The present invention relates to an electronic device and elements thereof, and more particularly to an electronic device and a speaker module thereof.
Recently, with advances in technology, electronic devices such as mobile phones, tablet computers, e-Books, and note book computers are being widely used in day-to-day life. An electronic device generally includes a speaker module for producing sound, and the speaker module is commonly equipped with a casing and a speaker. The speaker is positioned in the casing and is used for transforming an electrical signal into structural vibration so as to generate sound. The sound quality of the speaker module is not only related to the speaker itself but also to the casing of the speaker module. Generally speaking, the casing of a speaker module with a greater volume will reduce the damping effect of the air inside the speaker module as the sound is produced by the speaker. In such a manner, the lowest resonant frequency of the speaker can be lower, thereby achieving a better low-frequency response effect, and thus improving the sound quality of the speaker module.
As mentioned above, the low-pitched sound performance of the speaker is related to the internal volume of the casing. In order to have better low-pitched sound performance, a larger casing is required. However, in a relatively small electronic device, the overall size of the speaker module is constrained, and the effective volume in the casing has to be decreased, which causes an increase of the low frequency resonant frequency of the speaker module. This increase not only degrades the low-pitched sound performance but also enhances distortion of the speaker, thereby influencing the sound quality of the electronic device.
One objective of the disclosure is to provide a speaker module which is able to produce sound of a high quality so as to address the problems in the prior art.
In accordance with some embodiments of the disclosure, the speaker module includes a housing, a speaker unit, and a modulating unit. The housing has a main segment and an extension segment connecting to the main segment and extending away from the main segment, the main segment and the extension segment communicate with each other and form a chamber. The speaker unit is disposed in the housing in a position that is relative to the main segment. The modulating unit is arranged to correspond to the extension segment and is positioned in the housing. The shape of a cross section of the modulating unit is compatible with the shape of a cross section of the extension segment, and a length between the speaker unit and the modulating unit along the chamber is greater than 0.
In the above-mentioned embodiments, the extension segment comprises a first sub-segment and a second sub-segment. The modulating unit is positioned in the second sub-segment. The first sub-segment is connected to the main segment and extending in a first direction. The second sub-segment is connecting to the first sub-segment and extending in a second direction away from the main segment. the first direction is different from the second direction.
In the above-mentioned embodiments, the extension segment comprises a first sub-segment and a second sub-segment. The modulating unit is positioned in the second sub-segment. The first sub-segment is connected to the main segment and extending in a first direction. The second sub-segment is connecting to the first sub-segment and extending in a second direction away from the main segment. the first direction is the same as the second direction.
In the above-mentioned embodiments, the width of the main segment is greater than the width of the extension segment.
In the above-mentioned embodiments, the modulating module comprising one or more materials selected from a group consisting of polyurethane, Polyethylene, foam rubber, melamine, glass fiber, rockwool, OFAN polyester fiber, cyanuramide and active carbon.
In the above-mentioned embodiments, the ratio of a length of the modulating unit and a length of the extension segment is about 0.25.
In the above-mentioned embodiments, the ratio of a length (L1) of the chamber, between the speaker unit and the modulating unit, a length (L2) of the modulating unit, and a length (L3) of the chamber, between the modulating unit and an end of the extension segment that is away from the speaker unit, is about 1:1:2.
In the above-mentioned embodiments, the main body has a sound outlet, and the speaker unit is arranged to correspond to the sound outlet and positioned in the housing, wherein the sound outlet is sealed by the speaker unit, and a sealed chamber which is secluded from the surrounding is defined in the housing.
Another objective of the disclosure is to provide an electronic device using the speaker module in any one of the above-mentioned embodiments. The speaker module is positioned at two sides of the electronic device and is configured to convert electric signals from control unit in the electronic device.
For a more complete understanding of the embodiments and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings.
In the following detailed description, for purposes of explanation, numerous specific details and embodiments are set forth in order to provide a thorough understanding of the present disclosure. The specific elements and configurations described in the following detailed description are set forth in order to clearly describe the present disclosure. It will be apparent, however, that the exemplary embodiments set forth herein are used merely for the purpose of illustration, and the inventive concept may be embodied in various forms without being limited to those exemplary embodiments. In addition, the drawings of different embodiments may use like and/or corresponding numerals to denote like and/or corresponding elements in order to clearly describe the present disclosure. However, the use of like and/or corresponding numerals in the drawings of different embodiments does not suggest any correlation between different embodiments.
In this specification, relative expressions are used. For example, “lower”, “bottom”, “higher” or “top” are used to describe the position of one element relative to another. It should be appreciated that if a device is flipped upside down, an element at a “lower” side will become an element at a “higher” side.
The terms “about” and “substantially” typically mean +/−20% of the stated value, more typically +/−10% of the stated value and even more typically +/−5% of the stated value. The stated value of the present disclosure is an approximate value. When there is no specific description, the stated value includes the meaning of “about” or “substantially”.
In accordance with some embodiments, the speaker modules 10 and 20 are arranged at two opposite sides of the base 50 so as to optimize user's experience. Specifically, as shown in
Referring to
Referring to
Specifically, as shown in
Referring to
Referring to
In some embodiments, the modulating module 15 is made of material having sound-absorbing characteristics. For example, the modulating module 15 is made of a material that includes one or more materials selected from a group consisting of polyurethane, Polyethylene, foam rubber, melamine, glass fiber, rockwool, OFAN polyester fiber, cyanuramide, and active carbon.
In some embodiments, a depression structure 124 is formed on a portion of the upper housing member 12 relative to the second sub-segment 117. The depression structure 124 is depressed inwardly. In some embodiments, the modulating unit 15 is arranged to correspond to the depression structure 124 and positioned in the second sub-segment 117. In some embodiments, the depression structure 124 is omitted, and the modulating unit 15 is positioned in any position in the second sub-segment 117. The modulating unit 15 is not arranged to correspond to the depression structure 124.
Referring to
In one exemplary embodiment, the modulating unit 15 of the speaker module 10 has a length L2 of 12 mm. An upper chamber of the speaker module 10 (a portion of the chamber 110 between the speaker unit 14 and the modulating unit 15) has a length L1 of 9 mm. A lower chamber of the speaker module 10 (a portion of the chamber 110 between the modulating unit 15 and the second end 118 of the housing 11) has a length L3 of 23.92 mm. That is, the ratio of the length L1 and the length L3 is about 3:8.
As shown in
In one exemplary embodiment, the modulating unit 15 of the speaker module 10a has a length L2 of 12 mm. An upper chamber of the speaker module 10a (a portion of the chamber 110 between the speaker unit 14 and the modulating unit 15) has a length L1 of 5 mm. A lower chamber of the speaker module 10a (a portion of the chamber 110 between the modulating unit 15 and the second end 118 of the housing 11) has a length L3 of 27.92 mm. That is, the ratio of the length L1 and the length L3 is about 1:5. As shown in
In one exemplary embodiment, the modulating unit 15 of the speaker module 10b has a length L2 of 12 mm. An upper chamber of the speaker module 10b (a portion of the chamber 110 between the speaker unit 14 and the modulating unit 15) has a length L1 of 28 mm. A lower chamber of the speaker module 10b (a portion of the chamber 110 between the modulating unit 15 and the second end 118 of the housing 11) has a length L3 of 4.92 mm. That is, the ratio of the length L1 and the length L3 is about 7:1. As shown in
Referring to
Specifically, a first boundary line between the main segment 111c and the first sub-segment 115c is located at a lateral side 141 of the speaker unit 14, and a second boundary line between the first sub-segment 115c and the second sub-segment 117c is located parallel to the first boundary line. As a whole, the housing 11c has a straight shape, and the width of the main segment 111c is greater than a width of the first segment 115c.
In one exemplary embodiment, the modulating unit 15 of the speaker module 10c has a length L2 of 12 mm. An upper chamber of the speaker module 10c (a portion of the chamber 110c between the speaker unit 14 and the modulating unit 15) has a length L1 of 9 mm. A lower chamber of the speaker module 10c (a portion of the chamber 110c between the modulating unit 15 and the second end 118 of the housing 11) has a length L3 of 23.92 mm. That is, the ratio of the length L1 and the length L3 is about 3:8. With these arrangements, the speaker module 10c has a “planarization” acoustic characteristic and produces sounds with inhibited distortion.
In one exemplary embodiment, the modulating unit 15 of the speaker module 10d has a length L2 of 12 mm. An upper chamber of the speaker module 10d (a portion of the chamber 110c between the speaker unit 14 and the modulating unit 15) has a length L1 of 5 mm. A lower chamber of the speaker module 10d (a portion of the chamber 110c between the modulating unit 15 and the second end 118c of the housing 11c) has a length L3 of 27.92 mm. That is, the ratio of the length L1 and the length L3 is about 1:5. With the arrangements, the speaker module 10d has a “planarization” acoustic characteristic and produces sounds with inhibited distortion.
In one exemplary embodiment, the modulating unit 15 of the speaker module 10e has a length L2 of 12 mm. An upper chamber of the speaker module 10e (a portion of the chamber 110c between the speaker unit 14 and the modulating unit 15) has a length L1 of 28 mm. A lower chamber of the speaker module 10e (a portion of the chamber 110c between the modulating unit 15 and the second end 118c of the housing 11c) has a length L3 of 4.92 mm. That is, the ratio of the length L1 and the length L3 is about 7:1. With the arrangements, the speaker module 10d has a “planarization” acoustic characteristic and produces sounds with inhibited distortion.
Embodiments of the micro speaker modules are able to be applied to electronic device with limited sized. The micro speaker module includes a modulating unit positioned inside of the chamber for adjusting the capacitance value and the resistance value. Since the standing wave of the speaker module is inhibited, the sound quality of the speaker module is improved.
Although the embodiments and their advantages have been described in detail, it should be understood that various changes, substitutions, and alterations can be made herein without departing from the spirit and scope of the embodiments as defined by the appended claims. Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods, and steps described in the specification. As one of ordinary skill in the art will readily appreciate from the disclosure, processes, machines, manufacture, compositions of matter, means, methods, or steps, presently existing or later to be developed, that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized according to the disclosure. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods, or steps. In addition, each claim constitutes a separate embodiment, and the combination of various claims and embodiments are within the scope of the disclosure.
Number | Date | Country | Kind |
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104133818 | Oct 2015 | TW | national |
This application is a Continuation of U.S. patent application Ser. No. 14/991,479, filed on Jan. 8, 2016, which claims priority of Taiwan Patent Application No. 104133818, filed on Oct. 15, 2015, the entirety of which is incorporated by reference herein.
Number | Date | Country | |
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Parent | 14991479 | Jan 2016 | US |
Child | 15708477 | US |