The disclosure relates generally to spatial power-combining devices, and more particularly, to an antenna assembly for a spatial power-combining device.
Spatial power-combining devices, such as a Qorvo® Spatium® spatial power-combining device, are used for broadband radio frequency power amplification in commercial and defense communications, radar, electronic warfare, satellite, and various other communication systems. Spatial power-combining techniques are implemented by combining broadband signals from a number of amplifiers to provide output powers with high efficiencies and operating frequencies. One example of a spatial power-combining device utilizes a plurality of solid-state amplifier assemblies that form a coaxial waveguide to amplify an electromagnetic signal. Each amplifier assembly may include an input antenna structure, an amplifier, and an output antenna structure. When the amplifier assemblies are combined to form the coaxial waveguide, input antennas may form an input antipodal antenna array, and output antennas may form an output antipodal antenna array.
In operation, an electromagnetic signal is passed through an input port to an input coaxial waveguide section of the spatial power-combining device. The input coaxial waveguide section distributes the electromagnetic signal to be split across the input antipodal antenna array. The amplifiers receive the split signals and in turn transmit amplified split signals across the output antipodal antenna array. The output antipodal antenna array and an output coaxial waveguide section combine the amplified split signals to form an amplified electromagnetic signal that is passed to an output port of the spatial power-combining device.
An antenna for conventional spatial power-combining devices typically includes a metal antenna signal conductor and a metal antenna ground conductor deposited on opposite sides of a substrate, such as a printed circuit board. The printed circuit board provides a desired form factor and mechanical support for the antenna signal conductor and the antenna ground conductor; however, the printed circuit board can become increasingly lossy at higher frequencies, thereby limiting combining efficiency, operating frequency range, and achievable output power of the spatial power-combining device.
Aspects disclosed herein include spatial power-combining devices and antenna assemblies for spatial power-combining devices. The disclosure relates to spatial power-combining devices with antenna assemblies designed for high efficiency, high or low frequency ranges, ultra-wide bandwidth operation, and high output power.
In some aspects, a spatial power-combining device includes an input coaxial waveguide section, an output coaxial waveguide section, and a center waveguide section that is between the input coaxial waveguide section and the output coaxial waveguide section. The center waveguide section includes an input center waveguide section including an input inner housing and an input outer housing, an output center waveguide section including an output inner housing and an output outer housing, and a core section that forms an integral single component with the input inner housing and the output inner housing. A plurality of amplifiers are registered with the core section.
In some embodiments, the input center waveguide section, the output center waveguide section, and the core section are formed completely of metal. The input inner housing may include a plurality of input signal conductors, and the input outer housing may include a plurality of input ground conductors. The plurality of input signal conductors and the plurality of input ground conductors form an input antenna assembly. In some embodiments, the input antenna assembly includes a plurality of input antennas, wherein each input antenna of the plurality of input antennas includes an input signal conductor of the plurality of input signal conductors and an input ground conductor of the plurality of input ground conductors. Each input antenna of the plurality of input antennas is electromagnetically connected with a corresponding amplifier of the plurality of amplifiers. In a similar manner, the spatial power-combining device may also include an output antenna assembly.
In some aspects, a spatial power-combining device includes an input coaxial waveguide section, an output coaxial waveguide section, a center waveguide section that is between the input coaxial waveguide section and the output coaxial waveguide section. The center waveguide section includes an input center waveguide section including an input inner housing and an input outer housing, an output center waveguide section including an output inner housing and an output outer housing, and a core section that is attached to the input inner housing and the output inner housing. A plurality of amplifiers are registered with the core section. In some embodiments, the core section is attached to the input inner housing and the output inner housing by at least one of a screw or other threaded connection, a bolt, a pin, a press-fit connection, or an adhesive.
In some aspects, a spatial power-combining device structure includes an input antenna assembly including a plurality of input signal conductors and a plurality of input ground conductors, an output antenna assembly including a plurality of output signal conductors and a plurality of output ground conductors, and a core section between the input antenna assembly and the output antenna assembly. The core section forms an integral single component with the plurality of input signal conductors and the plurality of output signal conductors. In some embodiments, the input antenna assembly, the output antenna assembly, and the core section are formed completely of metal.
Those skilled in the art will appreciate the scope of the present disclosure and realize additional aspects thereof after reading the following detailed description of the preferred embodiments in association with the accompanying drawing figures.
The accompanying drawing figures incorporated in and forming a part of this specification illustrate several aspects of the disclosure, and together with the description serve to explain the principles of the disclosure.
The embodiments set forth below represent the necessary information to enable those skilled in the art to practice the embodiments and illustrate the best mode of practicing the embodiments. Upon reading the following description in light of the accompanying drawing figures, those skilled in the art will understand the concepts of the disclosure and will recognize applications of these concepts not particularly addressed herein. It should be understood that these concepts and applications fall within the scope of the disclosure and the accompanying claims.
It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
It will be understood that when an element such as a layer, region, or substrate is referred to as being “on” or extending “onto” another element, it can be directly on or extend directly onto the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly on” or extending “directly onto” another element, there are no intervening elements present. Likewise, it will be understood that when an element such as a layer, region, or substrate is referred to as being “over” or extending “over” another element, it can be directly over or extend directly over the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly over” or extending “directly over” another element, there are no intervening elements present. It will also be understood that when an element is referred to as being “connected” or “coupled” to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, there are no intervening elements present.
Relative terms such as “below” or “above” or “upper” or “lower” or “horizontal” or “vertical” may be used herein to describe a relationship of one element, layer, or region to another element, layer, or region as illustrated in the Figures. It will be understood that these terms and those discussed above are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises,” “comprising,” “includes,” and/or “including” when used herein specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms used herein should be interpreted as having a meaning that is consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Aspects disclosed herein include spatial power-combining devices and antenna assemblies for spatial power-combining devices. The disclosure relates to spatial power-combining devices with antenna assemblies designed for high efficiency, high or low frequency ranges, ultra-wide bandwidth operation, and high output power.
In some embodiments, an antenna assembly may include a signal conductor and a ground conductor that are entirely separated by air. Conventional antenna structures for spatial power-combining devices typically have antenna conductors in the form of patterned metals on opposing sides of a printed circuit board. Separating the antenna conductors entirely by air eliminates any lossy materials of the printed circuit board and, among other advantages, facilitates spatial power-combining devices with antenna structures sized for ultra-broadband microwave operation. The embodiments are particularly adapted to spatial power-combining devices that operate at microwave frequencies, such as, by way of non-limiting example, energy between about 300 megahertz (MHz) and 300 gigahertz (GHz) (0.1 cm wavelength). A spatial power-combining device may operate within one or more common radar bands including, but not limited to, S-band, C-band, X-band, Ku-band, K-band, Ka-band, and Q-band. In some embodiments, by way of non-limiting examples, the operating frequency range includes an operating bandwidth spread of 2 GHz to 20 GHz. In other embodiments, the operating frequency range includes an operating bandwidth spread of 4 GHz to 41 GHz. In still further embodiments, the operating frequency range includes frequencies of 40 GHz and higher, such as operating frequency ranges of 2 GHz to 400 GHz, 20 GHz to 120 GHz, 40 GHz to 400 GHz, and 70 GHz to 400 GHz. Accordingly, an antenna assembly as described herein may be configured to transmit electromagnetic signals above, below, and within a microwave frequency range. For example, in various embodiments, an antenna assembly may transmit electromagnetic signals with frequencies as low as 100 MHz and as high as 400 GHz.
A spatial power-combining device generally includes a plurality of signal paths that include an amplifier connected to an output antenna structure of an output center waveguide. The output antenna structure may comprise an output antenna ground conductor and an output antenna signal conductor that are entirely separated by air. An output coaxial waveguide may be configured to concurrently combine amplified signals from the output antenna structure. Each signal path may further comprise an input antenna structure comprising an input antenna ground conductor and an input antenna signal conductor that are entirely separated by air. An input coaxial waveguide may be configured to provide a signal concurrently to each input antenna structure. The plurality of signal paths may be arranged coaxially about a center axis. Accordingly, the spatial power-combining device may be configured to split, amplify, and combine an electromagnetic signal. Separating the antenna ground conductors and the antenna signal conductors by air eliminates any lossy materials of conventional antenna structures on printed circuit boards and, among other advantages, facilitates spatial power-combining devices with antenna structures sized for ultra-broadband microwave operation.
In some embodiments, the plurality of amplifiers 28 comprise an array of Monolithic Microwave Integrated Circuit (MMIC) amplifiers. In some embodiments, each MMIC may include a solid-state Gallium Nitride (GaN)-based MMIC. A GaN MMIC device provides high power density and bandwidth, and a spatial power-combining device may combine power from an array of GaN MMICs efficiently in a single step to minimize combining loss.
In some embodiments, the output ground conductors 36 and the output outer housing 32 are an integral single component, and the output signal conductors 38 and the output inner housing 34 are an integral single component. In other embodiments, the output ground conductors 36 and the output signal conductors 38 may be formed separately and attached to the output outer housing 32 and the output inner housing 34, respectively. In other embodiments, the order may be reversed in which the output outer housing 32 comprises output signal conductors and the output inner housing 34 comprises output ground conductors. As with
In
The plurality of input signal conductors 86 and the plurality of input ground conductors 90 form an input antenna assembly 104. The plurality of output signal conductors 94 and the plurality of output ground conductors 98 form an output antenna assembly 106. In that regard, spatial power-combining device structures may include the input antenna assembly 104 comprising the plurality of input signal conductors 86 and the plurality of input ground conductors 90, the output antenna assembly 106 comprising the plurality of output signal conductors 94 and the plurality of output ground conductors 98, and the core section 100 that is between the input antenna assembly 104 and the output antenna assembly 106. In some embodiments, the core section 100 forms an integral single component with the plurality of input signal conductors 86 and the plurality of output signal conductors 94. In some embodiments, the input antenna assembly 104, the output antenna assembly 106, and the core section 100 are formed completely of metal, such as Al or alloys thereof, or Cu or alloys thereof.
In
In operation, an input signal 120 is received at the input port 70. The input signal 120 then propagates through the opening 112 of the input coaxial waveguide section 72 to the input antenna assembly 104. The input signal 120 is split across the input antenna assembly 104 and is concurrently distributed in a substantially even manner to each amplifier of the plurality of amplifiers 102. The plurality of amplifiers 102 concurrently amplify respective portions of the input signal 120 to generate amplified signal portions. The plurality of amplifiers 102 transmit the amplified signal portions to the output antenna assembly 106 where they are guided to the opening 118 of the output coaxial waveguide section 76. The amplified signal portions are combined to form an amplified output signal 120AMP, which is then propagated through the output port 78. In some embodiments, the input port 70, the input coaxial waveguide section 72, the input antenna assembly 104, the output antenna assembly 106, the output coaxial waveguide section 76, and the output port 78 are all formed completely of metal. In this manner, the entire structure that the electromagnetic signal passes through before and after the plurality of amplifiers 102 is metal. Accordingly, losses associated with conventional antenna structures that use printed circuit boards are eliminated. This allows spatial power-combining devices with higher frequency ranges of operation.
An all-metal configuration further provides the ability to scale the dimensions down for higher frequency ranges or scale the dimensions up for lower frequency ranges. For example, for a lower frequency range of about 350 MHz to about 1100 MHz, the spatial power-combining device 68 may comprise a length of about 50 inches from the input port 70 to the output port 78 and a diameter of the center waveguide section 74 of about 20 inches. For a medium frequency range of about 2 GHz to about 20 GHz, the spatial power-combining device 68 may be scaled to comprise a length of about 9 inches from the input port 70 to the output port 78 and a diameter of the center waveguide section 74 of about 2.3 inches. For a high frequency range of about 20 GHz to about 120 GHz, the spatial power-combining device 68 may be scaled to comprise a length of about 0.75 inches from the input port 70 to the output port 78 and a diameter of the center waveguide section 74 of about 0.325 inches. For an ultra-high frequency range of about 70 GHz to about 400 GHz, the spatial power-combining device 68 may be scaled to comprise a length of about 0.250 inches from the input port 70 to the output port 78 and a diameter of the center waveguide section 74 of about 0.1 inches. Accordingly, a spatial power-combining device may comprise the same structure, only with relative dimensions scaled up or down, and achieve any of the above frequency ranges.
An all-metal design additionally provides improved thermal capabilities that allow better power-handling for spatial power-combining devices. For example, in some embodiments, the plurality of amplifiers 102 are mounted on the core section 100 that comprises a highly thermally conductive material, such as metal. As previously described, the rest of the spatial power-combining device 68 may also comprise a highly thermally conductive material, such as metal. In operation, the core section 100 as well as other components of the spatial power-combining device 68 serve as a heat sink for heat generated by the plurality of amplifiers 102. Accordingly, the spatial power-combining device 68 has improved thermal capabilities that allow higher temperature operation with increased efficiency and higher overall output power.
As previously described, a spatial power-combining device with an all-metal design allows scalability for higher or lower frequency ranges that were not previously possible with conventional antenna structures. For example, for frequencies above about 20 GHz, the dimensional requirements of an individual antenna may be so small that they fall below minimum thickness limitations for printed circuit boards. Additionally, for frequencies below 1 or 2 GHz, the dimensional requirements of an individual antenna become larger than conventional antenna arrangements on printed circuit boards. An all-metal antenna allows flexibility to design spatial power-combining devices for a wide range of operation frequencies.
As in previous embodiments, the signal conductor 162 may additionally include a connector 168 for transmitting or receiving a signal to or from an amplifier. The connector 168 may be a single piece or integral with the signal conductor 162, or it may be formed separately. The connector 168 is a transition area for the antenna structure 160 to transmit or receive a signal, such as a signal with frequency in the microwave range or higher. The antenna structure 160 may comprise a metal with a thickness such that a substrate is not required for support, thereby an air gap 170 is maintained entirely between the signal conductor 162 and the ground conductor 164. Accordingly, the signal conductor 162 and the ground conductor 164 are entirely separated by air.
It is understood that the antenna structure 160 of
As previously described, a spatial power-combining device may include an antenna assembly that includes at least one antenna in which a conventional substrate is removed and the signal and ground conductors are separated entirely by air. This configuration provides the ability to scale down designs for higher frequency ranges not previously attainable. For example, an antenna structure 186 of
Additional antenna designs are possible, such as a stub-launch antenna design, as shown by an antenna structure 210 of
Those skilled in the art will recognize improvements and modifications to the preferred embodiments of the present disclosure. All such improvements and modifications are considered within the scope of the concepts disclosed herein and the claims that follow.
This application claims the benefit of provisional patent application Ser. No. 62/548,472, filed Aug. 22, 2017, the disclosure of which is hereby incorporated herein by reference in its entirety.
Number | Name | Date | Kind |
---|---|---|---|
3023382 | Borghetti | Feb 1962 | A |
4234854 | Schellenberg et al. | Nov 1980 | A |
4424496 | Nichols | Jan 1984 | A |
5036335 | Jairam | Jul 1991 | A |
5162803 | Chen | Nov 1992 | A |
5214394 | Wong | May 1993 | A |
5256988 | Izadian | Oct 1993 | A |
5736908 | Alexanian et al. | Apr 1998 | A |
5920240 | Alexanian et al. | Jul 1999 | A |
6028483 | Shealy et al. | Feb 2000 | A |
6037840 | Myer | Mar 2000 | A |
6181221 | Kich et al. | Jan 2001 | B1 |
6828875 | Channabasappa et al. | Dec 2004 | B2 |
7110165 | Martin et al. | Sep 2006 | B2 |
7215220 | Jia | May 2007 | B1 |
7466203 | Rector | Dec 2008 | B2 |
8698577 | Sherrer et al. | Apr 2014 | B2 |
8928429 | Song et al. | Jan 2015 | B2 |
9019036 | Kolias et al. | Apr 2015 | B2 |
9054427 | Guy et al. | Jun 2015 | B2 |
9065163 | Wu et al. | Jun 2015 | B1 |
9276304 | Behan et al. | Mar 2016 | B2 |
9287605 | Daughenbaugh, Jr. et al. | Mar 2016 | B2 |
9325074 | Chandler | Apr 2016 | B2 |
9917343 | Chieh et al. | Mar 2018 | B2 |
9954706 | Harris et al. | Apr 2018 | B1 |
10003118 | Kitt | Jun 2018 | B2 |
10009067 | Birk et al. | Jun 2018 | B2 |
10164667 | Kitt | Dec 2018 | B1 |
20060202777 | Deckman et al. | Sep 2006 | A1 |
20070229186 | Hacker et al. | Oct 2007 | A1 |
20070279146 | Rector | Dec 2007 | A1 |
20140145794 | Courtney et al. | May 2014 | A1 |
20140167880 | Daughenbaugh, Jr. et al. | Jun 2014 | A1 |
20170149113 | Theveneau et al. | May 2017 | A1 |
20170179598 | Kitt | Jun 2017 | A1 |
20180294539 | Kitt | Oct 2018 | A1 |
20190007007 | Kitt | Jan 2019 | A1 |
20190067778 | Mohan | Feb 2019 | A1 |
20190067781 | Mohan et al. | Feb 2019 | A1 |
20190067782 | Mohan et al. | Feb 2019 | A1 |
20190067783 | Mohan et al. | Feb 2019 | A1 |
20190068123 | Mohan et al. | Feb 2019 | A1 |
20190068140 | Mohan et al. | Feb 2019 | A1 |
20190068141 | Yoon et al. | Feb 2019 | A1 |
Number | Date | Country |
---|---|---|
2017214357 | Dec 2017 | WO |
Entry |
---|
Author Unknown, “Interpack 2005: An assessment for PMMI members,” 2005, PMMI, 32 pages. |
Caturla, F., et al., “Electroless Plating of Graphite with Copper and Nickel,” Journal of the Electrochemical Soceity, vol. 142, Issue 12, Dec. 1995, The Electrochemical Society, Inc., pp. 4084-4090. |
Fitzhugh, William, et al., “Modulation of Ionic Current Limitations by Doping Graphite Anodes,” Journal of Electrochemical Society, vol. 165, Issue 10, Jul. 2018, The Electrochemical Society, 6 pages. |
Larkins, Grover, et al., “Evidence of Superconductivity in Doped Graphite and Graphene,” Superconductor Science and Technology, vol. 29, Issue 1, Dec. 2015, IOP Publishing Ltd, 18 pages. |
Glenis, S., et al., “Sulfur doped graphite prepared via arc discharge of carbon rods in the presence of thiopenes,” Journal of Applied Physics, vol. 86, Issue 8, Oct. 1999, American Institute of Physics, pp. 4464-4466. |
Scheike, T., et al., “Can doping graphite trigger room temperature superconductivity: Evidence for granular high-temperature superconductivity in water-treated graphite powder,” Advanced Materials, vol. 24, Issue 43, Sep. 2012, 19 pages. |
Smalc, Martin, et al., “Thermal Performance of Natural Graphite Heat Spreaders,” Proceedings of IPACK2005, Jul. 17-22, San Francisco, California, American Society of Mechanical Engineers, 11 pages. |
Notice of Allowance for U.S. Appl. No. 15/637,472, dated Mar. 12, 2019, 7 pages. |
Non-Final Office Action for U.S. Appl. No. 15/846,840, dated Mar. 21, 2019, 4 pages. |
Non-Final Office Action for U.S. Appl. No. 15/637,472, dated Aug. 10, 2018, 8 pages. |
Notice of Allowance for U.S. Appl. No. 15/927,565, dated Aug. 8, 2018, 8 pages. |
Non-Final Office Action for U.S. Appl. No. 15/933,783, dated May 1, 2019, 8 pages. |
Non-Final Office Action for U.S. Appl. No. 16/042,351, dated Jul. 5, 2019, 5 pages. |
Notice of Allowance for U.S. Appl. No. 15/846,840, dated Jul. 5, 2019, 7 pages. |
Non-Final Office Action for U.S. Appl. No. 15/981,535, dated Jul. 8, 2019, 5 pages. |
Notice of Allowance for U.S. Appl. No. 15/845,225, dated Jan. 10, 2019, 7 pages. |
Notice of Allowance for U.S. Appl. No. 16/166,548, dated Nov. 29, 2018, 8 pages. |
Non-Final Office Action for U.S. Appl. No. 15/933,821, dated Jul. 11, 2019, 7 pages. |
Author Unknown, “Spatial Combining Technology: Revolutionizing the Microwave Power Amplifier,” Microwave Journal, Sep. 8, 2008, http://www.microwavejournal.com/articles/print/6838-spatial-combining, CAP Wireless Inc., 7 pages. |
Author Unknown, “Vivaldi antenna,” Wikipedia, web page last edited Feb. 7, 2017, accessed May 11, 2017, https://en.wikipedia.org/wiki/Vivaldi_antenna, Wikimedia Foundation, Inc., 2 pages. |
Courtney, Patrick G. et al., “120 W Ka Band Power Amplifier Utilizing GaN MMICs and Coaxial Waveguide Spatial Power Combining,” White Paper, May 2016, Qorvo, pp. 1-8. |
Jia, Pengcheng et al., “Broadband High Power Amplifier using Spatial Power Combining Technique” IEEE Transactions on Microwave Theory and Techniques, vol. 51, Issue 12, Dec. 2003, IEEE, 4 pages. |
Leggieri, Alberto et al., “The Squarax Spatial Power Combiner,” Progress in Electromagnetics Research C, vol. 45, Oct. 2013, EMW Publishing, pp. 43-55. |
Ortiz, Sean C., “High Power Spatial Combiners: Tile and Tray Approaches,” Dissertation, North Carolina State University, Electrical Engineering, Nov. 2001, 194 pages. |
Notice of Allowance for U.S. Appl. No. 15/290,749, dated Feb. 16, 2018, 9 pages. |
Amjadi, S., et al., “Design of a Broadband Eight-Way Coaxial Wavelength Power Combiner,” IEEE Transactions on Microwave Theory and Techniques, vol. 60, Issue 1, Nov. 15, 2011, pp. 39-45. |
Beyers, R., et al., “Compact Conical-Line Power Combiner Design Using Circuit Models,” IEEE Transactions on Microwave Theory and Techniques, vol. 62, Issue 11, Oct. 9, 2014, pp. 2650-2658. |
Fathy, A., et al., “A Simplified Approach for Radial Power Combiners,” IEEE Transactions on Microwave Theory and Techniques, vol. 54, No. 1, Jan. 2006, pp. 247-255. |
Gharehkand, F., “Design of a 16 Way Radial Microwave Power Divider/Combiner with Rectangular Waveguide Output and Coaxial Inputs,” International Journal of Electronics and Communications (AEU), vol. 68, 2014, pp. 422-428. |
Tribak, A., et al., “Ultra-Broadband High Efficiency Mode Converter,” Progress in Electromagnetics Research C, vol. 36, 2013, pp. 145-158. |
Montgomery, R., et al., “Solid-State PAs Battle TWTAs for ECM Systems,” Microwave Journal, Jun. 2017 Supplement, Jun. 14, 2017, 3 pages. |
Möttönen, V. S., “Receiver Front-End Circuits and Components for Millimetre and Submillimetre Wavelengths,” Dissertation for the degree of Doctor of Science in Technology, Helsinki University of Technology, Department of Electrical and Communications Engineering, Radio Laboratory, Apr. 2005, 40 pages. |
Non-Final Office Action for U.S. Appl. No. 16/005,794, dated Oct. 7, 2019, 11 pages. |
Notice of Allowance for U.S. Appl. No. 16/042,351, dated Nov. 18, 2019, 7 pages. |
Non-Final Office Action for U.S. Appl. No. 16/008,586, dated Oct. 24, 2019, 10 pages. |
Non-Final Office Action for U.S. Appl. No. 16/191,541, dated Dec. 9, 2019, 7 pages. |
Corrected Notice of Allowance and Examiner-Initiated Interview Summary for U.S. Appl. No. 15/846,840, dated Dec. 12, 2019, 6 pages. |
Notice of Allowance for U.S. Appl. No. 16/005,794, dated Jan. 9, 2020, 7 pages. |
Non-Final Office Action for U.S. Appl. No. 16/032,252, dated Dec. 27, 2019, 5 pages. |
Notice of Allowance for U.S. Appl. No. 16/008,586, dated Feb. 4, 2020, 8 pages. |
Corrected Notice of Allowance and Applicant-Initiated Interview Summary for U.S. Appl. No. 15/846,840, dated Dec. 31, 2019, 6 pages. |
Notice of Allowance for U.S. Appl. No. 15/981,535, dated Dec. 31, 2019, 7 pages. |
Notice of Allowance for U.S. Appl. No. 15/933,821, dated Jan. 15, 2020, 7 pages. |
Non-Final Office Action for U.S. Appl. No. 16/039,435, dated Jan. 7, 2020, 5 pages. |
Final Office Action for U.S. Appl. No. 16/191,541, dated Mar. 31, 2020, 8 pages. |
Corrected Notice of Allowability and Examiner-Initiated Interview Summary for U.S. Appl. No. 16/005,794, dated May 26, 2020, 6 pages. |
Notice of Allowance for U.S. Appl. No. 16/032,252, dated Jun. 1, 2020, 7 pages. |
Notice of Allowance for U.S. Appl. No. 16/039,435, dated Jun. 17, 2020, 8 pages. |
Notice of Allowance for U.S. Appl. No. 16/214,234, dated May 15, 2020, 8 pages. |
Non-Final Office Action for U.S. Appl. No. 16/288,735, dated May 26, 2020, 9 pages. |
Advisory Action, Examiner-Initiated Interview Summary, and AFCP 2.0 Decision for U.S. Appl. No. 16/191,541, dated May 21, 2020, 5 pages. |
Number | Date | Country | |
---|---|---|---|
20190067836 A1 | Feb 2019 | US |
Number | Date | Country | |
---|---|---|---|
62548472 | Aug 2017 | US |