Information
-
Patent Grant
-
6691832
-
Patent Number
6,691,832
-
Date Filed
Thursday, May 9, 200223 years ago
-
Date Issued
Tuesday, February 17, 200422 years ago
-
Inventors
-
Original Assignees
-
Examiners
Agents
-
CPC
-
US Classifications
Field of Search
US
- 181 153
- 181 148
- 181 154
- 181 157
- 181 165
- 181 168
- 181 169
-
International Classifications
-
Abstract
The diaphragm is supported by the frame at the outer edge thereof. The pair of terminal members is mounted on the frame, and a pair of lead wire drawn from the voice coil is fixed to the land portion of the terminal member for electrical continuity. Since the land portion is disposed on the upper side of the frame, fixation of the lead wire can be performed without turning the frame upside down. This simplifies the manufacturing process of the speaker and also prevents a breakage of the lead wire that conventionally happens when the frame is turned upside down. Further, this prevents the operator from touching the lead wire since no part of the lead wire is exposed outside the frame after the fixation.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a dynamic speaker, particularly to a structure of fixing a lead wire of a voice coil.
2. Description of the Related Art
A dynamic speaker is conventionally known among the types of a speaker. As shown JP-A-6-178390, a dynamic speaker comprises a diaphragm having a voice coil attached on the lower surface, and a frame disposed on the lower side of the diaphragm and adapted to support the diaphragm at the periphery thereof. A pair of lead wires drawn from the voice coil is fixed to a pair of terminal members mounted on the lower side of the frame by soldering or other means.
The manufacturing process of the conventional dynamic speaker is described. The voice coil is attached to the diaphragm, the diaphragm is bonded to the frame with the lead wires drawn outside the diaphragm and the frame, the assembly of the diaphragm, the voice coil and the frame is turned upside down, and the leading ends of the lead wires are fixed to the terminal members.
Conventionally, the manufacturing process is complicated since the assembly of the diaphragm, the voice coil and the frame needs to be turned. upside down.
Further, when the assembly is turned upside down, the leading ends of the lead wires are free, therefore, there is a risk of a breakage of wire.
Further, after the lead wire is fixed to the terminal member, part of the lead wire is exposed outside the frame so that the operator may touch the wire, possibly also causing a breakage of wire. The conventional speaker therefore requires a protection against such unintentional breakage.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a speaker which simplifies the manufacturing process and prevents a breakage of the lead wire.
The speaker of the present invention achieves the object by providing a land portion of the terminal member on the upper side of the frame.
A speaker of the present invention comprises:
a diaphragm;
a voice coil attached to the lower surface of the diaphragm;
a frame disposed on the lower side of the diaphragm and supporting the diaphragm at the outer edge thereof and
a pair of terminal member mounted on the frame and having a portion where a pair of lead wire drawn from the voice coil is fixed;
wherein the portion is disposed on the upper side of the frame.
The words such as “lower” and “upper” are used for the purpose of explanation to clarify the positional relationship of the members. The actual direction or orientation of the speaker when operated is not thereby limited.
Any type of “diaphragm” and “voice coil” may be used as far as applicable as an element of a dynamic speaker.
Any type of “terminal member” may be used as far as the portion is made of conductive material and disposed on the upper side of the frame.
The lead wire is fixed to the portion of the terminal member for electrical connection. Any type of fixing method is applicable such as soldering and thermo-compression bonding.
According to the speaker of the present invention, the frame is disposed on the lower side of the diaphragm, the diaphragm is supported by the frame at the periphery, the pair of terminal member is mounted on the frame, and a pair of lead wire drawn from the voice coil is fixed and electrically connected to the land portion of the terminal member. Since the land portion of the terminal member is disposed on the upper side of the frame, fixation of the lead wire can be performed without turning the frame upside down.
This simplifies the manufacturing process of the speaker and also prevents a breakage of the lead wire that conventionally happens when the frame is turned upside down. Further, this prevents the operator from unintentionally touching the lead wire since no part of the lead wire is exposed outside the frame after the fixation.
According to this invention, the manufacturing process is simplified and a breakage of wire is prevented.
The land portion may be plate-shaped and provided along the upper side of the frame. The lead wire may be fixed to the land portion by thermo-compression bonding method. This eliminates a conventional soldering process and contributes to an environmental lead-free structure. This effectively reduces a space for fixation since a space for solder spot is not required. Continuity failure is also considerably lessened since this method provides more reliable continuity.
The “thermo-compression bonding” is a method applying heat and pressing force. Any type of heating method may be used as far as it melts the insulation coating of the lead wire so that the exposed core of the wire may be pressed against the land portion of the terminal member by pressing force. For example, the following three methods are applicable: 1) supplying current between the lead wires; 2) supplying current between the terminal member and a thermo-compression bonding jig holding the lead wire; and 3) pre-heating the jig and pressing the heated jig against the lead wire.
The placement of the land portion is not limited as far as it is located on the upper side of the frame. The land portion is preferably disposed inside the outer edge of the diaphragm. In this case, the diaphragm provides protection for the lead wire fixed on the land portion. Further, the external shape of the speaker may be designed to that of the diaphragm so as to obtain a compact sized speaker.
Any material may be used for the “frame”. If the frame is made of insulating material, the terminal member may be directly mounted on the frame without applying an insulating coating on the surface of the frame.
The frame may be molded of synthetic resin and the terminal member may be integrally formed with the frame by insert molding. This improves the mounting strength of the terminal member, and enables part of the terminal member to be easily protruded outside the speaker.
The upper surface of the land portion may be placed lower than the upper end of the voice coil. Then, the lead wire may be traveled enough away from the diaphragm. This prevents the lead wire from interfering with the diaphragm during an operation of the speaker, thereby preventing an occurrence of abnormal sound. A breakage of wire due to the interference is also prevented and therefore the durability of the speaker is improved. Degree of freedom in designing the diaphragm, especially the cross-sectional shape thereof, is also enhanced.
The difference in height between the upper surface of the land portion and the upper end of the voice coil may be varied to the size of the speaker and the cross-sectional shape of the diaphragm. Preferably, the difference is 0.1 mm or more. More preferably, it is 0.2 mm or more.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1
is a sectional view of a speaker of the present invention facing upward as seen in the drawing
FIG. 2
is a plan view of the speaker.
FIG. 3
is a bottom view of the speaker.
FIG. 4
is an exploded sectional view of the speaker.
FIG. 5
is a plan view of a frame subassembly with a diaphragm mounted thereon.
FIG. 6
is a plan view of the frame subassembly and the diaphragm separately.
FIG. 7
is a sectional view of the VII—VII line in FIG.
5
.
FIG. 8
is a sectional view of the VIII—VIII line in FIG.
6
.
FIG. 9
is a detailed drawing of the IX part in
FIG. 6
comprising FIG.
9
(
a
) showing a thermo-compression bonding and FIG.
9
(
b
) showing an overcoat.
FIG. 10
is a sectional view of the X—X line in FIG.
9
(
a
).
FIG. 11
is a plan view of a speaker of another embodiment.
FIG. 12
is a bottom view of the speaker of FIG.
11
.
FIG. 13
is a detailed drawing of part of FIG.
11
.
DETAILED DESCRIPTION OF THE INVENTION
The present invention will be described below in detail with reference to the accompanying drawings.
FIG. 1
is a sectional view of a speaker
10
of the present invention facing upward as seen in the drawing.
FIGS. 2
,
3
, and
4
are a plan view, a bottom view, and an exploded sectional view respectively showing the speaker
10
. For the purpose of explanation only, the right hand of the speaker
10
is referred to as the “front”, the left hand is the “rear”, the cover
16
side is the “upper”, and the magnetic circuit unit
18
side is the “lower”.
As shown in these drawings, the speaker
10
is a small dynamic speaker (of an outer diameter of approximately 17 mm) which is mounted in, for example, a mobile phone.
The speaker
10
comprises a frame subassembly
12
, a diaphragm
14
and a cover
16
respectively mounted on the upper side of the frame subassembly
12
, and a magnetic circuit unit
18
mounted on the lower side of the frame subassembly
12
.
FIG. 5
is a plan view showing the frame subassembly
12
having the diaphragm
14
mounted thereon (the cover
16
and the magnetic circuit unit
18
are not mounted).
FIG. 6
is a plan view showing the frame subassembly
12
and the diaphragm
14
separately.
FIG. 7
is a sectional view of the VII—VII line in FIG.
5
.
FIG. 8
is a sectional view of the VIII—VIII line in FIG.
6
.
As shown in these drawings, the frame subassembly
12
comprises a frame
20
, a pair of terminal members
22
and a voice coil
24
.
The frame
20
is made of polyamide resin by injection molding. There is formed at the center of the frame
20
a circular opening
20
a
of a larger diameter than the voice coil
24
. The frame
20
further comprises an annular bottom
20
A surrounding the circular opening
20
a
and a circumferential wall
20
B extending upward from the outer edge of the annular bottom
20
A. At the inner side of the wall
20
B, there is formed an annular stepped portion
20
C which is higher than the annular bottom
20
A. A pair of terminal support portions
20
D is formed in the frame
20
at the rear corners behind the wall
20
B.
There are circumferentially formed twelve circular holes
20
b
in the annular bottom
20
A at given intervals. The wall
20
B has a notched portion
20
c
at the front thereof and a pair of guide grooves
20
d
(described later) at the inner side of the pair of terminal support portions
20
D. The notched portion
20
c
is coplanar with the upper surface of the stepped portion
20
C. The pair of guide grooves
20
d
is coplanar with the upper surface of the annular bottom
20
A.
The pair of terminal members
22
is made of phosphor bronze by pressing or bending, and integrally formed with the frame
20
by insert molding. Each terminal member
22
is partially embedded in the terminal support portion
20
D; comprising a plate spring
22
A projecting rearward from the rear surface of the terminal support portion
20
D and a land portion
22
B (a portion for electrical continuity) extending along the upper surface of the annular bottom
20
A into the inner side of the wall
20
B.
The plate spring
22
A is bent downward in the shape of a letter “U” and extended forward in an oblique manner below the lower surface of the annular bottom
20
A. The leading end of the plate spring is slightly bent upward, and a conical downward projection
22
a
is provided around the leading end. The plate spring
22
A is initially straight and later bent downward in the shape of a letter “U” after the diaphragm
14
, the cover
16
, and the magnetic circuit unit
18
are mounted on the frame subassembly
12
and the magnetic circuit unit
18
is magnetized.
The upper surface of the land portion
22
B is coplanar with the upper surface of the annular bottom
20
A. The land portion
22
B is extended to the outer side of the wall
20
B via each guide groove
20
d
toward the vicinity of the rear end of the terminal support portion
20
D. Such extension of the land portion
22
B to the outer side of the wall
20
B is not necessarily required.
The voice coil
24
is disposed in the circular opening
20
a
with the upper end being coplanar with the upper surface of the stepped portion
20
C. A pair of lead wire
26
drawn from the upper end of the voice coil
24
is guided toward the land portion
22
B of the pair of terminal member
22
. The lead wire
26
is fixed to the land portion
22
B at the portion near the leading end thereof by thermo-compression bonding (described later) and thereby they are electrically connected.
Since the upper surface of the land portion
22
B is placed lower than the upper end of the voice coil
24
, the lead wire
26
is angled down toward the rear. In this embodiment, the upper surface of the land portion
22
B is lower than the upper end of the voice coil
24
by approximately 0.4 to 0.5 mm.
The lead wire
26
is first directed sideways and then re-directed toward the rear. This structure guarantees an enough length of the lead wire
26
in case the voice coil
24
is moved up and down, and also allows the path of the lead wire
26
to be easily defined.
The diaphragm
14
is made of polyether-imide (PET) film by thermal press molding, having a plurality of irregularity concentric to each other. There are formed a circumferential flat portion
14
a
(outer edge) and an intermediate flat portion
14
b
. They are annular flat surfaces on the same horizontal plane. The diaphragm
14
is bonded to the upper surface of the stepped portion
20
C at the circumferential flat portion
14
a
and bonded to the upper end of the voice coil
24
at the intermediate flat portion
14
b.
The bonding of the diaphragm
14
is being described. First, adhesive is applied to the upper surface of the stepped portion
20
C and the lower surface of the intermediate flat portion
14
b
respectively, second the diaphragm
14
is placed on the frame
20
, and then visible light is irradiated at the contact surfaces from above. Applied adhesive is thereby hardened.
The cover
16
is made of stainless steel by press molding, comprising a circular top surface
16
A having a plurality of sound emitting holes
16
a
formed at given positions thereon, a short cylindrical portion
16
B extending downward from the outer edge of the circular top surface
16
A, and an annular flange portion
16
C radially extending outward from the bottom end of the cylindrical portion
16
B. The cover
16
is bonded to the upper surface of the circumferential flat portion
14
a
and the stepped portion
20
C at the flange portion
16
C.
The magnetic circuit unit
18
comprises a steel base
28
, a magnet
30
, and a steel yoke
32
.
The base
28
has the shape of a bottomed cylinder. An annular stepped portion
28
a
is formed at the upper circumference thereof. The magnet
30
and the yoke
32
has the shape of a disk respectively and placed and bonded in this order on the bottom of the base
28
so as to be concentric to each other. A cylindrical gap is thereby formed between the outer surface of the yoke
32
and the inner surface of the base
28
, having the same width over the entire circumference so as to accommodate a lower portion of the voice coil
24
in the gap.
The magnetic circuit unit
18
is mounted on the frame
20
in the following manner. The annular stepped portion
28
a
of the base
28
is fitted into the circular opening
20
a
of the frame
20
, and then adhesive is applied around the joint portion of the outer surface of the base
28
and the lower surface of the annular bottom
28
A.
There are twelve circular holes
20
b
formed on the annular bottom
20
A. Two of them
20
b
are located below the land portions
22
B and each having an upper end closed by the land portion
22
B. Each of the other holes
20
b
is a through hole penetrating the annular bottom
20
A serving as an escape for any pressure generated in the space formed by the diaphragm
14
, the frame
20
and the magnetic circuit unit
18
when the diaphragm
14
is vibrated. The pair of hole
20
b
located below the land portions
22
B is formed by an insert holding member set in a mold when the frame
20
is formed by injection molding. The insert holding member holds and positions the terminal member
22
in a predetermined position in the mold.
The terminal supporting portion
20
D of the frame
20
has a notched portion
20
e
on the upper surface and a circular hole
20
f
on the lower surface. The notched portion
20
e
and the circular hole
20
f
are also formed by the insert holding member when the frame
20
is formed by injection molding.
As described above, the lead wire
26
is thermo-compression bonded to the land portion
22
B and thereby they are electrically connected. A thermo-compression bonded portion
26
a
of the lead wire
26
is covered by an overcoat
36
.
FIG.
9
(
b
) is a detailed drawing of the IX part in FIG.
6
. FIG.
9
(
a
) shows the thermo-compression bonded portion
26
A before the overcoat
36
is applied.
FIG. 10
is a sectional view of the X—X line in FIG.
9
(
a
).
The method of the thermo-compression bonding is being described referring to the left-hand lead wire
26
.
As shown in FIGS.
9
(
a
) and
10
, a metal pin or a supporting jig
4
is inserted from under the circular hole
20
b
until the leading end of the jig
4
abutting a target position on the back surface of the land portion
22
B. The lead wire
26
(a long wire before finally cut) is guided along the groove
20
d
so as to pass the target position. Another metal pin or a thermo-comression bonding jig
2
is lowered from above the target position until it presses the lead wire
26
against the land portion
22
B by a predetermined force. While the lead wire
26
is pressed by the thermo-compression bonding jig
2
, an instant energization (approximately 20 to 30 msec) is applied between the thermo-compression bonding jig
2
and the supporting jig
4
. Joule heat generated there amounts to 600 degrees centigrade or more to melt an insulation coating of the lead wire
26
. The lead wire
26
is fixed to the land portion
22
B with the exposed core being pressed against the land portion
22
B.
After completion of the thermo-comression bonding, the leading portion of the lead wire
26
beyond the thermo-compression bonded portion
26
a
is cut off.
Generated heat is immediately transmitted from the land portion
22
B to the supporting jig
4
of higher conductivity than the frame
20
. This prevents melting of the frame
20
, particularly the area around the land portion
22
B. Since the thermo-compression bonding jig
2
is stopped by the supporting jig
4
, the land portion
22
B is prevented from sinking in the frame
20
even when pressing force is applied from the thermo-compression bonding jig
2
.
As shown in
FIG. 8
, the guide groove
20
d
formed in the frame
20
has tapered side surfaces
20
d
1
and
20
d
2
so that the groove
20
d
has the entire shape of a letter of “Y” as seen from the rear. This structure allows the lead wire
26
to be easily guided in the groove
20
d.
The thermo-compression bonded portion
26
a
is deformed to be substantially flat compared to the other general portions of the lead wire
26
. The thermo-compression bonded portion
26
a
and the neighborhood suffers degradation such as deterioration of the core and lower tensile strength. A general portion
26
b
of the lead wire
26
which is nearer to the voice coil
24
than the thermo-compression bonded portion
26
a
is moved up and down in accordance with the movement of the voice coil
24
. Therefore, an intervening portion
26
c
connecting the general portion
26
b
and the thermo-compression bonded portion
26
a
is subjected to stress concentration due to such repeated bending load, and the lead wire
26
is easy to be broken at the intervening portion
26
c.
In this embodiment, the intervening portion
26
c
and the neighborhood is covered by the overcoat
36
to guard against stress concentration. Adhesive applied on the intervening portion
26
c
is hardened by ultraviolet irradiation so as to serve as the overcoat
36
.
As shown in
FIG. 2
, an overcoat
38
is applied on a plate portion of the land portion
22
B extended to the rear side of the wall
20
B via each guide groove
20
d
after the diaphragm
14
and the cover
16
is mounted on the frame subassembly
12
. The pair of guide groove
20
d
is thereby closed.
As described above, according to the speaker
10
of the present invention, the frame
20
is disposed on the lower side of the diaphragm
14
, the diaphragm
14
is supported by the frame
20
at the circumferential flat portion
14
a
, the pair of terminal members
22
is mounted on the frame
20
, and a pair of lead wire
26
drawn from the voice coil
24
is fixed to the land portion
22
B of the terminal member. Since the land portion
22
B is disposed on the upper side of the frame
20
, fixation of the lead wire
26
can be performed without turning the frame
20
upside down.
This simplifies the manufacturing process of the speaker
10
and also prevents a breakage of the lead wire
26
that conventionally happens when the frame
20
is turned upside down. Further, this prevents the operator from touching the lead wire
26
after the fixation of wire since no part of the lead wire
26
is exposed outside the frame
20
.
According to this invention, the manufacturing process is simplified and a breakage of the lead wire is prevented.
In this embodiment, the lead wire
26
is fixed to the terminal member
22
by thermo-compression bonding method. This eliminates a conventional soldering process and contributes to an environmental lead-free structure. This effectively reduces a space for fixation since a space for solder spot is not required. Continuity failure is also considerably lessened since this method provides more reliable continuity.
Since the land portion
22
B is disposed inside the circumferential flat portion
14
a
of the diaphragm
14
, the lead wire
26
fixed on the land portion
22
B is protected by the diaphragm
14
. Further, the external shape of the speaker
10
may be designed to that of the diaphragm
14
so as to obtain a compact sized speaker.
In this embodiment, the frame
20
is molded of synthetic resin, and the pair of terminal member
22
is integrally formed with the frame
20
by insert molding. This improves the mounting strength of the terminal member
22
, and enables the plate spring
22
A of the terminal member
22
to be easily protruded outside the speaker
10
.
Since the upper surface of the land portion
22
B is placed lower than the upper end of the voice coil
24
by approximately 0.4 to 0.5 mm, the lead wire
26
can be traveled enough away from the diaphragm
14
. This prevents the lead wire
26
from interfering with the diaphragm
14
during an operation of the speaker, thereby preventing an occurrence of abnormal sound. A breakage of wire due to the interference is also prevented and therefore the durability of the speaker
10
is improved. Degree of freedom in designing the diaphragm
14
, especially the cross-sectional shape thereof, is also enhanced.
Another embodiment of the invention is described below.
FIGS. 11 and 12
are a plan view and a bottom view respectively of the speaker
50
of the another embodiment.
FIG. 13
is a detailed drawing of part of FIG.
11
.
As shown in these drawings, the speaker
50
is a smaller dynamic speaker (of an outer diameter of approximately 13 mm) than the speaker
10
. The structure of the speaker
50
is the same as that of the speaker
10
except that the land portion
22
B is disposed outside the circumferential flat portion
14
a
of the diaphragm
14
.
An overcoat
52
is applied on the thermo-compression bonded portion
26
a
of the lead wire
26
and guide grooves
20
d
are covered by the overcoat
52
. A pair of notched portion
20
g
is formed on the back surface of the frame
20
to expose the land portion
22
B to the back space of the frame
20
.
The land portion
22
B of the terminal member
22
is also disposed on the upper surface of the frame
20
in this another embodiment, therefore the manufacturing process is simplified and a breakage of the lead wire is prevented.
Claims
- 1. A speaker comprising:a diaphragm; a voice coil attached to a lower surface of the diaphragm; a frame disposed on the lower surface of the diaphragm and supporting the diaphragm at an outer edge thereof; and a pair of terminal members mounted on the frame and having a portion where a pair of lead wires drawn from the voice coil is fixed to the pair of terminal members; wherein the pair of lead wires is disposed only on an upper side of the frame, and the portion where the pair of lead wires is fixed is disposed on the upper side of the frame.
- 2. The speaker as claimed in claim 1, wherein the portion of each terminal member has the shape of a plate extending along the upper surface of the frame, and each lead wire is fixed on the portion by thermo-compression bonding.
- 3. The speaker as claimed in claim 1, wherein the portion of each terminal member is disposed inside the outer edge of the diaphragm.
- 4. The speaker as claimed in claim 2, wherein the portion of each terminal member is disposed inside the outer edge of the diaphragm.
- 5. The speaker as claimed in claim 1, wherein the frame is molded of synthetic resin and the each terminal member is integrally formed with the frame by insert molding.
- 6. The speaker as claimed in claim 2, wherein the frame is molded of synthetic resin and the each terminal member is integrally formed with the frame by insert molding.
- 7. The speaker as claimed in claim 3, wherein the frame is molded of synthetic resin and the each terminal member is integrally formed with the frame by insert molding.
- 8. The speaker as claimed in claim 2, wherein the upper surface of the portion is positioned lower than the upper end of the voice coil.
- 9. The speaker as claimed in claim 4, wherein the upper surface of the portion is positioned lower than the upper end of the voice coil.
- 10. The speaker as claimed in claim 6, wherein the upper surface of the portion is positioned lower than the upper end of the voice coil.
Priority Claims (1)
| Number |
Date |
Country |
Kind |
| P. 2001-154598 |
May 2001 |
JP |
|
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| Number |
Name |
Date |
Kind |
|
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Soma |
Dec 1982 |
A |
|
5984859 |
Lesinski |
Nov 1999 |
A |
|
6371241 |
Yamada et al. |
Apr 2002 |
B1 |
|
6484844 |
Sugiyama et al. |
Nov 2002 |
B2 |