or more lites of the window unit. Specifically, the IGUs disclosed herein generally have measures for avoiding electrical shorting between a metal spacer and conductive components of the electrochromic window, such as bus bars, for example.
For example, electrochromic devices on glass lites use conductive wires, bus bars, or other connections that pass a spacer used to form an IGU, for electrical communication to the electrochromic device. Spacers are often chosen, or required, to be a metal, and for some IGUs, the glass lites may be compressed against the spacer. In some configurations, there are problematic issues created by compressing a metallic, conductive spacer against a conductor (i.e., the conductive wires, bus bars, or other connections) of the electrochromic device. Some conventional sealants may not suffice as insulators in such conditions.
In order to orient the reader to the embodiments of IGUs disclosed herein, a brief discussion of electrochromic devices, edge deletion, and IGUs is provided. This initial discussion of electrochromic devices, edge deletion, and IGUs is provided for context only, and the subsequently described embodiments of spacers are not limited to the specific features and fabrication processes of this initial discussion.
Particular examples of electrochromic devices formed on substrates are described with reference to
In some embodiments, the glass sheet as supplied may include the diffusion barrier layer as well as the first TCO layer. Thus, in some embodiments, an electrochromic stack, 120, and then a second TCO layer, 125, may be formed in the fabrication of electrochromic lite 100. The electrochromic stack is typically a series of layers, e.g., an electrochromic layer, an electrolyte layer, and an ion storage layer; however, in some embodiments electrochromic stack 120 is an electrochromic layer and an ion storage layer with an interfacial region that acts as an electrolyte layer. Examples of electrochromic devices including such stacks are described in U.S. patent application Ser. No. 12/772,055, filed Apr. 30, 2010, titled “Electrochromic Devices,” and naming Wang et. al as inventors; the application is incorporated by reference in its entirety herein. In some embodiments, electrochromic stack 120 and second TCO layer 125 are fabricated in an integrated deposition system where glass sheet 105 does not leave the integrated deposition system at any time during fabrication of the stack. In some embodiments, first TCO layer 115 is also formed using the integrated deposition system where glass sheet 105 does not leave the integrated deposition system during deposition of the stack/layers. In some embodiments, all of the layers (diffusion barrier 110, first TCO layer 115, electrochromic stack 120, and the second TCO layer 125) are deposited in the integrated deposition system where glass sheet 105 does not leave the integrated deposition system during deposition of the stack/layers.
After formation of the electrochromic device, edge deletion and laser scribing are performed.
In some embodiments, laser scribe trenches 130, 132, and 133 pass through the first TCO layer to aide in isolation of the device. Note that laser scribe trench 131 does not pass through the first TCO layer; otherwise, it would cut off bus bar 2's electrical communication with the first TCO layer and thus the electrochromic stack.
The laser or lasers used for the laser scribing are typically, but not necessarily, pulse-type lasers, for example, including diode-pumped solid state lasers. For example, the laser scribing can be performed using a suitable laser from IPG Photonics (Oxford, Mass.), or from Ekspla (Vilnius, Lithuania). Scribing can also be performed mechanically, for example, with a diamond tipped scribe. One of ordinary skill in the art would appreciate that the laser scribing can be performed at different depths and/or performed in a single process whereby the laser cutting depth is varied, or not, during a continuous (or not) path around the perimeter of the electrochromic device. In some embodiments, the edge deletion is performed to the depth below the first TCO layer. In some embodiments, a second laser scribe is performed to isolate a portion of the first TCO layer near the edge of the glass sheet from that toward the interior, as depicted in
After laser scribing is complete, bus bars are attached. In
Edge deletion may be performed on a window where edge portions of an electrochromic device are removed prior to integration of the window into the IGU. The edge portions may include, for example, regions of “roll off” where layers of an electrochromic stack that are normally separated contact one another due to non-uniformity in the layers near the edge of the electrochromic device.
Further, edge deletion may be employed for removal of one or more electrochromic device layers that would otherwise extend to underneath the IGU. In some embodiments, isolation trenches are cut and the isolated portions of the electrochromic device on the perimeter of the electrochromic lites are removed by edge deletion. The process of performing edge deletion is, in some embodiments, a mechanical process such as a grinding or sandblasting process. An abrasive wheel may be employed for grinding. In some embodiments, edge deletion is done by laser, where a laser is used to ablate electrochromic material from the perimeter of the electrochromic lite. The process may remove all electrochromic device layers, including the underlying TCO layer, or it may remove all electrochromic device layers except the bottom TCO layer. The latter case is appropriate when the edge deletion is used to provide an exposed contact for a bus bar, which may be connected to the bottom TCO layer. In some embodiments, a laser scribe is used to isolate that portion of the bottom TCO layer that extends to the edge of the glass sheet from that which is connected to the bus bar (sometimes referred to as a bus bar pad or contact pad) in order to avoid having a conductive path to the electrochromic device from the edge of the glass sheet.
When edge deletion is employed, it can be performed before or after the electrochromic lites are cut from the glass sheet (assuming that lites are cut from a larger glass sheet as part of the fabrication process). In some embodiments, edge deletion is performed in some edge areas prior to cutting the electrochromic lites and again after they are cut. In some embodiments, all edge deletion is performed prior to cutting the electrochromic lites. In embodiments employing edge deletion prior to cutting the electrochromic lites, portions of the electrochromic device on the glass sheet can be removed in anticipation of where the cuts (and thus edges) of the newly formed electrochromic lites will be. In most fabrication processes, after edge deletion, bus bars are applied to the one or more electrochromic lites.
After the electrochromic devices with bus bars are fully assembled on the glass sheets, IGUs are manufactured using the one or more electrochromic lites (e.g., refer to
As described above, after the bus bars are connected, the electrochromic lite is integrated into an IGU, which includes, for example, wiring for the bus bars and the like. In the embodiments described herein, both of the bus bars are inside the primary seal of the finished IGU.
For further context,
In some embodiments, an edge bumper is employed to protect the edges of the glass after incorporation in the IGU. This protection allows the IGU to be safely transported from manufacturer to installation, for example. In some embodiments, the protective bumper is a U-channel cap which fits over the glass edges around the perimeter of the IGU. It may be made from an elastomeric or plastic material. In some embodiments, the edge bumper is a vinyl cap.
Because the spacer in a conventional IGU is made from a metal, such as a steel hollow bar or a stainless steel hollow bar, for example, it can possibly short out one or more features contained in an electrochromic device employed in an electrochromic window. Using IGU 325 (see
In some embodiments, rather than bus bar leads traversing the area where the spacer presses against the primary sealant material, wires 405 may traverse the area. However, the compression used to assemble an IGU may compromise the integrity of insulation on wires 405. In some embodiments, wires 405 may be thin, flat wires (e.g., braided wire cabling) with insulation over the wires. In some embodiments, the wires run between the spacer and the lite, rather than leads as depicted in
A second potential short or failure area depicted in
The third mode of potential shorting and failure is illustrated by reference Z. As shown, a contact can occur between the spacer and some amount of the transparent conductive electrode employed in the electrochromic device. While it is typical to remove some or all of the electrochromic device stack, for example, in an edge delete process, it is not uncommon to have some small amount of an underlying conductive film such as ITO or TEC remain near the edge of the device on the window. As described above, the primary sealant, such as PIB or PVB, typically separates the metal spacer bar from the glass lite with the transparent conductive electrode. However, the primary sealant can deform under pressure and it is not uncommon for the sealant to be squeezed out of the seal area over time. As a consequence, there is a significant risk that the spacer will electrically contact some of the transparent conductive electrode and cause a short.
It should be understood that the design placement of the bus bar, the connectors/leads, the location of the conductive electrode layers, etc., are specified with very tight tolerances, e.g., on the order of about a few millimeters or less. It has been found in practice that the specification may not be met. Therefore, each of the three depicted modes of shorting failure represents a significant design challenge. The following discussion of
There are two primary distinctions between a normal spacer design and spacer 510 shown in
The second significant distinction of spacer 510 from a conventional spacer is in the use of recesses or notches 501 on the upper and lower inner corners of spacer 510. In some embodiments, a spacer may include two notches, and in some embodiments, the spacer may include one notch. Two notches, e.g., as depicted in
In some embodiments, the portion of the spacer's face that does not include the notch (i.e., the outer portion of the spacer) is approximately the same width as a normal spacer employed in non-electrochromic IGU applications. As depicted in
In
Spacer 510, which is wider than conventional spacers, as well as notches 501 in spacer 510, provide additional space for primary seal material 515 (e.g., PIB). This feature, along with the notch or notches on the top and/or bottom inside edges of the spacer, give spacer 510 various advantages that are particular to electrochromic devices incorporated in IGUs. For example, a wider primary seal area provides better containment of argon or other gas within the IGU interior as well as protection of the IGU from moisture and other gasses in the ambient environment. The sealing of the IGU secondary seal also may be improved and may provide better structural integrity than a conventional IGU design. Additionally, the IGU may color all the way to the edge defined by the interior perimeter of the spacer. With the bus bars hidden underneath the notch in the spacer, there will be no bright sight lines created either by the inactive area where the bus bar is placed or by the relatively lightly colored material used to fabricate the bus bar.
Still further, the disclosed embodiment will satisfy industry expectations for an IGU that contains a primary seal having a glass/primary seal material (e.g., PIB)/metal spacer construction. Additionally, because the electrochromic device may employ an edge deletion down to the level of the glass (or the diffusion barrier) and from the glass edge to an area where a notch of the bus bar will form a portion of the primary seal and thus provide more space between the bus bar and spacer, the likelihood of shorting between the electrochromic device electrode and the spacer is greatly reduced.
As noted, embodiments described herein, including notched embodiments, may employ a channel or “mouse hole” under an edge of the spacer where a lead or a connector to the bus bar may run to allow connection to an outside power source (described further herein). One embodiment is the spacer as described in relation to
Each of the connector keys in
In embodiment 600, a connector key, 605, joins two ends, 620, of the spacer. In some embodiments, the spacer may be a metal spacer, such as a steel spacer or a stainless steel spacer, for example. In some embodiments, the spacer may have a substantially rectangular cross section. In some embodiments, the spacer may be hollow. The two ends of the spacer, 607, slide into the respective ends of connector key 605. The connector key and spacer are configured so that when joined, the surfaces that are to come into contact with the glass are substantially co-planar. Connector key 605 has a middle section that is made from a metal, particularly a crimpable metal, such as steel or stainless steel, for example. The bottom portion of the middle region of connector key 605 is made from this crimpable metal and is in fact crimped to produce the channel 609 or mouse hole under which the bus bar lead passes. Of course, connector key 605 could be cast or machined to achieve the same result, but stamped or crimped metal is more economical.
In some embodiments, instead of a bus bar lead passing under channel 609, wiring for an electrode may pass under channel 609. For example, in some embodiments, the wire may be thinner than the thickness (i.e., height) of the channel. In some embodiments, when a thin wire is used, the thickness (i.e., height) of the channel may be reduced.
In embodiment 610, a connector key, 615, joins two ends, 620, of the spacer. The two ends of the spacer, 617, slide into the ends of connector key 615. Connector key 615 is an electrically non-conductive or insulating material (e.g., a plastic). Connector key 615 may or may not have a channel or mouse hole cut into it. Typically, such a channel will be unnecessary because connector key 615 is a non-conductive or insulating material, thereby eliminating the possibility of a short between the connector key and the bus bar lead. Thus, the connector key and the lead will not be in electrical communication.
It should be noted that the connector key normally sits at a random location in the spacer. This is because the tubular metal pieces used to make the spacer typically come in standard or fixed lengths. These lengths may be used to construct a rectangular spacer of effectively arbitrary size, as dictated by the size of the window and the associated IGU. In accordance with the embodiments shown
In some other embodiments, the spacer is constructed using conventional connector keys. The spacer may then be dented or crimped at the locations where the bus bar lead passes.
A crimping process that may be used to form a crimped metal connector key may have tolerances associated with the process. Therefore, the channel formed in a connector key may be specified to be somewhat larger than what is desired to account for the tolerances in the process.
Notch 820 in spacer 805 resides in the middle of the underside of spacer 805. The dimensions of notch 820 are suitable to accommodate bus bar 825, factoring in tolerances of the process used to form the notch, as discussed above. In some embodiments, the notch width is about 2 millimeters to about 5 millimeters, and the notch height is about 0.1 millimeters to 1 millimeter. In some embodiments, the notch width is about 3 millimeters to 4 millimeters, and the notch height is about 0.1 millimeter to about 0.5 millimeters.
Comparing notch 820 shown in
In some embodiments, the channel for the bus bar lead is located as in the embodiment described with respect to
In some embodiments, the electrochromic device stack 802 when in a colored state may color all the way under the spacer such that electrochromic device stack 802 is substantially uniformly colored. Further, the bus bar may not be visible.
In some other embodiments, instead of impregnating the primary seal material with mechanical supports, the primary seal material is made more viscous or mechanically resistant to compression. This may be accomplished by, for example, increasing the cross-linking in the primary seal material when the primary seal material is a polymeric material.
Of course, as with the other designs, some provision may be made for passing the bus bar lead underneath the spacer. This can be accomplished with a modified connector key or a channel/tunnel under a portion of the spacer, as described above.
Spacer 1005 is a hollow spacer with three sides of the spacer made from a metal (e.g., steel or stainless steel) and one side, 1035, is made out of an electrically non-conductive material. The electrically non-conductive or insulating material may be a polymeric material or a plastic, for example. Side 1035 is a c-shaped piece which mates with the metal portion (e.g., much like the U-channel described above with regard to protecting the IGU, but smaller so as to fit within the IGU, as part of the spacer). Together, the metal and plastic portions form a tubular structure as with a conventional all-metal spacer. Spacers of the type depicted in
Side 1035 of spacer 1005 faces towards the inside of the IGU, and is therefore the portion of spacer 1005 that comes into closest proximity with bus bar 1025. In accordance with this embodiment, if spacer 1005 is moved into a position where it effectively touches glass lite 1015 and possibly bus bar 1025, side 1035, which is insulating, will contact bus bar 1025. With side 1035 contacting bus bar 1025, shorting between the metal portions of spacer 1005 and bus bar 1025 is avoided.
Of course, as with the other designs, some provision may be made for passing the bus bar lead underneath the spacer. This can be accomplished with a modified connector key or a channel/tunnel under a portion of the spacer, as described above.
As shown in cross section K-K′, non-conductive or insulating spacer 1105 includes a notch or recess, 1115, to accommodate bus bar 310. The notch may form a channel in a side of the non-conductive or insulating spacer. An electrochromic device stack (not shown) is fabricated on glass lite 1130. Bus bar 310 located on the electrochromic device stack makes electrical contact with one of the electrodes of the device. With non-conductive or insulating spacer 1105 situated on top of bus bar 310, the risk of a short between bus bar 310 and metal spacer 1110 is reduced. An edge delete operation may still be performed on glass lite 1130 down to the glass so that metal spacer 1110 does not contact the conductive electrodes of the electrochromic device stack. The IGU primary seal is comprised of interfaces between glass lites 1130 and 1135 and primary seal material (e.g., PIB), 1140, and between primary seal material 1140 and non-conductive or insulating spacer 1105 and metal spacer 1110.
In some embodiments, metal spacer 1110 may have about the same width as a conventional spacer; i.e., about 6 millimeters wide. In some embodiments, metal spacer 1110 may have a smaller width than a conventional spacer. For example, metal spacer 1110 may be about 4 millimeters wide. Regardless of whether metal spacer 1110 has the same width or has a smaller width than a conventional spacer, the overall design of metal spacer 1110 may be similar in many regards to a conventional spacer.
Cross section J-J′ shows a channel for the bus bar lead. Specifically, metal spacer 1110 includes a raised portion compared to non-conductive or insulating spacer 1105. The raised portion of metal spacer 1110 effectively forms the channel or mouse hole under which the bus bar leads passes to avoid electrical contact with metal spacer 1110.
One advantage of the embodiments shown in
In some embodiments, non-conductive or insulating spacer 1105 includes a desiccant. In conventional IGUs, a desiccant is provided in the interior of the metal spacer. Therefore, the metal spacer maintains its integrity in the IGU. For example, the metal spacer cannot include any holes to the outside environment which would permit direct contact with the desiccant when a desiccant is provided in the interior of the metal spacer. Typically, there are one or more holes used to introduce desiccant into the spacer, but these are sealed after the desiccant is introduced.
The metal spacer may include holes to accommodate the wiring to connect the electrochromic device bus bars with a power source. The wires can be fed through the interior of the metal bus bar. These holes may be sealed around the wires to secure the desiccant's function in the metal spacer.
In some embodiments, the non-conductive or insulating spacer and the metal spacer may form barrier between an exterior region and an inter region of the IGU. The metal spacer may include two holes, with a wire in electrical contact or communication with an electrode of an electrochromic device passing through the first hole, though the hollow metal spacer, and out of the second hole. The wire may provide electrical communication from the exterior region of the IGU to the interior region of the IGU.
The manufacturing advantage of the embodiment shown in
In some other embodiments, the entire spacer may be made from a material that is electrically non-conductive (i.e., electrically resistive or electrically insulating) and therefore does not exhibit any of the three modes of shorting illustrated in
In some embodiments, a metal spacer has an electrically non-conductive or insulating outer coating (i.e., an electrically resistive outer coating) but may otherwise be similar in design and structure to a conventional spacer. In some embodiments, the metal spacer may have a substantially rectangular cross section. In some embodiments, the non-conductive outer coating may be on at least one side of the substantially rectangular cross section of the metal spacer. In some embodiments, the non-conductive outer coating may be on all four sides of the substantially rectangular cross section of the metal spacer. In some embodiments, the metal spacer may include a channel configured to accommodate an electrode of an optically switchable device on one of the glass lites.
For example, one embodiment is metal spacer coated on one or more sides with an insulating (non-electrically conductive) coating. The insulating coating may be a paint or polymeric material such as polytetrafluoroethylene or similar material. The spacer is used along with a primary sealant material as described herein. The spacer may include a channel and/or a notch as described herein. In one embodiment, the spacer includes one or more connector keys as described herein. In one embodiment, the spacer is coated on all sides; in another embodiment, the spacer is coated on only the sides proximate the bus bar and/or bus bar lead.
For example, the spacer may be made from a metal having the shape and dimensions of a conventional metal spacer and be coated with a non-conductive or insulating coating. For example, the spacer may be made from aluminum and the outer non-conductive coating may be an anodized layer. More generally, any form of passivation may be employed to provide a tough, non-conductive coating. Other metals that can be electrolytically passivated in a similar manner to aluminum include titanium, zinc, magnesium, tantalum, and niobium, for example. It should be understood that the passivating layer also may be made from many different forms of inorganic non-conductive materials, such as metal oxides, carbides, and nitrides. Alternatively, the non-conductive coating may be an organic-based material such as a thermosetting or thermoplastic resin, a wax, an elastomer, or a polymeric material, for example. Some examples of non-conducing-coatings include polyurethanes, acrylics, polyesters, epoxies, and hybrids of these. Painting and powder coating are two examples of suitable processes for applying non-conductive organic based materials. In some embodiments, a commercially available non-conductive (e.g., insulating) paint is applied to the surface of the metal spacer that faces the electrochromic stack. The paint may be black or clear or any other color. The paint also may be applied to one or more of the remaining surfaces of the spacer for aesthetic reasons.
Although the foregoing embodiments have been described in some detail to facilitate understanding, the described embodiments are to be considered illustrative and not limiting. It will be apparent to one of ordinary skill in the art that certain changes and modifications can be practiced within the scope of the appended claims.
This application claims benefit under 35 U.S.C. §119(e) to U.S. Provisional Patent Application No. 61/421,154, filed Dec. 8, 2010, and to U.S. Provisional Patent Application No. 61/435,914, filed Jan. 25, 2011, both of which are herein incorporated by reference.
Number | Name | Date | Kind |
---|---|---|---|
5076673 | Lynam et al. | Dec 1991 | A |
5140455 | Varaprasad et al. | Aug 1992 | A |
5142407 | Varaprasad et al. | Aug 1992 | A |
5145609 | Varaprasad et al. | Sep 1992 | A |
5151816 | Varaprasad et al. | Sep 1992 | A |
5233461 | Dornan et al. | Aug 1993 | A |
5239405 | Varaprasad et al. | Aug 1993 | A |
5340503 | Varaprasad et al. | Aug 1994 | A |
5379146 | Defendini | Jan 1995 | A |
5384653 | Benson et al. | Jan 1995 | A |
5471338 | Yu et al. | Nov 1995 | A |
5472643 | Varaprasad et al. | Dec 1995 | A |
5500760 | Varaprasad et al. | Mar 1996 | A |
5567360 | Varaprasad et al. | Oct 1996 | A |
5657149 | Buffat et al. | Aug 1997 | A |
5657150 | Kallman et al. | Aug 1997 | A |
5668663 | Varaprasad et al. | Sep 1997 | A |
5724175 | Hichwa et al. | Mar 1998 | A |
5724187 | Varaprasad et al. | Mar 1998 | A |
5805330 | Byker et al. | Sep 1998 | A |
5953150 | Smarto et al. | Sep 1999 | A |
5969847 | Coleman et al. | Oct 1999 | A |
5985184 | Lynam | Nov 1999 | A |
5995271 | Zieba et al. | Nov 1999 | A |
6001487 | Ladang et al. | Dec 1999 | A |
6002511 | Varaprasad et al. | Dec 1999 | A |
6045643 | Byker et al. | Apr 2000 | A |
6045896 | Boire et al. | Apr 2000 | A |
6055088 | Fix et al. | Apr 2000 | A |
6055089 | Schulz et al. | Apr 2000 | A |
6118573 | Kubo et al. | Sep 2000 | A |
6143209 | Lynam | Nov 2000 | A |
6154306 | Varaprasad et al. | Nov 2000 | A |
6166849 | Coleman et al. | Dec 2000 | A |
6204953 | Zieba et al. | Mar 2001 | B1 |
6207083 | Varaprasad et al. | Mar 2001 | B1 |
6244716 | Steenwyk et al. | Jun 2001 | B1 |
6261641 | Zieba et al. | Jul 2001 | B1 |
6337758 | Beteille et al. | Jan 2002 | B1 |
6369935 | Cardinal et al. | Apr 2002 | B1 |
6420071 | Lee et al. | Jul 2002 | B1 |
6433913 | Bauer et al. | Aug 2002 | B1 |
6515787 | Westfall et al. | Feb 2003 | B1 |
6529308 | Beteille et al. | Mar 2003 | B2 |
6535126 | Lin et al. | Mar 2003 | B2 |
6559411 | Borgeson et al. | May 2003 | B2 |
6561460 | Rukavina et al. | May 2003 | B2 |
6783099 | Rukavina et al. | Aug 2004 | B2 |
6795226 | Agrawal et al. | Sep 2004 | B2 |
6822778 | Westfall et al. | Nov 2004 | B2 |
6853472 | Warner et al. | Feb 2005 | B2 |
6862125 | Warner et al. | Mar 2005 | B2 |
6919530 | Borgeson et al. | Jul 2005 | B2 |
6995891 | Agrawal et al. | Feb 2006 | B2 |
7002720 | Beteille et al. | Feb 2006 | B2 |
7004592 | Varaprasad et al. | Feb 2006 | B2 |
7033655 | Beteille et al. | Apr 2006 | B2 |
7130101 | Rukavina et al. | Oct 2006 | B2 |
7133181 | Greer | Nov 2006 | B2 |
7173750 | Rukavina | Feb 2007 | B2 |
7202987 | Varaprasad et al. | Apr 2007 | B2 |
7230748 | Giron et al. | Jun 2007 | B2 |
7248392 | Rukavina et al. | Jul 2007 | B2 |
7277215 | Greer | Oct 2007 | B2 |
7300166 | Agrawal et al. | Nov 2007 | B2 |
7317106 | Warner et al. | Jan 2008 | B2 |
7324261 | Tonar et al. | Jan 2008 | B2 |
7362491 | Busick et al. | Apr 2008 | B2 |
7531101 | Beteille | May 2009 | B2 |
7586664 | O'Shaughnessy | Sep 2009 | B2 |
7710671 | Kwak et al. | May 2010 | B1 |
7719751 | Egerton et al. | May 2010 | B2 |
7869114 | Valentin et al. | Jan 2011 | B2 |
7894119 | Valentin et al. | Feb 2011 | B2 |
7929194 | Legois et al. | Apr 2011 | B2 |
8035882 | Fanton et al. | Oct 2011 | B2 |
8213074 | Shrivastava et al. | Jul 2012 | B1 |
20020041443 | Varaprasad et al. | Apr 2002 | A1 |
20020075552 | Poll et al. | Jun 2002 | A1 |
20020135881 | Rukavina et al. | Sep 2002 | A1 |
20040047050 | Bauer et al. | Mar 2004 | A1 |
20040257633 | Agrawal et al. | Dec 2004 | A1 |
20050002081 | Beteille et al. | Jan 2005 | A1 |
20050166495 | Cho et al. | Aug 2005 | A1 |
20060077511 | Poll et al. | Apr 2006 | A1 |
20060283084 | Johnson | Dec 2006 | A1 |
20070002422 | O'Shaughnessy | Jan 2007 | A1 |
20070020442 | Giron et al. | Jan 2007 | A1 |
20070067048 | Bechtel et al. | Mar 2007 | A1 |
20070103761 | Giron et al. | May 2007 | A1 |
20070133078 | Fanton et al. | Jun 2007 | A1 |
20070248756 | Krisko et al. | Oct 2007 | A1 |
20080074724 | Agrawal et al. | Mar 2008 | A1 |
20090058295 | Auday et al. | Mar 2009 | A1 |
20090067031 | Piroux et al. | Mar 2009 | A1 |
20090097098 | Piroux | Apr 2009 | A1 |
20090110918 | Jacquiod et al. | Apr 2009 | A1 |
20090114928 | Messere et al. | May 2009 | A1 |
20090130409 | Reutler et al. | May 2009 | A1 |
20090148642 | Mauser et al. | Jun 2009 | A1 |
20090174300 | Jousse et al. | Jul 2009 | A1 |
20090181203 | Valentin et al. | Jul 2009 | A1 |
20090251758 | Valentin et al. | Oct 2009 | A1 |
20090262411 | Karmhag et al. | Oct 2009 | A1 |
20090297806 | Dawson-Elli et al. | Dec 2009 | A1 |
20090323160 | Egerton et al. | Dec 2009 | A1 |
20090323162 | Fanton et al. | Dec 2009 | A1 |
20100208326 | Kwak et al. | Aug 2010 | A1 |
20100243427 | Kozlowski et al. | Sep 2010 | A1 |
20100245973 | Wang et al. | Sep 2010 | A1 |
20110043885 | Lamine et al. | Feb 2011 | A1 |
20110048614 | Veerasamy et al. | Mar 2011 | A1 |
20110051221 | Veerasamy | Mar 2011 | A1 |
20110059275 | Stark | Mar 2011 | A1 |
20110094585 | Debije et al. | Apr 2011 | A1 |
20110148218 | Rozbicki et al. | Jun 2011 | A1 |
20110211247 | Kozlowski et al. | Sep 2011 | A1 |
20110216389 | Piroux et al. | Sep 2011 | A1 |
20110249314 | Wang et al. | Oct 2011 | A1 |
20110260961 | Burdis | Oct 2011 | A1 |
20110266137 | Wang et al. | Nov 2011 | A1 |
20110266138 | Wang et al. | Nov 2011 | A1 |
20110267672 | Sbar et al. | Nov 2011 | A1 |
20110267674 | Wang et al. | Nov 2011 | A1 |
20110267675 | Wang et al. | Nov 2011 | A1 |
20110292488 | McCarthy et al. | Dec 2011 | A1 |
20110299149 | Park et al. | Dec 2011 | A1 |
20120026573 | Collins et al. | Feb 2012 | A1 |
20120033287 | Friedman et al. | Feb 2012 | A1 |
20120062975 | Mehtani et al. | Mar 2012 | A1 |
20120194895 | Podbelski et al. | Aug 2012 | A1 |
20120200908 | Bergh et al. | Aug 2012 | A1 |
20120239209 | Brown et al. | Sep 2012 | A1 |
20120268803 | Greer et al. | Oct 2012 | A1 |
20120300280 | Murphy et al. | Nov 2012 | A1 |
20120327499 | Parker et al. | Dec 2012 | A1 |
20130157493 | Brown | Jun 2013 | A1 |
Number | Date | Country |
---|---|---|
10 2006 042 538 | Mar 2008 | DE |
2136409 | Feb 2009 | EP |
2 348 357 | Jul 2011 | EP |
2001-193364 | Jul 2001 | JP |
WO 2005076061 | Aug 2005 | WO |
WO 2008043951 | Apr 2008 | WO |
WO 2009145876 | Dec 2009 | WO |
WO 2009148861 | Dec 2009 | WO |
WO 2011010067 | Jan 2011 | WO |
WO 2011028253 | Mar 2011 | WO |
WO 2011028254 | Mar 2011 | WO |
WO 2011050291 | Apr 2011 | WO |
WO 2011109688 | Sep 2011 | WO |
WO2012145155 | Oct 2012 | WO |
Entry |
---|
U.S. Appl. No. 13/452,032, filed Apr. 20, 2012, entitled “Angled Bus Bar”. |
International Search Report and Written Opinion dated Jul. 23, 2012, from PCT/US2011/063534. |
U.S. Appl. No. 13/326,168, filed Dec. 14, 2011, entitled “Connectors for Smart Windows”. |
International Preliminary Report on Patentability dated Jun. 20, 2013, from PCT/US2011/063534. |
International Search Report and Written Opinion dated Apr. 1, 2013 from PCT/US2012/068950. |
International Search Report and Written Opinion dated Aug. 12, 2013 for PCT/US2013/037644. |
International Search Report and Written Opinion dated Nov. 22, 2013 for PCT/US2013/056506. |
Number | Date | Country | |
---|---|---|---|
20120147449 A1 | Jun 2012 | US |
Number | Date | Country | |
---|---|---|---|
61421154 | Dec 2010 | US | |
61435914 | Jan 2011 | US |