Stamp component for transferring microstructure

Abstract

Description

FIG. 1 is a perspective view of a stamp component for transferring microstructure, showing our new design;

FIG. 2 is a front elevational view thereof, the rear elevational view, left side elevational view, and right side elevational view being identical;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is an enlarged portion view labeled, “5,” in FIG. 1;

FIG. 6 is an enlarged portion view labeled, “6,” in FIG. 5;

FIG. 7 is an enlarged portion view labeled, “7,” in FIG. 2; and,

FIG. 8 is an enlarged portion view labeled, “8,” in FIG. 7.

The dot-dashed lines depict the boundaries of the enlarged portion views of FIGS. 5-8 in FIGS. 1, 2, and 5-8 and form no part of the claimed design.

Claims

The ornamental design for a stamp component for transferring microstructure, as shown and described.