1. Field of the Invention
The present invention relates generally to a contact for electronic devices, and more particularly to a contact for electronic devices which electrically connects a plurality of leads of an integrated circuit (IC) provided in a test socket to corresponding pads of a printed circuit board (PCB).
2. Description of Related Art
Conventional contacts of two types are disclosed in U.S. Pat. No. 7,025,602, which is issued to Dong Weon Hwang on Apr. 11, 2006. The first type as shown in FIG. 4 of U.S. Pat. No. 7,025,602, includes a pipe body, an upper and lower contact pins and a spring. The upper and lower contact pins are received in the pipe body with their one ends respectively, and the opposite ends project out the pipe body respectively. The spring locates between said one ends and allow the upper contact pin to shift upwards and downwards. The upper and lower contact pins are of cylindrical shape, which is not easy in manufacture.
The second type of the convention contacts includes a blade-shaped upper and lower contact pins and a spring connecting said two contact pins, which all are received a hole defined in a test socket where the contact are arranged. The spring allows the upper contact pin to shift upward and downward relative to the lower contact pin. However, since the two contact pins are crossedly assembled, the two contact pin must be fabricated accurately, which is not easily obtained in manufacture.
Therefore, an improved contact is desired to overcome the disadvantages of the prior arts.
An object of the present invention is to provide a contact for electronic device, which is easily produced.
In order to achieve above-mentioned object, a contact comprises a first contact pin of blade shape, a second contact pin and a spring; the second contact pin comprises a connecting portion and a receiving portion opposite to the connecting portion; the receiving portion defines a receiving space to accommodate the first contact pin; the spring locates in the receiving space and allow the first contact pin to shift downwards and upwards therein.
Other objects, advantages and novel features of the present invention will become more apparent from the following detailed description of the present embodiment when taken in conjunction with the accompanying drawings.
Reference will now be made to the drawing figures to describe a preferred embodiment of the present invention in detail.
Referring to
Referring to
The second contact pin 22 is produced by fabricating an elongated sheet metal and includes a base portion 220. A connecting portion 223 extends downwards from the base portion 220 to be soldered with the PCB. A receiving portion 222 of box or the like is defined under the base portion 220. A widen metal sheet is extending upward from the base portion 220 and then bents transversely two time to form a rectangular receiving cavity 224 with an upward opening 2241, namely said receiving portion 222. The bottom portion of the side walls of the receiving space 224 bent inward to define a bottom side 221. Two parallel side walls, parallel to the base portion 220 of the receiving portion defines a slot 225, 226 (see
Seeing
However, the disclosure is illustrative only, changes may be made in detail, especially in matter of shape, size, and arrangement of parts within the principles of the invention.
Number | Date | Country | Kind |
---|---|---|---|
2007 2 0034629 U | Feb 2007 | CN | national |
Number | Name | Date | Kind |
---|---|---|---|
4263547 | Johnson | Apr 1981 | A |
5685725 | Kazumi | Nov 1997 | A |
5727954 | Yuji | Mar 1998 | A |
6652326 | Boyle et al. | Nov 2003 | B2 |
6821131 | Suzuki et al. | Nov 2004 | B2 |
6861862 | Tate | Mar 2005 | B1 |
7025602 | Dong | Apr 2006 | B1 |
20080003888 | Xu | Jan 2008 | A1 |
20080146083 | Hsiao et al. | Jun 2008 | A1 |
Number | Date | Country | |
---|---|---|---|
20080194123 A1 | Aug 2008 | US |