Patent Grant
11786929
This application claims priority to and the benefit of Korean Patent Application No. 10-2021-0066425 filed in the Korean Intellectual Property Office on May 24, 2021, the entire contents of which are incorporated herein by reference.
The present disclosure relates to a spray coater for forming a thin film by using a spray coating method and a thin-film transistor manufactured by using the same.
A spray coater refers to an apparatus for performing a coating process using a spray and is equipped with a system configured to convert a coating liquid into mist in the form of fog and apply the mist onto a surface of a target substrate. As the spray coater system is advanced and diversified, the spray coater system may be used for various purposes such as a process of coating a single sheet of thin film such as a transparent conductive film for a touch panel and a process of applying a photoresist onto a semiconductor or a member for a solar cell.
The spray coater system is economical because the spray coater system may adjust a desired thickness even though the spray coater system sprays a small amount of coating liquid. The spray coater system is characterized by being capable of applying the coating liquid with a uniform thickness onto a surface of a substrate having a level difference, unevenness, and a curved portion, easily forming a thin film on quadrangular and polygonal substrate, and performing a coating process even on a cylindrical substrate.
However, a process of loading and unloading a target substrate is manually performed, which causes a problem in that a working speed is low or precise control cannot be performed. In addition, there is a problem in that it is necessary to set different chamber environments having different process conditions and use different types of materials in order to sequentially form a plurality of films, which is made of different materials, on a target substrate.
The above information disclosed in this Background section is only for enhancement of understanding of the background of the invention, and therefore it may contain information that does not form the prior art that is already known in this country to a person of ordinary skill in the art.
The present disclosure has been made in an effort to provide a spray coater which may load and unload a target substrate by using an automatic control method and be suitable for sequentially forming a plurality of films using a plurality of materials.
However, the object to be achieved by the embodiments of the present invention is not limited to the above-mentioned object but may be variously expanded without departing from the technical spirit of the present invention.
An exemplary embodiment of the present invention provides a spray coater including a spray nozzle unit having at least one spray nozzle and configured to spray a coating material, a spray nozzle transfer unit configured to control a position of the spray nozzle unit by operating a transfer block, on which the spray nozzle unit is mounted, at least in a planar direction, a substrate seating unit positioned below the spray nozzle unit and configured such that a substrate, which is subjected to coating, is seated thereon, a substrate carrier configured to accommodate the substrate before the substrate is coated and accommodate the substrate after the substrate is coated, and a robot arm configured to unload the substrate from the substrate carrier and provide the substrate to the substrate seating unit before the substrate is coated or unload the substrate from the substrate seating unit and load the substrate on the substrate carrier after the substrate is coated.
The substrate seating unit may further include: a vertical movement holder configured to move the substrate in a vertical direction while moving upward or downward; and a support plate configured to support a lower part of the substrate.
The vertical movement holder may include: a holder body configured to move at least in the vertical direction below the spray nozzle unit; and a pair of holder arms extending from the holder body and configured to seat the substrate on the support plate or move the substrate upward.
The holder arm may extend in a direction parallel to an edge of the support plate.
The holder arm may include: a lower part support portion configured to support the lower part of the substrate; and a lateral part support portion configured to support a lateral part of the substrate.
The pair of holder arms may include a pair of lower part support portions, and a distance between the pair of lower part support portions may be larger than a horizontal width of the support plate.
The spray coater may further include a heating plate further including a temperature control means.
The heating plate may be configured to maintain a temperature of the substrate within a range of 300 to 500° C.
The robot arm may include a horizontal articulated robot.
The spray coater may include: a spray chamber configured to accommodate the spray nozzle unit, the spray nozzle transfer unit, and the substrate seating unit; and a load-lock chamber configured to accommodate the robot arm, in which the spray chamber and the load-lock chamber communicate with each other through a chamber gate which is openable and closable.
The load-lock chamber may be configured to accommodate the substrate carrier.
The spray chamber may include a plurality of sub-spray chambers disposed adjacent to one another and closed from one another, and each of the plurality of sub-spray chambers may be configured to accommodate the spray nozzle unit, the spray nozzle transfer unit, and the substrate seating unit.
Each of the plurality of sub-spray chambers may communicate with the load-lock chamber through a chamber gate which is openable and closable.
The spray chamber and the load-lock chamber may each include an atmospheric pressure environment, a nitrogen (N2) environment, or a vacuum environment.
A precursor solution, which is injected into the spray nozzle unit, may contain ammonium acetate (CH3CO2NH4).
The spray coater may further include a precursor refining unit configured to refine a precursor used for spray coating.
The precursor may be a nitride-based precursor (M(NO3)), an acetylacetonate-based precursor (M(CH3COCH2COCH3)), or an acetate-based precursor (M(CH3COO−)), or ammonium acetate may be added to the precursor.
Here, M is an abbreviation of metal and includes one or more selected from a group consisting of In, Zn, Ga, and Tin.
A concentration of the precursor may be 0.2 M or less.
The spray coater may further include a plasma treatment unit disposed adjacent to the load-lock chamber and configured to perform UV/O3 or Ar/O2 plasma treatment.
A thin-film transistor for an oxide semiconductor according to another embodiment may be manufactured by using the spray coater.
The manufactured oxide semiconductor thin-film transistor may contain at least one of IGZO (Indium Gallium Zinc Oxide), IGTO (Indium Gallium Tin Oxide), ITZO (Indium Tin Zinc Oxide), IGZTO (Indium Gallium Zinc Tin Oxide), and IGO (Indium Gallium Oxide).
In the manufactured oxide semiconductor thin-film transistor, an oxide insulating layer containing at least one of SiO2 (Silicon Dioxide), SiNx (Silicon Nitride), ZrOx (Zirconium Oxide), AlOx (Aluminum Oxide), and ZrAlOx (Zirconium Aluminum Oxide) is used as a gate insulating layer or a TFT (Thin-Film Transistor) protective layer.
A method of manufacturing a thin film according to still another embodiment may manufacture a ferroelectric HZO (HfZrO) (Hafnium Zirconium Oxide) thin film or a ZrOx (Zirconium Oxide), AlOx (Aluminum Oxide), and ferroelectric ZrOx/HZO/AlOx thin film by using the spray coater.
The spray coater according to the embodiments may load and unload a target substrate by using an automatic control method by using the robot arm.
In addition, the spray coater may have the plurality of spray chambers, and the plurality of spray chambers may independently perform the coating processes, such that the spray coater may sequentially form the plurality of films on the target substrate by using the plurality of materials.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those with ordinary skill in the art to which the present invention pertains may easily carry out the embodiments. In the drawings, a part irrelevant to the description will be omitted to clearly describe the present invention, and the same or similar constituent elements will be designated by the same reference numerals throughout the specification. Some constituent elements in the accompanying drawings are illustrated in an exaggerated or schematic form or are omitted. A size of each constituent element does not entirely reflect an actual size.
In addition, it should be interpreted that the accompanying drawings are provided only to allow those skilled in the art to easily understand the embodiments disclosed in the present specification, and the technical spirit disclosed in the present specification is not limited by the accompanying drawings, and includes all alterations, equivalents, and alternatives that are included in the spirit and the technical scope of the present invention.
The terms including ordinal numbers such as ‘first’, ‘second’, and the like may be used to describe various constituent elements, but the constituent elements are not limited by the terms. These terms are used only to distinguish one constituent element from another constituent element.
In addition, when one component such as a layer, a film, a region, or a plate is described as being positioned “above” or “on” another component, one component can be positioned “directly on” another component, and one component can also be positioned on another component with other components interposed therebetween. On the contrary, when one component is described as being positioned “directly on” another component, there is no component therebetween. In addition, when a component is described as being positioned “above” or “on” a reference part, the component may be positioned “above” or “below” the reference part, and this configuration does not necessarily mean that the component is positioned “above” or “on” the reference part in a direction opposite to gravity.
Throughout the specification, it should be understood the terms “comprises,” “comprising,” “includes,” “including,” “containing,” “has,” “having” or other variations thereof are inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof. Therefore, unless explicitly described to the contrary, the word “comprise/include” and variations such as “comprises/includes” or “comprising/including” will be understood to imply the inclusion of stated elements, not the exclusion of any other elements.
In addition, throughout the specification, when one constituent element is referred to as being “connected to” another constituent element, one constituent element can be “directly connected to” the other constituent element, and one constituent element can also be “indirectly connected to,” “physically connected to,” or “electrically connected to” the other element with other elements therebetween. Further, the constituent elements are defined as different names according to positions or functions thereof, but the constituent elements may be integrated.
Referring to
The spray nozzle unit 120 may have at least one spray nozzle 121, and the spray nozzle 121 may be inserted into and fixed to a nozzle holder 123. In addition, the spray nozzle 121 may be supplied with a coating material required for coating through a material supply pipe 126 connected to a coating material storage container (not illustrated).
The spray nozzle transfer unit 130 includes a first transfer block 131 on which the spray nozzle unit 120 is mounted. For example, the spray nozzle unit 120 may be mounted on the first transfer block 131 as the nozzle holder 123 is fixed to the first transfer block 131. The first transfer block 131 may be controlled to reciprocatingly move in a first direction (a y-axis direction in the drawings) along a guide rail provided on a second transfer block 134. In addition, the second transfer block 134 is elongated in the first direction, and third transfer blocks 135 are provided below two opposite ends of the second transfer block 134, respectively. Therefore, the second transfer block 134 may be controlled to reciprocatingly move in a second direction (an x-axis direction in the drawings) along guide rails provided on the base stage. Therefore, a position of the spray nozzle unit 120, which is required for the coating process, may be controlled as the spray nozzle unit 120 is operated at least in a planar direction (on a x-y plane in the drawings) by the transfer blocks 131, 134, and 135. In addition, the spray nozzle unit 120 may be moved in a vertical direction (a z-axis direction in the drawings) by a user, such that a distance between the substrate 20 and the spray nozzle 121 may be optionally adjusted.
The substrate seating unit 140 may be configured such that a substrate 20, which is subjected to the coating, is seated on the substrate seating unit 140 and disposed below the spray nozzle unit 120. In this case, the substrate 20 may be a glass substrate. As another example, all types of substrates, such as silicon wafer substrates and plastic substrates, which are applied to the spray process, may be applied. The substrate seating unit 140 may include a vertical movement holder 141 and a support plate 145 so that the substrate 20, which is subjected to the coating, is seated and supported below the spray nozzle unit 120. The vertical movement holder 141 may have a larger width than the substrate 20 and vertically move the substrate 20 by holding two opposite sides of the substrate 20. The support plate 145 may be configured as a heating plate further including a temperature control means to control a temperature thereof to a necessary temperature. The support plate 145 may support the substrate 20 during the spray process. The support plate 145, which is configured as the heating plate, may be controlled within a temperature range from a room temperature up to 600° C. at most, for example. The temperature of the substrate 20 may be maintained at 300 to 500° C. during the spray coating in order to form a uniform thin film.
The vertical movement holder 141 may be configured to seat the substrate 20 on the support plate 145 or move the substrate 20 upward from the support plate 145 while moving upward or downward below the spray nozzle unit 120.
The vertical movement holder 141 may include a holder body 142 and a pair of holder arms 143 extending from the holder body 142. The holder body 142 is configured to be movable at least in the vertical direction (z-axis direction in the drawings) below the spray nozzle unit 120. The pair of holder arms 143 may be disposed outside two opposite edges of the support plate 145 and extend in a direction (x-axis direction in the drawings) parallel to the edges. In addition, the pair of holder arms 143 may each include a lower part support portion 143a configured to support a lower part of the substrate 20, and a lateral part support portion 143b configured to support a lateral part of the substrate 20.
Referring to
In addition, the spray coater 100 according to the present embodiment may include a robot arm 151 configured to load the substrate 20 by moving the substrate 20 upward, and a substrate carrier 161 positioned at one side of the robot arm 151 and configured to accommodate the substrate 20.
For example, the robot arm 151 may include a horizontal articulated robot, i.e., a selective compliance assembly robot arm (SCARA). In general, the horizontal articulated robot may reach any point in a space while performing a single linear (vertical) motion and two rotational motions. That is, the robot arm 151 including the horizontal articulated robot may have two horizontal joint segments fixed to a base which is a vertical element, and a single linear vertical motion axis. Further, a handling strip 152 may be fixed to a distal end of the linear vertical motion axis of the robot arm 151 and move the substrate 20 upward or seat the substrate 20.
Therefore, the robot arm 151 may perform an operation of unloading the substrate 20 from the substrate carrier 161 and providing the substrate seating unit 140 with the substrate 20 before the substrate 20 is coated or an operation of unloading the substrate 20 from the substrate seating unit 140 and loading the substrate 20 on the substrate carrier 161 after the substrate 20 is coated. The substrate carrier 161 may accommodate the substrate 20 before the substrate 20 is coated or accommodate the substrate 20 after the substrate 20 is coated. The single substrate carrier 161 may selectively have different zones, and the substrate 20, which is to be coated, and the substrate 20, which has been coated, may be separately loaded on the single substrate carrier 161. Alternatively, the substrate 20, which is to be coated, and the substrate 20, which has been coated, may be separately loaded on a plurality of different substrate carriers 161.
Meanwhile, the spray coater 100, which has the above-mentioned components, may have a plurality of chambers separated from one another, and the components may be accommodated in the respective chambers.
For example, the spray coater 100 according to the present embodiment may include a spray chamber 110 and a load-lock chamber 150. The spray chamber 110 may accommodate the spray nozzle unit 120, the spray nozzle transfer unit 130, and the substrate seating unit 140. The robot arm 151 and the substrate carrier 161 may be accommodated together in the load-lock chamber 150.
In this case, the spray chamber 110 and the load-lock chamber 150 may be configured to communicate with each other through a chamber gate 156 which is openable and closable. For example, at the time of loading the substrate 20 by using the robot arm 151, the chamber gate 156 may be opened to allow the handling strip 152 of the robot arm 151 to enter or exist the load-lock chamber through the chamber gate 156. In this case, the chamber gate 156 may be controlled to be automatically opened or closed during the loading and unloading operations of the robot arm 151.
The spray chamber 110 and the load-lock chamber 150 may each include an atmospheric pressure environment or a vacuum environment. That is, both the spray chamber 110 and the load-lock chamber 150 may operate in the atmospheric pressure environment or the vacuum environment. In addition, the spray nozzle unit 120 may allow a precursor solution, which is to be injected, to include an ammonium acetate (CH3CO2NH4) stabilizer.
The vertical movement holder 141 may be positioned above the support plate 145, and the handling strip 152 of the robot arm 151 may transfer the substrate 20 while moving downward in the vertical direction from above the support plate 145, such that the substrate 20 may be placed on the holder arm 143 of the vertical movement holder 141 (see Steps 1 and 2 in
Since the pair of holder arms 143 of the vertical movement holder 141 extends from two opposite sides of the holder body 142, a middle portion between the pair of holder arms 143 is vacant. Further, because the handling strip 152 of the robot arm 151 is configured as a narrow and long piece member, the handling strip 152 does not interfere with the pair of holder arms 143 between the pair of holder arms 143 and may separate from the pair of holder arms 143 after seating the substrate 20 on the holder arm 143 (see Step 3 in
Therefore, the vertical movement holder 141, which receives the substrate 20, may seat the substrate 20 on the support plate 145 while moving downward in the vertical direction again so that the substrate 20 is supported on the support plate 145. Thereafter, when the vertical movement holder 141 continuously moves downward, the holder arm 143 moves further downward after passing by the support plate 145, and the substrate 20 may be kept in a state of being supported on the support plate 145 (see Steps 4 and 5 in
The coating process may be performed as the spray nozzle 121 operates and moves to a position above the substrate 20 positioned on the support plate 145 moves. In this case, the vertical movement holder 141 may move further rearward from the support plate 145 so that the vertical movement holder 141 is not affected by the coating process. The spray nozzle 121 may spray the coating material in a state in which the temperature of the substrate 20 seated on the support plate 145 is raised by the support plate 145 (see Step 6 in
After the substrate 20, which is completely coated, is subjected to preset curing or leveling, the vertical movement holder 141 enters again and moves upward to separate the substrate 20 from the support plate 145 (see Steps 7 and 8 in
When the substrate 20 is separated from the support plate 145, the handling strip 152 of the robot arm 151 enters again and carries the substrate 20 from the holder arm 143 of the vertical movement holder 141 (see Steps 9 and 10 in
In the spray coater 100 according to the present embodiment, the robot arm 151 may load the substrate 20, which is subjected to the coating, from the substrate carrier 161 and transport the substrate 20 into the spray chamber 110. The load-lock chamber 150 and the spray chamber 110, which may accommodate the robot arm 151, are closed from each other and communicate with each other through the chamber gate 156. For example, a sliding door 157 may open or close the chamber gate 156 while being opened downward or closed upward.
Referring to
Referring to
Referring to
The plurality of sub-spray chambers 210, 220, and 230 may be disposed adjacent to one another around the load-lock chamber 250. Further, the load-lock chamber 250, which accommodates the robot arm 151, may be configured to communicate with each of the plurality of sub-spray chambers 210, 220, and 230 through each of the chamber gates 156 which is openable or closable. Therefore, the handling strip 152 of the robot arm 151 may provide the substrate 20 to each of the sub-spray chambers 210, 220, and 230 or unload the substrate 20 from each of the sub-spray chambers 210, 220, and 230 while entering or existing through the each of the chamber gates 156.
For example, the plurality of sub-spray chambers 210, 220, and 230 may include the spray chamber 210 for a gate insulator, the spray chamber 220 for an oxide semiconductor, and a spray chamber 230 for passivation. For example, the spray chamber 210 for a gate insulator may include a configuration capable of depositing a gate insulator (GI) such as SiO2, SiNx, ZrOx, AlOx, ZAO, LaZrO, and HfOx on the substrate 20. For example, the spray chamber 220 for an oxide semiconductor may include a configuration capable of depositing a semiconductor made of IGZO, IGTO, IZTO, ZnO, LaZnO, or InOx on the substrate 20. In addition, examples of passivation materials may selectively include SiO2, SiNx, AlOx, ZrOx, AlOx/ZrOx, ZrOx/AlOx, and YOx.
Therefore, a multilayered thin film may be formed by performing the coating processes while sequentially loading and unloading the single substrate 20 to and from the plurality of sub-spray chambers 210, 220, and 230 by using the robot arm 151.
Referring to
The precursor refining unit 310 may have a device for refining a precursor used for spray coating. The plasma treatment unit 320 may have a device for UV/O3, Ar/O2 plasma treatment. The plurality of sub-spray chambers 330, 340, and 350 may be disposed adjacent to one another and closed from one another. Each of the plurality of sub-spray chambers 330, 340, and 350 may be configured to accommodate the spray nozzle unit, the spray nozzle transfer unit, and the substrate seating unit. Since the precursor refining unit 310, the plasma treatment unit 320, and the sub-spray chambers 330, 340, and 350 are provided in the plurality of chambers disposed adjacent to one another as described above, the spray coater 300 according to the present embodiment may be configured as a cluster type spray coater.
The plasma treatment unit 320 and the plurality of sub-spray chambers 330, 340, and 350 may be disposed adjacent to one another with respect to the load-lock chamber 305. Further, the load-lock chamber 305, which accommodates the robot arm, may communicate with the plasma treatment unit 320 and the plurality of sub-spray chambers 330, 340, and 350 through chamber gates which is openable or closable. Therefore, the handling strip of the robot arm may provide the substrate to each of the plasma treatment unit 320 and the sub-spray chambers 330, 340, and 350 or unload the substrate from each of the plasma treatment unit 320 and the sub-spray chambers 330, 340, and 350 while entering or existing through each of the chamber gates.
When the spray coater 300 according to the present embodiment performs the spray coating, a nitride-based precursor (M(NO3)), an acetylacetonate-based precursor (M(CH3COCH2COCH3)), or an acetate-based precursor (M(CH3COO−)) may be used as the precursor (herein, M is an abbreviation of metal (e.g., In, Zn, Ga, Tin, etc.)), and ammonium acetate may be added to the precursor. The precursor may be refined by the precursor refining unit 310, and a concentration of the precursor to be injected into the nozzle to form a uniform thin film during the spray coating may be 0.2 M or less.
A thin-film transistor made of IGZO, IGTO, ITZO, IGZTO, or IGO may be manufactured by using the spray coater described above. In addition, the thin-film transistor may be manufactured by using an oxide insulating layer containing at least one of SiO2, SiNx, ZrOx, AlOx, and ZrAlOx as a gate insulating layer or a TFT protective layer. In addition, ferroelectric HZO (HfZrO) thin films and ZrOx, AlOx and ferroelectric ZrOx/HZO/AlOx thin films may be manufactured by using the spray coater.
Hereinafter, a result of manufacturing a thin-film transistor (TFT) by using the spray coater according to the exemplary embodiment and measuring electrical properties of the thin-film transistor manufactured in this manner will be described in more detail. However, the protection scope of the present invention is not intended to be limited to the following examples.
A bottom-gate top-contact IGZO TFT was manufactured by using the spray coater described with reference to
The IGZO layer was deposited in the spray chamber 220 for an oxide semiconductor and deposited by spray pyrolysis on the heating plate at 350, 400, 425, or 450° C. An IGZO precursor solution of 0.1 M was sprayed for continuous 8 cycles to form the IGZO film of up to 12 nm. A distance between the spray nozzle and the substrate was kept as 10 cm and a spray flow velocity was about 3 ml/min. Photolithography patterning was performed after performing curing for 5 minutes and then wet etching was performed, thereby obtaining an active island.
After the active island was formed, patterning was performed by using a via hole and a gate contact pad was opened. A molybdenum (Mo) film of 40 nm was deposited by sputtering and patterned as a source/drain electrode on a gate insulator. A channel width/length ratio of 50 μm/10 μm was used for electrical characterization. To deposit the IGZO film without a coffee ring, the spray pyrolysis was performed on the heating plate at 350, 400, 425, or 450° C.
An Agilent 4156C semiconductor parameter analyzer was used to measure electrical properties of the IGZO TFT manufactured in Example 1.
Table 1 shows statistics data including standard deviations related to electrical performance of 40 IGZO TFTs in the form of swing (SS) which is saturation mobility (μsat), critical voltage (VTH), and a critical value or less.
A bottom-gate top-contact ferroelectric TFT was manufactured by using the spray coater described with reference to
The ZnO layer was deposited in the spray chamber 220 for an oxide semiconductor and deposited by spray pyrolysis on the heating plate at 350° C. An ZnO precursor solution of 0.2 M was sprayed for continuous 6 cycles to form the ZnO film of 30 nm. A distance between the spray nozzle and the substrate was kept as 10 cm and a spray flow velocity was about 3 ml/min. Photolithography patterning was performed after performing curing for 5 minutes and then wet etching was performed, thereby obtaining an active island.
After the active island was formed, patterning was performed by using a via hole and a gate contact pad was opened. A molybdenum (Mo) film of 40 nm was deposited by sputtering and patterned as a source/drain electrode on a gate insulator.
Table 2 shows properties of the ferroelectric TFT having the triple stack structure (ZrOx/HZO/AlOx) with respect to channel lengths (3, 6, 8, and 10 μm) when a channel width is 20 μm. As the channel length increases by 3, 6, 8, and 10, the properties have pun of 75.18, 64.46, 73.22, and 73.66 cm2/Vs, VTH of 0.05, 0.25, 0.25, and 0.4 V, and SS of 180, 190, 190, and 200 mV/dec. In addition, the properties of hysteresis (VH), which are properties of a memory window, have properties of 3.55, 2.75, 2.75, and 2.75 V.
While the exemplary embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications can be made and carried out within the scope of the claims, the detailed description of the invention, and the accompanying drawings, and also fall within the scope of the invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2021-0066425 | May 2021 | KR | national |
| Number | Name | Date | Kind |
|---|---|---|---|
| 4498414 | Kiba | Feb 1985 | A |
| 5374312 | Hasebe | Dec 1994 | A |
| 5565034 | Nanbu | Oct 1996 | A |
| 7694647 | Ishikawa | Apr 2010 | B2 |
| 8146530 | Ishikawa | Apr 2012 | B2 |
| 8176870 | Ikushima | May 2012 | B2 |
| 8181596 | Ishikawa | May 2012 | B2 |
| 8215262 | Ishikawa | Jul 2012 | B2 |
| 8550031 | Ishikawa | Oct 2013 | B2 |
| 8802488 | Yi | Aug 2014 | B2 |
| 9508567 | Namba | Nov 2016 | B2 |
| 9721813 | Ogata | Aug 2017 | B2 |
| 10105725 | Tomuta | Oct 2018 | B2 |
| 10730103 | Hosek | Aug 2020 | B2 |
| 10969700 | Park | Apr 2021 | B2 |
| 10991601 | Park | Apr 2021 | B2 |
| 11260412 | Tomuta | Mar 2022 | B2 |
| 11325143 | Brochier | May 2022 | B2 |
| 11380560 | Lee | Jul 2022 | B2 |
| 11456564 | Ikushima | Sep 2022 | B2 |
| 11469105 | Sano | Oct 2022 | B2 |
| 20120320361 | Ishikawa | Dec 2012 | A1 |
| 20160035601 | Eum | Feb 2016 | A1 |
| 20200026205 | Park | Jan 2020 | A1 |
| 20210057239 | Kim | Feb 2021 | A1 |
| 20220075270 | Kim | Mar 2022 | A1 |
| 20220100096 | Kim | Mar 2022 | A1 |
| 20220102169 | Kim | Mar 2022 | A1 |
| Number | Date | Country | |
|---|---|---|---|
| 20220371044 A1 | Nov 2022 | US |
