NSF Award
9108850
The mission of the Integrated Electronics Engineering Center (IEEC) will be four-fold: (1) to support the integrated electronics industry of New York State with short-and long-range research and development and planning efforts, (2) to disseminate the results of research which will advance the leading edge of technology in the field, (3) to provide a technology transfer and training program to enhance economic development in New York State, and (4) to deliver a unique educational experience in integration of electronics design and assembly at the undergraduate and graduate level. The goals and objectives for IEEC can be classified into three areas of activities: (1) research and development, (2) collaborative activities with industry, other academic institutions and government agencies, and (3) economic development, including business start-up and work force productivity and stability enhancement. The organizational framework will include an Industrial Advisory Board (IAB) for formal liaisons with industry. Additionally, there will be a cadre of Project Liaisons from industry working directly with faculty researchers on each technical project. The IAB has representatives from IBM, GE, Universal Instruments, the State's University Industry Public Partnership for Economic Growth (UnIPEG), and the Watson School of Engineering. The purpose of the IAB is to provide a collaborative technical interaction between the Watson School and the Electronics packaging industry, by establishing broader industrial consensus on the most critical packaging topics, and by encouraging interdisciplinary activities among university researchers. Leading two-year academic institutions in the State will serve as transmitters for amplifying the technology transfer mechanism to other regions of the state. Research results will be disseminated by: (i) reporting initially to IEEC members via regularly scheduled Center briefing sessions, followed by, (ii) publications or presentations in public forums, followed by, (iii) training workshops open to any member of the public on a course fee basis. Additional courses will be offered at the undergraduate and graduate level beyond those already provided by the Watson School in electronics packaging. Aside from the transfer of research results directly to sponsors, there is the prospect of transfer in the longer term to other firms through the active involvement of faculty with state agencies, such as the University/Industry Public Partnership for Economic Growth (UnIPEG) and their Industrial Technical Extension Service (ITES). The Continuing Education Office of the Watson School will develop a number of short courses related to the Center's implementation retraining programs for the local microelectronics industry at the level of the individual employee, thereby improving productivity and/or employment stability. The State of New York, industry and NSF will provide matching funds totalling $750,000 in the first year.
