This patent application relates generally to interconnection systems, such as those including electrical connectors, used to interconnect electronic assemblies.
Electrical connectors are used in many electronic systems. It is generally easier and more cost effective to manufacture a system as separate electronic assemblies, such as printed circuit boards (“PCBs”), which may be joined together with electrical connectors. A known arrangement for joining two printed circuit boards is to connect them in a stacking configuration. In this configuration, the two printed circuit boards are parallel to one another, and are connected using vertical connector. These connectors are often referred to as “mezzanine connectors” or “stacking connectors”. One printed circuit board may have a first mezzanine connector mounted thereon and a second printed circuit board may have a second mezzanine connector mounted thereon. Each one of the mezzanine connectors includes a plurality of contact portions made of a conductive material. When the printed circuit boards are to be connected, the mezzanine connectors are mated, such that corresponding contact portions form electrical contacts.
Regardless of the exact application, electrical connector designs have been adapted to mirror trends in the electronics industry. Electronic systems generally have gotten smaller, faster, and functionally more complex. Because of these changes, the number of circuits in a given area of an electronic system, along with the frequencies at which the circuits operate, have increased significantly in recent years. Current systems pass more data between printed circuit boards and require electrical connectors that are electrically capable of handling more data at higher speeds than connectors of even a few years ago.
According to one aspect of the present application, an electrical connector is provided. The electrical connector may comprise an insulating housing; a first plurality of contact portions, each of the first plurality of contact portions having a mating end, a contact tail, and a body disposed between the mating end and the contact tail, the body being disposed within the insulating housing; a second plurality of contact portions, each of the second plurality of contact portions having a mating end, a contact tail, and a body disposed between the mating end and the contact tail, the body being disposed within the insulating housing; and an opening formed in the insulating housing between the first plurality of contact portions and the second plurality of contact portions.
According to another aspect of the present application, another electrical connector is provided. The electrical connector may comprise an insulating housing; a first row of contact portions, each of the first row of contact portions having a mating end, a contact tail, and a body disposed between the mating end and the contact tail, the body being disposed within the insulating housing; a second row of contact portions, each of the second row of contact portions having a mating end, a contact tail, and a body disposed between the mating end and the contact tail, the body being disposed within the insulating housing; and a plurality of openings formed in the insulating housing and separated from one another by a plurality of beams along a first direction, each of the plurality of openings separating corresponding contacts portions of the first and second rows of contact portions along a second direction.
The accompanying drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component that is illustrated in various figures is represented by a like numeral. For purposes of clarity, not every component may be labeled in every drawing. In the drawings:
The inventors have recognized and appreciated that incorporating into a connector housing one or more slots between rows of conductors may increase the performance of a high density interconnection system by reducing the effects of signal crosstalk. Such a feature may be used in a mezzanine connector with two rows of conductors.
In some embodiments, crossbeams may be incorporated in the slot between the rows to provide mechanical integrity. Those crossbeams may be positioned to provide low crosstalk. In some embodiments, the crossbeams may be positioned between contacts designated to be of the same type, such as between contacts designated as signal contacts or contacts designated as ground contacts. Such crossbeams may be orthogonal to a direction of the rows of conductors. Alternatively or additionally, the cross beams may be at an angle other than 90 degrees relative to the rows. In some embodiments, the angle of the cross beams may align ends of the crossbeams with contacts in opposing rows that are offset from one another in the row direction.
Signal crosstalk arises in electrical interconnection systems due to electromagnetic coupling between adjacent conductors. Signal crosstalk is undesirable because it may degrade the signal-to-noise ratio (SNR) of the transmitted signals.
The effects of signal crosstalk are particularly severe in high-density connectors, in which the separation between adjacent conductors is small (e.g., less than 1 mm). In fact, the close proximity of adjacent conductors may promote mutual coupling. Furthermore, crosstalk may be exacerbated when the frequency of the signals carried by the connectors is large (e.g., greater than 25 GHz). In recent years, signal frequencies have been significantly increased in response to continuously increasing requirements in data rates. However, at high frequencies, the mutual coupling between adjacent conductors increases, thereby promoting signal crosstalk.
Typical electrical connectors include a plurality of electrically conductive contact portions for carrying electrical signals between mated electrical connectors. In stacking connectors, the contact portions are held together by an insulative housing and are often arranged in parallel rows. The insulative housing is made of a dielectric material, such as plastic.
The inventors have recognized and appreciated that signal crosstalk arising between adjacent contact portions of an electrical connector may be reduced by forming one or more openings through the housing between adjacent rows. In embodiments in which a connection is formed by mating two connectors, openings may be formed in each of the connectors such that the openings align when the connectors are mated.
Without being bound by any theory of operation, the inventors theorize that configurations as described herein improve electrical performance because the relative dielectric constant of the air occupying the opening(s) is lower than the relative dielectric constant of the housing itself, such that the overall effective dielectric constant is reduced between the conductors separated by the opening. This reduction in the effective dielectric constant leads to an increase in the effective electrical distance in the region in which the openings are formed. As a result, in embodiments in which the conductors separated by the air are used to carry signals that are intended to be separate, signal crosstalk is reduced. In some embodiments, one or more openings may be positioned in the housing between adjacent rows of contact portions. In this way, the signal crosstalk between contact portions of different rows is reduced. This result may be particularly applicable to connectors configured for communicating differential signals in edge coupled pairs of signal conductors within the rows.
The opening(s) may extend all the way through the housing (e.g., from a first outer surface to a second outer surface of the housing), thus enhancing the air fill factor. Openings of the type described herein may be used to reduce signal crosstalk in any type of electrical connector. For example, in some embodiments, a mezzanine connector (e.g., a PCI or a PCIe connector) may comprise a housing having one or more openings formed there through. Various examples of mezzanine connectors are described further below. However, the use of openings to reduce signal crosstalk is not limited to mezzanine connectors. Accordingly, in some embodiments, other types of connectors may use openings formed in the connector's housing to reduce signal crosstalk.
For example, openings of the type described herein may be used in connection with board-to-board connectors other than mezzanine connectors, such as right-angled connectors. The openings may be positioned in the connector's housing between adjacent contact portions. In another example, the openings may be used to reduce crosstalk in connectors configured to mate with optical modules, such as SFP, QSFP, micro QSFP, CXP, CFP, or any other suitable type of connector.
In some embodiments, connector 102 is configured to be attached to a motherboard, while connector 104 is configured to be attached to a daughtercard. The opposite arrangement is also possible. In some embodiments, the printed circuit boards may communicate with each other, via interconnection system 100, using a standardized protocol, such as a PCI protocol. In these embodiments, connectors 102 and 104 may be designed to conform with PCI standards, and conductors may be designated for certain functions according to these standards, such as to carry differential signals, power, ground, or low speed single-ended signals.
Such a designation may be made by configuration of the contacts. Ground contacts, for example, may be wider or have a higher inductance than signal conductors. Alternatively or additionally, ground conductors may be longer. As yet another form of designation, adjacent signal contacts may be closer to each other than to adjacent ground conducts or otherwise be configured to provide greater coupling between signal conductors so as to form a differential pair than to an adjacent conductor designated as a ground. Alternatively or additionally, these designations may be based on a standard such that when a connector is attached to a printed circuit board according to the standard, the designated conductors are attached to conducting structures that couple signals or grounds conductors per the designation. Such connections are possible because the connector has conductors positioned according to the designation of the standard.
The conductors in connectors 102 and 104 may also comprise electrically conducting contact tails designed to attach to a corresponding printed circuit board. Interconnection system 100 may be demated by pulling connectors 102 and 104 away from each other along a direction parallel to the z-axis.
Connectors 102 and 104 may each comprise a housing. For example, connector 102 may comprise housing 106 and connector 104 may comprise housing 108. The housings may be made, wholly or in part, of any suitable insulative material, such as plastic or nylon. Examples of suitable materials include, but are not limited to, liquid crystal polymer (LCP), polyphenyline sulfide (PPS), high temperature nylon or polyphenylenoxide (PPO) or polypropylene (PP). Other suitable materials may be employed, as aspects of the present disclosure are not limited in this regard.
The insulative material may be molded to form the desired shape. The housing may hold the plurality of conductors with contact portions in position to mate with the contact portions of conductors in the mating connector. The housing may be molded around the conductors alternatively, the housing may be molded with passages configured to receive the conductors, which may then be inserted into the passages
In the embodiment illustrated, the conductors are arranged in multiple, parallel rows. The non-limiting example of
As illustrated, housing 106 may hold conductors 110. Conductors 110 may be made of any suitable conductive material, such as copper, or any other suitable metal or alloy of metals. Each conductor 110 may comprise a contact tail 112 and a mating contact portion 116 (as shown in
The contact tails may be used to form electrical contacts with the printed circuit board on which the connector is mounted. For example, the contact tails may form electrical contacts with a corresponding pad disposed on the printed circuit board. The contact tails may be attached to the printed circuit board in any suitable way. For example, the contact tails may be shaped as press fit compliant sections and may be attached to the printed circuit board using a press fit mechanism. However, in the embodiment illustrated, the contact tails are shaped for attachment to a printed circuit board using a surface mount soldering technique.
The mating contact portions 116 of connector 102 (not shown in
In some embodiments, the connectors may comprise one or more projecting members for facilitating the mating operations. The projecting members may support the mating portion of the conductors in a way that they are exposed for mating with contact portions of conductors in a mating connector. The projecting members may be part of the connectors' housings. A projecting member may have a free end. The free end may extend in the mating direction (the z-axis in the example shown in
One or more openings may be formed in the housing of a connector. In some embodiments, the opening(s) may be arranged between adjacent rows of contact portions. As a result, signal crosstalk between contact portions of different rows may be reduced. It should be appreciated that, due to the change in effective dielectric constant caused by the presence of air in the openings, the capacitance associated with the housing may also vary. As a result, the resonant frequency of the connector may shift. According to one aspect of the present application, the opening(s) may be arranged so as to provide a desired shift in the resonant frequency. For example, it may be desirable to move the resonant frequency away from the operating frequency of the interconnection system.
In the embodiment of
Mating connector 104 alternatively or additionally may include an opening formed in housing 108. The opening in housing 108 may align, when connectors 102 and 104 are mated, with the opening in housing 106 such that a slot may extend from the board mounting face of connector 102 to the board mounting face of connector 104. In the illustrated embodiment, each of connectors 102 and 104 may have the same board mounting interface such that each connector 104, when viewed from the perspective of its board mounting surface, may have an arrangement of conductors and a slot as illustrated in
Adjacent contact portions 110 may be separated, along the x-axis, by an edge-to-edge distance that is between 0.4 mm and 2 mm, between 0.4 mm and 0.8 mm, between 0.5 mm and 0.7 mm, or between any other suitable range within such ranges. In some embodiments, contact portions 110 may be arranged, along the x-axis, in a periodic configuration, that is, with a constant pitch. The pitch may be between 0.4 mm and 1.6 mm, between 0.7 mm and 0.9 mm, or between any other suitable range within such ranges.
In the embodiment illustrated in
Regardless of whether the rows are staggered with respect to one another, the designations shown in
In some embodiments, a beam 138 may be positioned, along the x-axis, in proximity to two adjacent contact portions of the same type (e.g., two signal contacts or two ground contacts). This configuration is illustrated in
Each conductor110 may comprise a mating end 116, a contact tail 112, and an intermediate portion 114. The intermediate portion may connect the mating end to the contact tail. In some embodiments, intermediate portion 114 comprises a portion having an angle that is substantially 90° (e.g., between 85° and 95°, between 80° and 100°, or between 75° and 105°). In some such embodiments, conductors 110 are arranged in an L-shape. Mating ends 116 may have tapered ends for facilitating mating with corresponding contact portions.
In some embodiments, each of the rows of conductors may be stamped from a sheet of conductor. With this process, each conductor may have two broader sides, joined by edges. Adjacent conductors are aligned edge-to-edge such that, when two adjacent conductors within a row are designated as signal conductors for a differential pair, that pair will have edge-to-edge coupling. Conductors 110 may be held in rows by housing 106. In some embodiments, the contact portions are held by projecting member 130. A plurality of channels 135 may be formed on either sidewall of projecting member 130, and may be arranged for positioning the contact portions with respect to the housing.
As should be appreciated from
As another example, curve 406 illustrates the crosstalk specifications for a third generation PCIe connector. Curve 408 illustrates crosstalk at various frequencies for a PCIe connector including openings of the type described herein. As illustrated, the crosstalk meets the PCIe specification across the frequency range examined, and surprisingly exceeds a PCIe Gen 4 specification, whereas conventional designs whereas conventional designs marginally meet the specification.
Having thus described several aspects of at least one embodiment of this invention, it is to be appreciated that various alterations, modifications, and improvements will readily occur to those skilled in the art.
For example, it is described that a slot is formed in a connector housing between rows of mating contact portions of conductors. Alternatively or additionally, the slot may be formed or other portions of the conductors.
As an example of another variation, it is described that the slot is full of air. Air has a low dielectric constant relative to an insulative housing. The relative dielectric constant of air, for example, may be about 1.0, which contrasts to a dielectric housing with a relative dielectric constant in the range of about 2.4 to 4.0. The improved performance described herein may be achieved with a slot filled with material other than air, if the relative dielectric constant of that material is low, such as between 1.0 and 2.0 or between 1.0 and 1.5, in some embodiments.
Such alterations, modifications, and improvements are intended to be part of this disclosure, and are intended to be within the spirit and scope of the invention. Further, though advantages of the present invention are indicated, it should be appreciated that not every embodiment of the invention will include every described advantage. Some embodiments may not implement any features described as advantageous herein and in some instances. Accordingly, the foregoing description and drawings are by way of example only.
Various aspects of the present invention may be used alone, in combination, or in a variety of arrangements not specifically discussed in the embodiments described in the foregoing and is therefore not limited in its application to the details and arrangement of components set forth in the foregoing description or illustrated in the drawings. For example, aspects described in one embodiment may be combined in any manner with aspects described in other embodiments.
Also, the invention may be embodied as a method, of which an example has been provided. The acts performed as part of the method may be ordered in any suitable way. Accordingly, embodiments may be constructed in which acts are performed in an order different than illustrated, which may include performing some acts simultaneously, even though shown as sequential acts in illustrative embodiments.
Use of ordinal terms such as “first,” “second,” “third,” etc., in the claims to modify a claim element does not by itself connote any priority, precedence, or order of one claim element over another or the temporal order in which acts of a method are performed, but are used merely as labels to distinguish one claim element having a certain name from another element having a same name (but for use of the ordinal term) to distinguish the claim elements.
All definitions, as defined and used herein, should be understood to control over dictionary definitions, definitions in documents incorporated by reference, and/or ordinary meanings of the defined terms.
The indefinite articles “a” and “an,” as used herein in the specification and in the claims, unless clearly indicated to the contrary, should be understood to mean “at least one.”
As used herein in the specification and in the claims, the phrase “at least one,” in reference to a list of one or more elements, should be understood to mean at least one element selected from any one or more of the elements in the list of elements, but not necessarily including at least one of each and every element specifically listed within the list of elements and not excluding any combinations of elements in the list of elements. This definition also allows that elements may optionally be present other than the elements specifically identified within the list of elements to which the phrase “at least one” refers, whether related or unrelated to those elements specifically identified.
The phrase “and/or,” as used herein in the specification and in the claims, should be understood to mean “either or both” of the elements so conjoined, i.e., elements that are conjunctively present in some cases and disjunctively present in other cases. Multiple elements listed with “and/or” should be construed in the same fashion, i.e., “one or more” of the elements so conjoined. Other elements may optionally be present other than the elements specifically identified by the “and/or” clause, whether related or unrelated to those elements specifically identified. Thus, as a non-limiting example, a reference to “A and/or B”, when used in conjunction with open-ended language such as “comprising” can refer, in one embodiment, to A only (optionally including elements other than B); in another embodiment, to B only (optionally including elements other than A); in yet another embodiment, to both A and B (optionally including other elements); etc.
As used herein in the specification and in the claims, “or” should be understood to have the same meaning as “and/or” as defined above. For example, when separating items in a list, “or” or “and/or” shall be interpreted as being inclusive, i.e., the inclusion of at least one, but also including more than one, of a number or list of elements, and, optionally, additional unlisted items. Only terms clearly indicated to the contrary, such as “only one of” or “exactly one of,” or, when used in the claims, “consisting of,” will refer to the inclusion of exactly one element of a number or list of elements. In general, the term “or” as used herein shall only be interpreted as indicating exclusive alternatives (i.e. “one or the other but not both”) when preceded by terms of exclusivity, such as “either,” “one of,” “only one of,” or “exactly one of.” “Consisting essentially of,” when used in the claims, shall have its ordinary meaning as used in the field of patent law.
Also, the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of “including,” “comprising,” or “having,” “containing,” “involving,” and variations thereof herein, is meant to encompass the items listed thereafter and equivalents thereof as well as additional items.
This application claims priority under 35 U.S.C. § 119(e) to U.S. Provisional Patent Application Ser. No. 62/460,644, entitled “STACKING ELECTRICAL CONNECTOR WITH REDUCED CROSSTALK,” filed on Feb. 17, 2017, which is hereby incorporated herein by reference in its entirety.
Number | Name | Date | Kind |
---|---|---|---|
3259869 | Batcheller | Jul 1966 | A |
3411127 | Adams | Nov 1968 | A |
3865462 | Cobaugh et al. | Feb 1975 | A |
4241970 | Rider, Jr. et al. | Dec 1980 | A |
4740180 | Harwath et al. | Apr 1988 | A |
5267881 | Matuzaki | Dec 1993 | A |
5290181 | Bixler et al. | Mar 1994 | A |
5558542 | O'Sullivan et al. | Sep 1996 | A |
5692928 | Nelson et al. | Dec 1997 | A |
5795191 | Preputnick et al. | Aug 1998 | A |
5957734 | Gladd et al. | Sep 1999 | A |
5980337 | Little | Nov 1999 | A |
6024584 | Lemke et al. | Feb 2000 | A |
6042389 | Lemke et al. | Mar 2000 | A |
6079991 | Lemke et al. | Jun 2000 | A |
6093035 | Lemke et al. | Jul 2000 | A |
6139336 | Olson | Oct 2000 | A |
6146202 | Ramey et al. | Nov 2000 | A |
6164983 | Lemke et al. | Dec 2000 | A |
6183268 | Consoli et al. | Feb 2001 | B1 |
6193537 | Harper, Jr. et al. | Feb 2001 | B1 |
6247635 | Olson | Jun 2001 | B1 |
6325644 | Lemke et al. | Dec 2001 | B1 |
6358068 | Houtz | Mar 2002 | B1 |
6371784 | Scholz et al. | Apr 2002 | B1 |
6425785 | Azuma | Jul 2002 | B1 |
6454157 | Olson | Sep 2002 | B2 |
6488550 | Kikuchi et al. | Dec 2002 | B1 |
6565368 | Liao et al. | May 2003 | B1 |
6623284 | Korsunsky | Sep 2003 | B1 |
6699048 | Johnson et al. | Mar 2004 | B2 |
6848944 | Evans | Feb 2005 | B2 |
6860741 | Ashmann et al. | Mar 2005 | B2 |
6869292 | Johnescu et al. | Mar 2005 | B2 |
6872085 | Cohen et al. | Mar 2005 | B1 |
6899547 | Chang | May 2005 | B1 |
6939173 | Elco et al. | Sep 2005 | B1 |
7059873 | Johnescu et al. | Jun 2006 | B2 |
7097465 | Korsunsky et al. | Aug 2006 | B1 |
7214104 | Minich et al. | May 2007 | B2 |
7322855 | Mongold et al. | Jan 2008 | B2 |
7341482 | Ngo | Mar 2008 | B2 |
7371094 | Tokuhashi et al. | May 2008 | B1 |
7431616 | Minich | Oct 2008 | B2 |
D585031 | Hung | Jan 2009 | S |
7503773 | Tokunaga | Mar 2009 | B2 |
7585185 | Obikane | Sep 2009 | B2 |
7597581 | Trout et al. | Oct 2009 | B2 |
7632107 | Mizumura | Dec 2009 | B2 |
7766670 | Ju | Aug 2010 | B1 |
7985079 | Wilson | Jul 2011 | B1 |
8257095 | Akai | Sep 2012 | B2 |
9257778 | Buck et al. | Feb 2016 | B2 |
9520661 | Horning et al. | Dec 2016 | B1 |
9543703 | Horchler et al. | Jan 2017 | B2 |
9735484 | Brubaker et al. | Aug 2017 | B2 |
9735848 | Saiwai et al. | Aug 2017 | B2 |
9831605 | Buck et al. | Nov 2017 | B2 |
9871323 | Horchler et al. | Jan 2018 | B2 |
20020061687 | Cachina et al. | May 2002 | A1 |
20020098738 | Astbury, Jr. et al. | Jul 2002 | A1 |
20040175995 | Tsai | Sep 2004 | A1 |
20050020103 | Spink, Jr. | Jan 2005 | A1 |
20050142908 | Harper, Jr. | Jun 2005 | A1 |
20070021002 | Laurx et al. | Jan 2007 | A1 |
20070155241 | Lappohn | Jul 2007 | A1 |
20070175572 | Rubin et al. | Aug 2007 | A1 |
20070224845 | Becker et al. | Sep 2007 | A1 |
20080176418 | Hougham et al. | Jul 2008 | A1 |
20080207023 | Tuin et al. | Aug 2008 | A1 |
20080311768 | Hougham et al. | Dec 2008 | A1 |
20090023311 | Goodman | Jan 2009 | A1 |
20090264023 | Yi et al. | Oct 2009 | A1 |
20100015861 | Zhang et al. | Jan 2010 | A1 |
20100055988 | Shuey et al. | Mar 2010 | A1 |
20100093232 | Trout et al. | Apr 2010 | A1 |
20100240233 | Johnescu et al. | Sep 2010 | A1 |
20100291803 | Kirk | Nov 2010 | A1 |
20110097934 | Minich | Apr 2011 | A1 |
20110117781 | Stoner | May 2011 | A1 |
20120077380 | Minich et al. | Mar 2012 | A1 |
20120088378 | Rathburn | Apr 2012 | A1 |
20120202363 | McNamara | Aug 2012 | A1 |
20130273781 | Buck et al. | Oct 2013 | A1 |
20140017957 | Horchler et al. | Jan 2014 | A1 |
20140148022 | Mongold et al. | May 2014 | A1 |
20140273553 | Heppner et al. | Sep 2014 | A1 |
20160134057 | Buck et al. | May 2016 | A1 |
20170125946 | Horchler et al. | May 2017 | A1 |
20170317440 | Lauermann | Nov 2017 | A1 |
20180241156 | Huang | Aug 2018 | A1 |
20180316106 | Rengarajan et al. | Nov 2018 | A1 |
20180317335 | Rengarajan et al. | Nov 2018 | A1 |
Number | Date | Country |
---|---|---|
101006614 | Jul 2007 | CN |
203277706 | Nov 2013 | CN |
2009-129708 | Jun 2009 | JP |
10-2009-0029286 | Mar 2009 | KR |
201136063 | Oct 2011 | TW |
WO 02101882 | Dec 2002 | WO |
WO 2006105484 | Oct 2006 | WO |
WO 2008156851 | Dec 2008 | WO |
WO 2016064804 | Apr 2016 | WO |
Entry |
---|
U.S. Appl. No. 13/836,610, filed Mar. 15, 2013, Buck et al. |
U.S. Appl. No. 14/995,026, filed Jan. 13, 2016, Buck et al. |
U.S. Appl. No. 15/402,146, filed Jan. 9, 2017, Horchler et al. |
U.S. Appl. No. 15/520,790, filed Apr. 20, 2017, Lauermann. |
U.S. Appl. No. 15/964,246, filed Apr. 27, 2018, Madhumitha. |
U.S. Appl. No. 15/964,284, filed Apr. 27, 2018, Madhumitha. |
EP 13775244.0, Feb. 28, 2019, European Examination. |
PCT/US2015/056346, Jan. 28, 2016, International Search Report and Written Opinion. |
PCT/US2015/056346, May 4, 2017, International Preliminary Report on Patentability. |
PCT/US2018/029706, Aug. 10, 2018, International Search Report and Written Opinion. |
PCT/US2018/029709, Aug. 16, 2018, International Search Report and Written Opinion. |
European Examination for European Application No. EP 13775244.0 dated Feb. 28, 2019. |
International Search Report and Written Opinion for International Application No. PCT/US2015/056346 dated Jan. 28, 2016. |
International Preliminary Report on Patentability for International Application No. PCT/US2015/056346 dated May 4, 2017. |
International Search Report and Written Opinion for International Application No. PCT/US2018/029706 dated Aug. 10, 2018. |
International Search Report and Written Opinion for International Application No. PCT/US2018/029709 dated Aug. 16, 2018. |
[No Author Listed], Gig-Array Connector System. Board/Wire-To-Board Connectors. FCI. Estimated date of publication before 2016. 5 pages. |
[No Author Listed], NeXLev. High-Density Parallel Board Connector. Amphenol TCS. 2009. 2 pages. |
Number | Date | Country | |
---|---|---|---|
20180241156 A1 | Aug 2018 | US |
Number | Date | Country | |
---|---|---|---|
62460644 | Feb 2017 | US |