This disclosure is directed to split jack assemblies and methods for making the same.
Electronic devices may include jacks into which plugs may be inserted. The jack can include a number of contacts that come into contact with the plug when it is inserted into the jack. When inserted, signals can be transmitted between the plug and the jack. For example, an electronic device can generate audio signals that are provided from the jack to the plug, or the jack can receive microphone signals from the plug. As the size of electronic devices continue to shrink, and more features requiring more circuitry are incorporated therein, an ever increasing premium is made on space. Since the jack is often a necessary component included in electronic devices, there is a need for jacks having a reduced footprint.
This disclosure is directed to split jack assemblies and methods for making the same. Split jack assemblies according to embodiments of the invention are constructed with a tubeless pin block. Elimination (or split) of the tube, or more particularly, a tube that is an integrally formed part of the pin block form the pin block allows for the use of a tubeless pin block design that results in a jack assembly having smaller overall dimensions than a conventional jack assembly constructed to accommodate a plug of the same dimensions. The tubeless pin block can be used in conjunction with a tube sleeve or with a curved surface of a housing for an electronic device, or both to provide a plug receptacle region of the split jack assembly.
The above and other objects and advantages of the invention will be apparent upon consideration of the following detailed description, taken in conjunction with the accompanying drawings, in which like reference characters refer to like parts throughout, and in which:
Split jack assemblies according to various embodiments are constructed with a tubeless pin block. Elimination (or split) of the tube, or more particularly, a tube that is an integrally formed part of the pin block form the pin block allows for the use of a tubeless pin block design that results in a jack assembly having smaller overall dimensions than a conventional jack assembly constructed to accommodate a plug of the same dimensions. The tubeless pin block can be used in conjunction with a tube sleeve or with a curved surface of a housing for an electronic device, or both to provide a plug receptacle region of the split jack assembly.
Referring to
Split jack assembly 200 eliminates the integrated housing of assembly 100, and as a result, is able to reduce its footprint, compared to assembly 100. The reduced footprint can be realized in that the separate pin block 210 and tube 220 construction allows for a thinner housing 250 in the z-height than housing 150. The two part construction of assembly 200 does not require pin block to envelope tube 220, thus eliminating the minimum thickness requirement needed to form tube 110.
Referring briefly to
Block 210 can include tube-stop abutting member 212, which can provide an anchor point for tube 220 if tube 220 is fixed to block 210. Retention pin 232 can hold a plug (not shown) in place when it is inserted into the split jack assembly.
Referring now to
Referring back to
Jack assembly 200 can be positioned adjacent to a side of housing 250. In some embodiments, block 210, tube 220, or both may be secured to housing 250 using glue, adhesive, or other suitable bonding agent or technique. Use of glue, for example, can assist in enhanced strength of jack assembly 200 and can help eliminate ingress of water or debris into the housing 250. Housing 250 can be any multi-walled structure that encloses various components of an electronic device. Some of the walls may be curved, as shown. In particular, side wall 253 is curved and can be integrally formed with first surface member 251 and second surface member 252. The interior surface of sidewall 253 can be curved according to a predetermined radius. Moreover, in some embodiments, the interior surface may be dimensioned so that tube 220 fits snuggly against it when jack assembly 200 is installed in housing 250. In other embodiments, the interior surface of housing 250 may be dimensioned to accommodate a tubeless design (as shown in
The wall thickness of side wall 253 relative to wall thickness of tube 220 may be substantially greater. For example, the wall thickness of side wall 253 may be 2-10 times greater than the wall thickness of tube 220. Enhanced wall thickness may be necessary because it bears some the lateral load exerted by the plug as it is inserted and retained within jack assembly 200.
In some embodiments, depending on the material composition of housing 550, an insulation layer may be applied to inner surface 553. If housing is constructed from metal, the insulation layer will prevent shorts when the plug is inserted. If an insulation layer is applied, then the dimensions of the inner surface are made so that the desired diameter is obtained for the plug receptacle.
The insulation layer may be constructed from any suitable material and applied using any suitable process. For example, a material may be applied using spraying, painting, plasma vapor deposition (PVD), chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD), UV curing, high bake curing, thin tube extrusion (e.g., coupled to the housing an adhesive, tape, bonding, or press fit), oxidation, electrolytic deposition, electrostatic deposition, plasma electrolytic oxide (PEO) process, a thermal spray coating, or any other suitable process. Different materials may be used for each of the processes, including for example polyetheretherketone (PEEK), alumina, nitride (e.g., aluminum titanium nitride or silicon nitride), polyphenyl ether (PPE), diamond-like carbon coating (DLC), a plastic, polymer, composite material, or any other suitable material. In some embodiments, thin tube extrusion (e.g., using PEEK), coatings applied by oxidation of the base metal (e.g., oxidation of the housing metal around the periphery of the port), or electrostatic deposition of ceramic coatings may provide adequate insulation on inner surface 653.
The material and process may be selected based on any suitable criteria. In particular, the material may be selected to be isolating (e.g., otherwise, it does not reduce undesired contacts between the connector and housing). Other criteria may include, for example, selecting the material and process based on the appearance of the resulting layer or film (e.g., select a material that is substantially clear or transparent, or a material that is substantially the same color as the housing). As another example, the material and process may be selected based on resistance to cracking, abrasive wear, or other failure (e.g., select a material and process that provide a layer operative to resist to a particular number of cycles of placing and removing a connector within the connector housing, or pulling a connector against the edges of the housing port). As still another example, the material and process may be selected for its applicability to different geometries (e.g., select a process and material that may be applied to ports in flat housings and curved housings).
The tube can be secured to the pin block by being inserted into the housing and rotated such that the spring-loaded pins protrude through their respective holes in the tube. The tube may also be inserted into the housing until it abuts a tube-stop abutting member.
It is understood that the interlocking features can be reversed. For example, the slot can exist on the tube and the tab member can exist in the pin block. As another example, the channels can exist on the tube and the ribs can exist on the pin block.
Referring specifically to
It is understood that the tab member and slot can be reversed. For example, the tube can include a tab member operative to fit into a slot contained in the curved member.
The above described embodiments of the invention are presented for purposes of illustration and not of limitation, and the present invention is limited only by the claims which follow.
This application claims the benefit of U.S. Non-Provisional application Ser. No. 13/631,553 filed Sep. 28, 2012, U.S. Provisional Application No. 61/553,109, filed Oct. 28, 2011, and U.S. Provisional Application No. 61/555,131, filed Nov. 3, 2011, the disclosures of which are incorporated by reference herein in their entireties.
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Parent | 13631553 | Sep 2012 | US |
Child | 14185133 | US |