Spring clip for retaining thermal contact between an electronic device package and a heat sink

Information

  • Patent Grant
  • D357227
  • Patent Number
    D357,227
  • Date Filed
    Friday, September 24, 1993
    31 years ago
  • Date Issued
    Tuesday, April 11, 1995
    29 years ago
Abstract
Description
Claims
  • The ornamental design disclosed for a spring clip for retaining thermal contact between an electronic device package and a heat sink, as shown and described.
US Referenced Citations (7)
Number Name Date Kind
D275178 Yeater Aug 1984
D301334 Dupasquier et al. May 1989
D307540 McCarthy May 1990
2724882 Poupitch Nov 1955
4964198 McCarthy Oct 1990
5068764 Bland et al. Nov 1991
5138524 Smithers Aug 1992