This non-provisional patent application claims priority under 35 U.S.C. §119(a) from Patent Application No. 1214823.5 filed in United Kingdom on Aug. 20, 2012.
This invention relates to a tamper indication device and in particular to a. stackable security wrap for an electronic circuit to protect against tampering.
Although this invention will be described in relation to security wraps for a printed circuit board as an example of the invention, the invention can be used with any printed electronics (PE) flex having a need for protection against or detection of tampering.
Traditional security wraps form a solid security screen masking an area of the electronics to be protected. Removal of the security wrap is physically difficult due to the manner in which the security wrap is attached to the device, usually by gluing, soldering or encapsulation by a resin material. Modern security wraps have a security screen electrically connecting a pair of terminals of an alarm circuit. The security screen may be damaged or broken during attempts to tamper with the device to thereby set off an alarm condition. The alarm circuit may disable the device or simply give a visual indication that the security wrap has been tampered with.
In a co-pending commonly assigned patent application, there is disclosed a security wrap of the breakable conductor type, having a security screen with a conductor that is relatively thin and densely packed over the area to he protected to prevent tampering and arranged or designed to easily fracture should an attempt be made to tamper with the security wrap once fitted. However, security wraps are often required to cover complex shapes which may be best protected by using two or more security wraps. With only a limited number of alarm terminals available, connection of the security screens of multiple security wraps may be problematic.
Hence, there is a desire for a security wrap which can be stacked with another security wrap with the security screens of the two security wraps being electrically interconnected.
Accordingly, in one aspect thereof, the present invention provides a security assembly for protecting a device, comprising first and second security wraps fitted to the device, The first security wrap covers a first area of the device, and has a first security screen comprising first and second screen terminals and a conductive track extending between said first and second screen terminals. The second security wrap partially overlaps said first security wrap, covers a second area of the device, and has a second security screen comprising first and second screen terminals and a conductive track extending between said first and second screen terminals. A conductive structure is disposed in an overlapping area between said first security wrap and said second security wrap and coupled to said second screen terminal of said first security screen and to said first screen terminal of said second security screen.
Preferably, said first screen terminal of said first security screen and said second screen terminal of said second security screen are coupled to two corresponding terminals of an alarm circuit of the device.
Preferably, said first security wrap further includes a first substrate; said first security screen includes said first and second screen terminals and said conductive track formed on said first substrate; and said conductive structure includes a conductive plug formed in said first substrate and coupled to said second screen terminal of said first security screen and to said first screen terminal of said second security screen.
Optionally, said conductive structure includes a conductive resilient disc disposed between said first security wrap and said second security wrap, said conductive resilient disc being in contact with said second screen terminal of said first security screen and with said first screen terminal of said second security screen in response to a compression in the overlapping area between said first security wrap and said second security wrap.
Optionally, an adhesive layer in the overlapping area between said first security wrap and said second security wrap, said adhesive layer compressing said conductive resilient disc in contact with said second screen terminal of said first security screen and with said first screen terminal of said second security.
Optionally, further comprising a spigot over the overlapping area between said first security wrap and said second security wrap, said spigot compressing said conductive resilient disc in contact with said second screen terminal of said first security screen and with said first screen terminal of said second security.
Optionally, said conductive structure includes a carbon pad disposed in the overlapping area between said first security wrap and said second security wrap and in contact with said first screen terminal of said second security screen; said carbon pad and said second screen terminal of said first security screen define a gap there between; and said carbon pad is in contact with said second screen terminal of said first security screen in response to a compression of the overlapping area between said first security wrap and said second security wrap.
Preferably, said conductive structure includes a printed conductive through hole electrically connected to said second screen terminal of said first security screen and said first screen terminal of said second security screen.
Preferably, said second security wrap includes a folded wrap.
Preferably, said first and second security screens include first and second breakable conductive screens formed on said first and second security wraps, respectively.
According to a second aspect thereof, the present invention provides a security assembly for protecting a device includes first and second wrap. The first wrap comprises a substrate having first side and second sides opposite to each other, a first conductive track bonded to the first side of said substrate and having two ends forming a first screen terminal coupled to the device and a second screen terminal, and a first adhesive layer covering said first conductive track over the first side of said substrate and bonding said substrate to the device. The second wrap has an overlapping area with said first wrap and comprises a substrate having first and second sides opposite to each other, a second conductive track bonded to the first side of said substrate and having two ends forming a first screen terminal coupled to the second screen terminal of said first conductive track and a second screen terminal coupled to the device, and a second adhesive layer covering said second conductive track over the first side of said substrate and bonding the substrate to the device. A conductive structure is disposed in the overlapping area between said first wrap and said second wrap and in said substrate of said first wrap, said conductive structure being coupled to said second screen terminal of said first conductive track and to said first screen terminal of said second conductive track.
Preferably, said first and second conductive tracks includes first and second breakable conductive tracks.
Preferably, further comprising an intermittent pattern of release ink disposed between the first side of said substrate of said first wrap and said first conductive track to selectively modify a boding strength between said first conductive track and said substrate of said first wrap.
Preferably, said first screen terminal of said first conductive track is coupled to a first terminal of the alarm circuit of the device; said second screen terminal of said second conductive track coupled to a second terminal of the alarm circuit of the device; said first conductive track and said second conductive track form a series conductive path between the first and second terminals of the device.
Preferably, said first wrap is fitted to the device and covers a first area of the device; and said second wrap is fitted to the device and covers a second area of the device.
By overlaying and interconnecting security wraps, complex areas can be covered or protected by the security wraps without having to form large complex security wraps which have high material wastage.
Preferred embodiments of the invention will now be described, by way of example only, with reference to figures of the accompanying drawings. In the figures, identical structures, elements or parts that appear in more than one figure are generally labelled with a same reference numeral in all the figures in which they appear. Dimensions of components and features shown in the figures are generally chosen for convenience and clarity of presentation and are not necessarily shown to scale. The figures are listed below.
The PCB 12 and the two security wraps 20, 30 are shown in exploded view in
As mentioned, the second security wrap 30 is preferably formed as a folded wrap. This means that the wrap 30 is formed from a flat sheet of flexible substrate material. Once the flat wrap has been formed and cut to shape, it is folded into the desired shape. The unfolded or developed state is shown in
The general principles of construction of a security wrap will now be described with reference to the first security wrap 20 and
For a security wrap 20 with breakable conductors, an intermittent layer of adhesive modifier or release layer 52 is applied between the substrate 50 and the first screen 22. It should be noted that the use of breakable conductors is optional and that breakable conductors can be formed using a different method not involving a release layer.
The substrate 50 is preferably a polymer film, typically a polyethylene terephthalate (PET or commonly referred to as polyester) film, that provides a base for a security wrap circuit. Optionally the substrate is flexible, being a film of thickness between 25 μm and 175 μm but can be greater depending on functional requirements and may include other variants of polymer film including, but not limited to, polycarbonate, PEN, polyimide and PVC. The substrate 50 may be clear but preferably is opaque and pigmented, for example black or white, to hide the configuration of the conductive screen 22 and the underlying circuitry on PCB 12.
The release layer 52 is preferably, a ultra-violet (UV), infra-red (IR) or thermally cured ink system used to provide a different adhesion level between the substrate 50 and the security screen 22. The ink is thus an adhesion modifier. The release layer 52 is intermittent and applied to the substrate 50 in a predetermined pattern by a printing process and is not a complete layer such that there are areas of substrate which are not covered by the adhesion modifier ink. Optionally, the pattern of the release, layer 52 is simple stripes or dots.
The screen 22 is composed of a pattern formed by a conductive trace or conductor preferably formed by thermoset or thermoplastic conductive ink printed over the substrate 50 in variable trace widths and serpentine mesh patterns forming an electrically conductive path between a pair of screen terminals 24. Preferably, the screen terminals 24 are simply the ends of the conductors.
The conductive inks can be silver, silver-coated copper or gold containing conductive or resistive ink, each with specific properties that suit the necessary requirement for the operation and functionality of the security wrap flexible circuit. The conductive ink can also be carbon, graphite, clear conductive polymer or other conductive or resistive ink, each with specific properties that suit the necessary requirement for the operation and functionality of the security wrap.
A dielectric layer such as a LTV curable ink system with electrically insulative properties may be used to electrically insulate the security screen 22 to avoid short circuits, if needed.
The adhesive layer 54 is preferably a pressure-sensitive adhesive (PSA), typically an acrylic adhesive that forms a bond between surfaces when pressure is applied. The adhesive may he applied as an adhesive ink or as a laminate. The adhesive layer is used to bond the security wrap to the parent device. Alternatively, the adhesive maybe a liquid adhesive such as an epoxy, or moisture-cure urethane etc. which is dispensed or printed between the security wrap and the PCB, which is then cured by moisture, thermal or UV energy and forms a permanent bond between wrap and PCB. This type of adhesive is not pressure sensitive, but could work under the same disclosed principle.
Depending on the material of the parent device 10 to which the security wrap 20 is adhered a variant PSA with specific adhesion properties could be used. Specifically the adhesion to the parent device 10 must be stronger than the adhesion to the substrate 50, so that on removal of the security wrap 20 from the parent device 10, the adhesive layer 54 will remain adhered to the parent device 10 in order to break the conductor of the screen 22.
First wrap 20 differs from the second wrap 30 in that normally the screen terminals are on the same side of the substrate 50 as the screen and the adhesive so that the security wrap protects the connections to the alarm terminals. However, as the screen 22 of the first wrap 20 needs to be connected to the screen 32 of the second wrap 30, the first screen terminals 24 extend through the first substrate 50 as shown in
The screen terminal 34 of the second wrap 30 is formed as a projection of the end of the conductor forming the second screen 32 and preferably forms a projection extending into the adhesive layer 54, The actual connection between the first and second screens 20, 30 may take different forms.
While the preferred embodiment uses security wraps with breakable conductors the present invention is also applicable to more traditional security wraps where the conductors of the security screen as not specifically designed to be broken if the security wrap is removed from the device. Depending on the complexity of the alarm circuit, a security screen may have any number of conductors.
While the drawings have been enlarged for better clarity of observation and description, in the preferred embodiments, the width of the conductive traces and the spaces there between are in the range of 1 to 1,000 microns. The preferred embodiment uses a trace width between 200 and 300 microns. This produces a good compromise between costs and security level as the finer the widths the higher the security level but the printing process is more expensive.
In the description and claims of the present application, each of the verbs “comprise”, “include”, “contain” and “have”, and variations thereof, are used in an inclusive sense, to specify the presence of the stated item but not to exclude the presence of additional items.
Although the invention is described with reference to one or more preferred embodiments, it should be appreciated by those skilled in the art that various modifications are possible. Therefore, the scope of the invention is to be determined by reference to the claims that follow.
Number | Date | Country | Kind |
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1214823.5 | Aug 2012 | GB | national |