Patent Application
20210243530
This application claims priority to and the benefit of Korean Patent Application No. 2020-0011857, filed on Jan. 31, 2020, the disclosure of which is incorporated herein by reference in its entirety.
The present invention relates to a speaker unit, and more particularly, to a speaker unit for an earphone, which is installed in an earphone, a headset, or the like.
Generally, an earphone is an electronic device and/or additional device which includes a miniaturized speaker unit therein and is put in a user's ear (for example, external auditory meatus) and capable of directly releasing a sound generated by the speaker unit toward an inside of the user's ear so as to allow a user to hear the sound with low power. Users may comfortably heat music and the like without regard to ambient conditions by using an earphone being coupled with an electronic device such as a mobile communication terminal, a portable multimedia player, a tablet personal computer (PC), and the like.
However, when an earphone is put on, a space in front of a speaker unit in an earphone and user's external auditory meatus is sealed such that an internal pressure thereof may increase. In this case, a pressure in the external auditory meatus increases further than that of outside, a user may feel sense of difference considerably such as a feeling of being deafened.
Also, when an earphone is dropped in the water or water or humidity flows into an earphone while the earphone is used in the rain, not only acoustic performance is degraded but also a risk of damaging an inner circuit is present. In the case of an earphone with a built-in battery, there is a concern about occurrence of explosion or fire.
The present invention is directed to providing a speaker unit for an earphone, capable of relieving a sense of difference when the earphone is put on by preventing a space in front of the speaker unit in the earphone from being sealed.
The present invention is also directed to providing a speaker unit for an earphone, capable of minimizing an influence of water or humidity which flows into the earphone.
Aspects of the present invention are not limited to the above-stated aspects and other unstated aspects of the present invention will be understood by those skilled in the art from a following description.
According to one aspect of the present invention, there is provided a speaker unit for an earphone. The speaker unit includes a magnet, an upper plate fixed to a top surface of the magnet, a voice coil disposed to surround outer circumferences of the magnet and the upper plate, a vibration plate disposed above the upper plate and to which the voice coil is fixed, a fixing ring on which an edge of the vibration plate is mounted, and a frame having an open top and configured to accommodate the magnet, the upper plate, and the voice coil. Here, a pipe conduit is formed in the frame along a circumferential direction. A first hole configured to allow the pipe conduit and a first space disposed in front of the speaker unit to communicate with each other is formed in at least one first position at a top of the frame in a circumferential direction. A second hole configured to allow the pipe conduit and a second space disposed in the rear of the speaker unit to communicate with each other is formed in at lest one second position at a bottom of the frame in a circumferential direction.
The frame may include a mounting portion formed along a circumferential direction to allow a part of an inside of a bottom surface of the fixing ring and a groove formed to be close to the mounting portion along a circumferential direction such that the pipe conduit may be formed along the circumferential direction by the groove and a part of an outside of the bottom surface of the fixing ring.
A partition having a height lower than a depth of the groove may be formed between the first hole and the second hole in the groove.
The frame may further include a support portion which provides an inner surface outside the groove and surrounds and supports an outer circumference of the fixing ring along a circumferential direction.
A protruding portion protruding from an outer circumference of the frame in a radial direction may be formed, and the first hole may be formed above the protruding portion.
A third hole configured to allow an internal space of the speaker unit and the second space to communicate with each other may be formed in at least one third position at the bottom of the frame in a circumferential direction.
The frame may have a shape with an open bottom. The speaker unit may further include a lower plate fixed to a bottom surface of the magnet and configured to cover the bottom of the frame. Here, a fourth hole and at least one fifth hole, which allow an internal space of the speaker unit and the second space to communicate with each other, may be formed in a center and a part outside the center of the lower plate, respectively.
When a groove portion which traverses the fourth hole and the fifth hole and extends to a side surface of the lower plate is formed in a bottom surface of the lower plate and a support plate configured to support the speaker unit is disposed on the bottom surface of the lower plate, a pipe conduit may be formed by the groove portion and the support plate such that an internal space of the speaker unit and the second space may communicate with each other through the fourth hole, the fifth hole, and the pipe conduit.
The groove portion may be formed such that a width between the fourth hole and the fifth hole may be smaller than a width of the fourth hole and a width of the fifth hole.
The speaker unit may further include a support portion which is formed of a metal material and coupled with the frame, provides an inner surface outside the groove, and surrounds and supports an outer circumference of the fixing ring along a circumferential direction.
The speaker unit may further include a second mesh member configured to cover the second hole and a third mesh member configured to cover the third hole.
The second hole and the third hole may be disposed in one plane, and the second mesh member and the third mesh member may be integrally formed and cover the second hole and the third hole at the same time.
The above and other objects, features and advantages of the present invention will become more apparent to those of ordinary skill in the art by describing exemplary embodiments thereof in detail with reference to the accompanying drawings, in which:
Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the drawings. Hereinafter, in the description and the attached drawings, substantially like elements will be referred to as like reference numerals and a repetitive description thereof will be omitted. Also, in a description of the embodiments of the present invention, a detailed description of well-known functions or components of the related art will be omitted when it is deemed to obscure understanding of the embodiments of the present invention.
An earphone 10 according to the embodiment may include a housing 100, a speaker unit 200 installed in the housing 100, and a support plate 300 installed to support the speaker unit 200 in the housing 100.
The housing 100 may be formed by coupling an upper housing 101 with an open bottom to a lower housing 102 with an open top. Although the speaker unit 200 and the support plate 300 are installed in the upper housing 101 in
The upper housing 101 may include a nozzle 110 which releases a sound output from the speaker unit 200. A first mesh 120 configured to prevent an inflow of foreign substances or to tune a sound may be installed on the nozzle 110. Also, the upper housing 101 may include a tuning hole 130 configured to tune a sound and a second mesh 140 installed on the tuning hole 130.
The support plate 300 may perform a function of supporting the speaker unit 200 and function as a substrate on which a variety of circuits (for example, a communication circuit, an active noise control (ANC) circuit, and the like) for operating the earphone 10 or a battery is installed.
An internal space of the earphone 10 may be divided into a first space S1 disposed in front of the speaker unit 200, a second space S2 disposed in the rear of the speaker unit 200 and in front of the support plate 300, a third space S3 disposed in the rear of the speaker unit 200 and in the rear of the support plate 300, and an internal space S4 of the speaker unit 200.
The speaker unit 200 according to the embodiment may include a vibration plate 203, a voice coil 205, a fixing ring 207, a first upper plate 209, a second upper plate 210, a first magnet 211, a second magnet 212, a frame 220, and a lower plate 260.
Outer diameters of the first magnet 211 and the first upper plate 209 may have approximately same circular shapes, and the first upper plate 209 may be fixed to a top surface of the first magnet 211.
The second magnet 212 and the second upper plate 210 may have inner diameters which are approximately same annular shapes and be disposed to surround the first magnet 211 and the first upper plate 209, respectively. The second upper plate 210 may be fixed to a top surface of the second magnet 212.
The voice coil 205 may be disposed such that a part of a bottom thereof is surrounded by inner circumferences of the second magnet 212 and the second upper plate 210 while surrounding outer circumferences of the first magnet 211 and the first upper plate 209. That is, the part of the bottom of the voice coil 205 is disposed between the outer circumferences of the first magnet 211 and the first upper plate 209 and the inner circumferences of the second magnet 212 and the second upper plate 210.
The vibration plate 203 is disposed above the first upper plate 209 and the second upper plate 210, and the voice coil 205 is fixed to a bottom of the vibration plate 203. An edge of the vibration plate 203 is mounted on the fixing ring 207.
The frame 220 has a top and a bottom which are open and accommodates the voice coil 205, the first upper plate 209, the second upper plate 210, the first magnet 211, and the second magnet 212. The vibration plate 203 covers a top of the frame 220, and the lower plate 260 is coupled with the frame 220 to cover a bottom of the frame 220. The lower plate 260 is fixed to bottom surfaces of the first magnet 211 and the second magnet 212. Accordingly, the frame 220 and the lower plate 260 provides an accommodation space which accommodates the voice coil 205, the first upper plate 209, the second upper plate 210, the first magnet 211, and the second magnet 212. According to embodiments, the second upper plate 210, the second magnet 212, and the lower plate 260 may be coupled with the frame through insert molding, and the first magnet 211 and the first upper plate 209 may be fixed to the lower plate 260.
The frame 220 may include a great-diameter portion 230 located above and having a relatively greater outer diameter and a small-diameter portion 250 located below and having a relatively smaller outer diameter.
The great-diameter portion 230 may include a mounting portion 221 formed along a circumferential direction such that a part of an inside of a bottom surface of the fixing ring 207 is mounted thereon. A groove 223 may be formed outside the mounting portion 221 to be adjacent to the mounting portion 221 along a circumferential direction. Also, the great-diameter portion 230 may include a support portion 226 which forms an outer circumference of the grater-diameter portion 230, provides an inner surface outside the groove 223, extends toward an upper part of a bottom surface of the fixing ring 207, and surrounds and supports an outer circumference of the fixing ring 207 along a circumferential direction. Accordingly, a pipe conduit 225 may be formed along a circumferential direction by a part of an outside of the bottom surface of the fixing ring 207 (that is, a part of the bottom surface of the fixing ring 207 which does not come into contact with the mounting portion 221) and the groove 223.
A first hole 227 configured to allow the pipe conduit 225 and the first space S1, which are disposed in front the speaker unit 200 in at least one first position in a circumferential direction, to communicate with each other may be formed above the great-diameter portion 230.
For example, on the basis of
To block an inflow of foreign substances or tune a sound, a 1_1 mesh member 227_1F and a 1_2 mesh member 227_2F, which cover the 1_1 hole 227_1 and the 1_2 hole 227_2, respectively, may be installed.
A circuit substrate 245 which receives an electrical signal from the outside and transmits the electrical signal to the voice coil 205 may be disposed below the protruding portion 240.
A second hole 229 which allows the pipe conduit 225 and the second space S2 disposed in the rear of the speaker unit 200 to communicate with each other may be formed in at least one second position below the great-diameter portion 230 in a circumferential direction.
For example, a 2_1 hole 229_1, a 2_2 hole 229_2, and a 2_3 hole 229_3 may be formed at positions B′, D, and B, respectively, below the great-diameter portion 230 in a circumferential direction on the basis of
To block an inflow of foreign substances or to tune a sound, a 2_1 mesh member 229_1F, a 2_2 mesh member 229_2F, and a 2_3 mesh member 229_3F, which cover the 2_1 hole 229_1, the 2_2 hole 229_2, and the 2_3 hole 229_3, respectively, may be installed.
A partition 233 having a height lower than a depth of the groove 223 may be formed in the groove 223 between the first hole 227 and the second hole 229 or between the second holes 229.
For example, referring to
The air flowing from the first space S1 through the 1_1 hole 227_1 passes through the pipe conduit 225 and discharges into the second space S2 through the 2_3 hole 229_3, the 2_2 hole 229_2, and the like. The air flowing from the first space S1 through the 1_2 hole 227_2 passes through the pipe conduit 225 and discharges into the second space S2 through the 2_1 hole 229_1, the 2_2 hole 229_2, and the like. Since the first space S1 and the second space S2 communicate with each other through the first hole 227, the pipe conduit 225, and the second hole 229 such that the space in front of the speaker unit 200 is not sealed as described above, a feeling of foreign may be relieved by an increase of a pressure thereinside.
Also, even when a liquid flows into the first hole 227 due to an air pressure in the pipe conduit 225 formed along a circumferential direction of the frame 220, it becomes difficult that the fluid moves forward along the pipe conduit 225 and reaches the second hole 229. In addition, the partitions 233 formed in the pipe conduit 225 makes it difficult for the liquid in the pipe conduit 225 to approach the second hole 229. A first mesh member 227F, which covers the first hole 227, may prevent a fluid from flowing into the pipe conduit 225 from the first space S1 through the first hole 227. A second mesh member 229F, which covers the second hole 229, may prevent a fluid from flowing into the second space S2 from the pipe conduit 225 through the second hole 229.
As described above, the first mesh member 227F prevents a liquid from flowing into the pipe conduit 225. The air pressure and the partitions 233 prevent a liquid from moving forward and reaching the second hole 229 through the pipe conduit 225. The second mesh member 229F prevents a liquid from flowing into the second space S2. Accordingly, since a liquid is almost completely prevented from flowing into the second space S2 in the rear of the speaker unit 200, a variety of circuits, it is possible to waterproof-protect a battery, or the like installed in the rear of the speaker unit 200 or the support plate 300.
A third hole 231 which allows the internal space S4 of the speaker unit 200 and the second space S2 to communicate with each other may be formed in at least one third position below the great-diameter portion 230 in a circumferential direction.
For example, a 3_1 hole 231_1, a 3_2 hole 231_2, a 3_3 hole 231_3, and a 3_4 hole 231_4 may be formed at positions C′, E, C, and G, respectively, below the great-diameter portion 230 in a circumferential direction on the basis of
To block an inflow of foreign substances or to tune a sound, a 3_1 mesh member 231_1F, a 3_2 mesh member 231_2F, a 3_3 mesh member 231_3F, and a 3_4 mesh member 231_4F, which cover the 3_1 hole 231_1, the 3_2 hole 231_2, the 3_3 hole 231_3, and the 3_4 hole 231_4, respectively, may be installed.
A fourth hole 263 and a fifth hole 265 for allowing the internal space S4 of the speaker unit 200 and the spaces S2 and S3 in the rear of the speaker unit 200 to communicate with each other may be formed in a center and a part outside the center of the lower plate 260, respectively.
For example, the fourth hole 263 may be formed in the center of the lower plate 260 and a 5_1 hole 265_1, a 5_2 hole 265_2, a 5_3 hole 265_3, and a 5_4 hole 265_4 may be formed at equivalent intervals (that is, a + shaped array) along a circumferential direction in different directions on the basis of the center of the lower plate 260. To block an inflow of foreign substances or to tune a sound, a fourth mesh member 263F, a 5_1 mesh member 265_1F, a 5_2 mesh member 265_2F, a 5_3 mesh member 265_3F, and a 5_4 mesh member 265_4F, which cover the fourth hole 263, the 5_1 hole 265_1, the 5_2 hole 265_2, the 5_3 hole 265_3, and the 5_4 hole 265_4, may be installed.
A sixth hole 305, which communicates with at least one of the fifth hole 265, for example, the 5_2 hole 265_2, may be formed in the support plate 300. To block an inflow of foreign substances or to tune a sound, a sixth mesh member 305F, which covers the sixth hole 305, may be installed.
A groove portion 262 having a + shape, which traverses the fourth hole 263, the 5_1 hole 265_1, the 5_2 hole 265_2, the 5_3 hole 265_3, and the 5_4 hole 265_4 and extends to a side surface of the lower plate 260, may be formed in a bottom surface of the lower plate 260.
A bottom surface 250A of an edge of the small-diameter portion 250 and a bottom surface 260A of a part where the groove portion 262 of the lower plate 260 is not formed are disposed to be in one plane while a part 250B of the bottom surface 250A of the small-diameter portion 250, which corresponds to side surfaces of the 5_1 hole 265_1 and the 5_3 hole 265_3 of the lower plate 260, and a bottom surface 260B, in which the groove portion 262 of the lower plate 260 is formed, are disposed in one plane. Accordingly, when the support plate 300 is disposed below the lower plate 260, that is, the support plate 300 is disposed to come into contact with the bottom surface 250A of the edge of the small-diameter portion 250 and the bottom surface 260A of the part of the lower plate 260 in which the groove portion 262 is not formed, a pipe conduit having a + shape restricted by the groove portion 262 and the support plate 300 is formed and sides of the 5_1 hole 265_1 and the 5_3 hole 265_3 in the pipe conduit communicate with the second space S2. Meanwhile, the pipe conduit communicates with the third space S3 through the sixth hole 305.
Consequently, the internal space S4 of the speaker unit 200 communicates with the second space S2 through the fourth hole 263, the 5_1 hole 265_1, the 5_2 hole 265_2, the 5_3 hole 265_3, the 5_4 hole 265_4, and the pipe conduit formed by the groove portion 262 and communicates with the third space S3 through the 5_2 hole 265_2 and the sixth hole 305 of the support plate 300.
As shown in
The sound discharged through the 2_1 hole 229_1, the 2_2 hole 229_2, the 2_3 hole 229_3, the 3_1 hole 231_1, the 3_2 hole 231_2, the 3_3 hole 231_3, and the 3_4 hole 231_4 below the small-diameter portion 250 flows into the pipe conduit formed by the groove portion 262. The sound discharged through the fourth hole 263, the 5_1 hole 265_1, the 5_3 hole 265_3, the 5_4 hole 265_4, and the like of the lower plate 260 is discharged into the second space S2 through the pipe conduit formed by the groove portion 262. The sound which flows into the groove portion 262 and the sound discharged through the 5_4 hole 265_4, the fourth hole 263, and the like flow again into the internal space S4 of the speaker unit 200 through the 5_2 hole 265_2 of the lower plate 260 or are discharged into the third space S3 through the sixth hole 305 of the support plate 300.
As described above, since a discharge path and an inflow path of a sound (air) are asymmetrically and diversely formed below the speaker unit 200, a frequency feature is improved, for example, a frequency band is increased such that a sound rich and close to an original sound may be reproduced.
In the speaker unit 200 of the above-described embodiment, it is necessary to form the support portion 226 of the frame 220 to have a considerably small thickness in a radial direction. Accordingly, when the frame 220 is injection-molded such that the support portion 226 is integrally formed, it is apprehended that a molding failure occurs or the support portion 226 is damaged during a process of assembling the speaker unit 200.
To redeem this, according to the modified embodiment of the present invention, a support portion 226′ separately molded using a metal material having higher rigidity than that of a frame 220′ may be coupled, instead of the support portion 226, with the frame 220′ formed by eliminating the support portion 226 from the frame 220. The support portion 226′ also provides an inner surface outside the groove 223 and surrounds and supports the outer circumference of the fixing ring 207 along a circumferential direction. The support portion 226′ may be formed to have a radial cross section having an L shape. The support portion 226′ and the frame 220′ may be coupled with each other through insert-molding.
According to the embodiments of the present invention, a variety of mesh members such as the 2_1 mesh member 229_1F, the 2_2 mesh member 229_2F, the 3_1 mesh member 231_1F, the 3_2 mesh member 231_2F, and the like are installed in holes below the great-diameter portion 230 of the frame 220. It may be inconvenient to install the variety of mesh members one by one in each hole. Accordingly, when two (or two or more) holes are disposed in one plane, it is possible to eliminate such inconvenient operation by installing a mesh member having a size capable of covering the two holes at one time. In this case, protruding ribs may be formed around the holes and between the holes and the mesh member may be attached to the protruding ribs through thermosetting.
For example, referring to
According to the embodiments of the present invention, a speaker unit for an earphone may relieve a feeling of foreign when the earphone is put on by preventing a space in front of the speaker unit in the earphone from being sealed.
Also, the speaker unit may minimize an influence even when water or humidity flows into the earphone.
Although exemplary embodiments of the present invention have been described above, it will be understood by one of ordinary skill in the art that modifications of the present invention may be made without departing from the essential features of the present invention. Therefore, the disclosed embodiments should be considered not in a limited view but in a descriptive view. The scope of the present invention will be shown in the claims not in the above description, and all differences within an equivalent range thereof should be interpreted as being included in the present invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2020-0011857 | Jan 2020 | KR | national |
