Sputtering chamber coil

Information

  • Patent Grant
  • D440582
  • Patent Number
    D440,582
  • Date Filed
    Monday, July 13, 1998
    26 years ago
  • Date Issued
    Tuesday, April 17, 2001
    23 years ago
  • US Classifications
    Field of Search
    • US
    • D15 1442
    • D15 199
    • 204 298
    • 204 19212
    • 204 19213
    • 204 29803
    • 204 29819
    • 204 2982
    • 204 29801
    • 204 29802
    • 204 29805
    • 204 29837
    • 204 29838
    • 315 11121
    • 315 11141
    • 315 11151
    • 315 11181
  • International Classifications
    • 1509
    • Term of Grant
      14Years
Abstract
Description




FIG. 1 is a front elevational view;




FIG. 2 is a top view;




FIG. 3 is a right side elevational view;




FIG. 4 is a bottom view; and,




FIG. 5 is a rear elevational view of our sputtering chamber coil.




The left side elevation view (not shown) is the same as the right side elevational view (FIG. 3) because of coil symmetry.



Claims
  • The ornamental design for sputtering chamber coil, as shown and described.
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Entry
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Applied Materials, Inc., Exhibit A, Dated prior to Jul. 13, 1998, the filing date of the present application.(Exhibit A is a drawing of a prior art coil design which is prior to the design of the present application).
S.M. Rossnagel et al., “Magnetron Sputter Deposition with High Levels of Metal Ionization,” Appl. Phys. Lett., vol. 63, pp. 3285-3287, 1993.
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Continuation in Parts (1)
Number Date Country
Parent 09/039695 Mar 1998 US
Child 29/090631 US