Steam Cleaner With Controllable Heating Element

Information

  • Patent Application
  • 20240349973
  • Publication Number
    20240349973
  • Date Filed
    April 19, 2024
    8 months ago
  • Date Published
    October 24, 2024
    2 months ago
Abstract
Systems, apparatuses, and computer-implemented methods for operating a heating element in a steam mop. In one embodiment, the present disclosure provides a battery to provide battery power; a fluid reservoir for holding liquid; at least heating element in fluid communication with the fluid reservoir; one or more temperature sensors coupled to the at least one heating element; and a controller in communication with the one or more temperature sensors and the at least one heating element, the controller is configured to operate in a cordless mode to control and energize the at least one heating element in a first high power mode and a second low power mode using battery power, based on, at least in part, temperature data received from the one or more temperature sensors; wherein the high power mode provides a greater amount of power to the at least one heating element than the low power mode.
Description
TECHNICAL FIELD

The present disclosure relates to heating components for electronic steam cleaners, and more particularly to optimizing a thick film boiler for corded or cordless steam mops.





BRIEF DESCRIPTION OF THE DRAWINGS

Features and advantages of various embodiments of the claimed subject matter will become apparent as the following Detailed Description proceeds, and upon reference to the Drawings, wherein like numerals designate like parts, and in which:



FIG. 1 illustrates a cleaning apparatus in accordance with at least one embodiment of the present disclosure;



FIG. 2A illustrates a first embodiment of thick film heater element in accordance with several embodiments of the present disclosure;



FIG. 2B illustrates another embodiment of thick film heater element in accordance with several embodiments of the present disclosure;



FIG. 2C illustrates another embodiment of thick film heater element in accordance with several embodiments of the present disclosure;



FIG. 2D illustrates another embodiment of thick film heater element in accordance with several embodiments of the present disclosure;



FIG. 2E illustrates another embodiment of thick film heater element in accordance with several embodiments of the present disclosure;



FIG. 2F illustrates another embodiment of thick film heater element in accordance with several embodiments of the present disclosure;



FIG. 2G illustrates another embodiment of thick film heater element in accordance with several embodiments of the present disclosure;



FIG. 3A illustrates a first view of a cylindrical (tubular) thick film boiler in accordance with several embodiments of the present disclosure;



FIG. 3B illustrates another view of a cylindrical (tubular) thick film boiler in accordance with several embodiments of the present disclosure;



FIG. 3C illustrates another view of a cylindrical (tubular) thick film boiler in accordance with several embodiments of the present disclosure;



FIG. 4 illustrates an exploded view of components of a thick film boiler in accordance with at least one embodiment of the present disclosure;



FIG. 5A illustrates a first view of a cylindrical thick film boiler with an NTC temperature control resistor, in accordance with several embodiments of the present disclosure;



FIG. 5B illustrates another view of a cylindrical thick film boiler with an NTC temperature control resistor, in accordance with several embodiments of the present disclosure;



FIG. 6A illustrates a steam mop according to a first embodiment of the present disclosure;



FIG. 6B illustrates a steam mops according to another embodiment of the present disclosure;



FIG. 7A illustrates a cross-sectional view of an ultra-sonic mister shown in FIG. 7B, in accordance with at least one embodiment of the present disclosure;



FIG. 7B illustrates the ultra-sonic mister of FIG. 7A, in accordance with at least one embodiment of the present disclosure;



FIG. 8 illustrates a flowchart 800 of operations according to one embodiment of the present disclosure; and



FIG. 9 illustrates a block diagram of a computing device of a cleaning apparatus including a thick film boiler system according to at least one embodiment of the present disclosure.





Although the following Detailed Description will proceed with reference being made to illustrative embodiments, many alternatives, modifications and variations thereof will be apparent to those skilled in the art.


DETAILED DESCRIPTION


FIG. 1 generally illustrates one example of a cleaning apparatus 100 consistent with the present disclosure. The cleaning apparatus 100 may include, but is not limited to, a steam cleaner and/or mop, a robotic steam mop, a vacuum cleaner including a steam mop, or the like. The cleaning apparatus 100 may include a body 102 and a steam nozzle (also referred to as a steam head) 104. The steam nozzle 104 may be configured to dispense steam to a surface to be cleaned (e.g., a floor 110), for example, through a steam pad 105. The steam head 105 may also include an agitator assembly (not shown) generally configured to scrub and loosen dirt and debris on the surface 110 to be cleaned. Optionally, the cleaning apparatus 100 may include a handle 106 and a hinge and/or connector 108. The handle 106 may be configured to allow a user to manipulate the cleaning apparatus 100 across the surface to be cleaned 110. The handle 106 may optionally include one or more user controls 112 (such as, but not limited to, one or more buttons, switches, displays, or the like) configured to allow a user to control one or more functions of the cleaning apparatus 100. The connector 108 may be configured to allow the steam nozzle 104 or move relative to the body 102 and/or handle 106. For example, the connector 108 may include a universal joint or the like.


The cleaning apparatus 100 may include one or more fluid reservoirs 116. The fluid reservoirs 116 may be configured to contain a quantity of liquid such as, but not limited to, water, cleaning, and/or disinfection agents. In at least one example, the cleaning apparatus 100 may include a first fluid reservoir configured to hold a quantity of water and a second (or more) fluid reservoir configured to hold a quantity of cleaning or disinfection agents.


The fluid reservoirs 116 may include one or more fluid inlets 118 for receiving and storing the fluid within the fluid reservoirs 116, and one or more fluid outlets 120. The fluid outlet 120 may be fluidly coupled to one or more thick film heating elements 122, for example, as illustrated by liquid flow path 121. As explained herein, the thick film heating elements 122 may be configured to heat the fluid from the fluid reservoir 116 to generate a gaseous fluid (e.g., steam), as generally illustrated by gaseous flow path 123. It should be appreciated that the gaseous flow path 123 may include only gas (e.g., only steam) or may include both gas (e.g., steam) and liquid (e.g., liquid water). The steam 123 may then flow from the thick film heating elements 122 to the steam nozzle 104, and optionally through one or more steam pads 105. Optionally, one or more controllable flow regulators 124 may be provided between the fluid outlet 120 and the thick film heating elements 122. The controllable flow regulators 124 may include one or more controllable valves and/or pumps (either mechanical or electrical pumps). In some examples, liquid may be gravity fed from the fluid reservoir 116 to the thick film heating elements 122.


In at least one example, the one or more fluid reservoirs 116 may be fluidly coupled to (e.g., selectively fluid coupled to) one or more of the thick film heating elements 122. Alternatively, as an example, a first fluid reservoir (e.g., the water reservoir) may be fluidly coupled to (e.g., selectively fluid coupled to) one or more of the thick film heating elements 122 and the second fluid reservoir (e.g., the cleaning or disinfection agents) may be fluidly coupled to one or more separate dispensing outlets (e.g., but not limited to, nozzles or the like) configured to dispense the cleaning or disinfection agents separately from the gaseous flow path 123.


The cleaning apparatus 100 may also include controller circuitry 126 generally configured to control the operation of the thick film heating element(s) 122 and/or the flow regulator 124, as described below. For example, the controller 126 may adjust the flow rate of a pump and/or can the position of a valve to regulate the amount of liquid being provided to the thick film heating elements 122.


The controller 126 may also adjust the power provided to the thick film heating element(s) 122. For example, the controller 126 may switch between a DC power source 128 (e.g., one or more rechargeable batteries) and/or AC power source 130. The controller 126 may be configured to selectively provide power to one or more specific thick film heating elements 122 based on the power source being used. For example, the controller 126 may provide power to a low power thick film heating elements 122 when operating on the DC power source, thereby extending battery life of the DC power source. Alternatively, the controller 126 may provide power to high power thick film heating elements 122 (and optionally the low power thick film heating elements 122) when operating on the AC power source, thereby providing maximum steam output.


The controller 126 may regulate the power provided to the thick film heating elements 122 based, at least in part, on the output of one or more temperature sensors 132 coupled to one or more thick film heating elements 122. In some embodiments, additional sensors may be used, for example, motion sensors, water level sensors, floor type sensors, dirt detection sensors, and/or the like, which may be located anywhere within or on the cleaning apparatus 100 (such as, but not limited to, within the fluid reservoir 116, the handle 106, the body 102, and/or the steam nozzle 104).


One or more thick film heating elements 122 may be configured to provide desired power densities, for example, up to 50 W/cm2 and/or desired operating temperatures, for example, on the order of 350° C. Thick film heating elements 122 may also be configured for direct liquid heating or contact heating of flat surfaces, have electrical strength up to several kW, be mechanically stable and be composed of self-supporting steel substrate. Further, the thick film heating elements 122 may be applied to simple application of holes, screws, nuts, welds, any flat shape; and does not absorb humidity. Examples of the one or more thick film heating element(s) 122 are described below in greater detail.


One or more of the temperature sensors 132 may include a negative temperature coefficient (NTC) resistor. As is known, an NTC resistor generally changes resistance as a function of temperature. The NTC resistor may be embedded within one or more thick film heating elements 122. For example, the NTC resistor may include an NTC thermistor integrated within thick film heating elements 122. Further, the NTC thermistor may be configured to improve the time in which thick film boiler system transitions between a first mode (e.g., a high power mode) and a second mode (e.g., a low power mode).


In an embodiment, the one or more temperature sensors 132 may include a first thermostat 132A configured to operate at a first temperature and a second thermostat 132B configured to operate at a second temperature. For example, the first thermostat 132A may be configured to detect liquid temperature at (or near) the thick film heating element(s) 122, and transmit data corresponding to the detected temperature to controller 126. Further, the first thermostat 132A may be configured to operate (i.e., close a power circuit) when the liquid temperature is less than a first maximum temperature. Similarly, the second thermostat 132A may be configured to detect liquid temperature at (or near) the thick film heating element(s) 122, and transmit data corresponding to the detected temperature to controller 126. The second thermostat 132B may be configured to operate (i.e., close a power circuit) when the liquid temperature is less than a first maximum temperature and/or greater than the first maximum temperature. The cleaning apparatus 100 may experience improved efficiencies as a result of regulating when one or more temperature sensors operate, for instance, by using less battery power and processing resources when the liquid temperatures do not exceed a temperature threshold.


In an embodiment, the first temperature may correspond to a first maximum temperature that is 50% less than a second maximum temperature that may correspond to the second temperature.


In an embodiment, one or more thick film heating elements 122 may include a 2-dimensional composite layer that comprises at least a substrate layer as a base layer, a heater track layer on top of the substrate layer, and/or an enamel protective layer on top of the heater track layer.



FIGS. 2A-2G illustrate various embodiments of thick film heater elements 200, in accordance with several embodiments of the present disclosure.


In an embodiment, thick film heater elements 200 (e.g., one or more thick film heating elements 122) may include flat circular thick film heating element 210 (FIG. 2A), half-circle thick film clement 220 (FIG. 2B), rounded-square thick film heating element 230 (FIG. 2C), square thick film heating element 240 (FIG. 2D), rectangular thick film heating element 250 (FIG. 2E), and tubular thick film heating elements 260, 270 (FIGS. 2F and 2G). The thick film heating elements of FIGS. 2A-2E may be used to heat liquid indirectly, for example, the thick film heating elements of FIGS. 2A-2E may be placed on or near a separate fluid container (not shown) in fluid communication with the fluid reservoir 116 and/or the thick film heating elements of FIGS. 2A-2E may be placed on or near the fluid reservoir 116 to provide heating of liquid. In the examples of 2F and 2G, the tubular heating element 260/270 may receive liquid within the tubular structure to be heated directly. In an embodiment, thick film heating elements 200 may be configured to provide high performance having capacity for high power densities up to 50 W/cm2. Further, thick film heating elements 200 may be configured to withstand and be subjected to high operating temperatures up to 350° C. Further, thick film heating elements 200 may also be configured for direct liquid heating or contact heating of flat surfaces, have electrical strength up to several kW, be mechanically stable and be composed of self-supporting steel substrate. Further, the thick film heating elements 200 may be applied to simple application of holes, screws, nuts, welds, any flat shape; and may be configured to reduce humidity absorption.



FIGS. 3A-3B illustrate various views of a cylindrical (tubular) thick film boiler 300, in accordance with several embodiments of the present disclosure.


In an embodiment, cylindrical thick film heater 300 may include inlet 310 (e.g., receiving inlet) configured for receiving a liquid and outlet 320 (e.g., dispensing outlet) configured for dispensing the liquid throughout a body of cylindrical thick film heater 300. For example, inlet 310 may receive liquid from a reservoir or tank in fluid communication with cylindrical thick film heater 300. Further, for example, outlet 320 may be configured to dispense liquid from cylindrical thick film heater 300 to a surface cleaning module (e.g., surface cleaning module 104) that may be in fluid communication with outlet 320.


In an embodiment, cylindrical thick film heater 300 may include electrical ports 320 to connect wire leads to receive electrical energy from a power source. Further, cylindrical thick film heater 300 may include valve component 340 with a back end disposed within the opening of a first end of spring component 350, wherein a front end of valve component lodged at an internal portion of inlet 310. For example, the internal portion of inlet may be disposed at an inlet portion of a spiral water channel inside the body of cylindrical thick film heater 300, wherein the valve component may be configured to provide anti-backflow of water through the spiral water channel.


In an embodiment, cylindrical thick film heater 300 may be configured with dimensions appropriate for the application in which it is used. For example, cylindrical thick film heater 300 may have a first length 370 of 111 mm and a first diameter of 13 mm, appropriate for a hand-held cleaning appliance (e.g., steam mop). Further, for example, cylindrical thick film heater 300 may have a second length 374 of 89 mm not including portions of inlet 310 and outlet 312 extending beyond the body and a second diameter 376 of 5.5 mm corresponding to the opening of inlet 310 and/or outlet 312. Even further, for example, cylindrical thick film heater 300 may have a third length 378 of 85 mm not including portions of respective caps for inlet 310 and outlet 312.



FIG. 4 illustrates an exploded view of components of a thick film boiler in accordance with one embodiment of the present disclosure.


In an embodiment, thick film boiler 400 may include inlet cap 410 configured to be disposed within an opening of a first end of shell 402 (e.g., outer portion of body) and outlet cap 412 configured to be disposed within an opening of a second end of shell 402. Further, thick film boiler 400 may include wires (e.g., conductive leads 420) attached to terminals electrically connected to thick film component 430 configured to provide electrical energy to generate heat at thick film component 430. Even further, thick film boiler 400 may include core with spiral water channel 440 configured to be disposed within and throughout the length of the body of thick film boiler 400. Furthermore, thick film boiler 400 may include spring 442 (e.g., spring component 350) with a back end disposed within the opening of a first end of valve 442 (e.g., valve component 340).



FIGS. 5A and 5B illustrate various views of a cylindrical thick film boiler 500 with an NTC temperature control resistor, in accordance with several embodiments of the present disclosure.


In an embodiment, cylindrical thick film boiler 500 may include NTC temperature control 510 component positioned at one end of body of cylindrical thick film heater 500 and electrically connected to cylindrical thick film heater 500. For example, NTC temperature control 510 component may be a thermistor configured to provide feedback to a controller regulate cylindrical thick film heater 500 to two or more different temperatures. For instance, switching the cylindrical thick film heater 500 between two or more different operating temperatures may include decrease the time between switching between a first mode and a second mode, and/or increase the change in temperature rate when switching between a first mode and a second mode.



FIG. 6A illustrates a steam mop 600 consistent with one embodiment of the present disclosure.


The steam mop 600 may be a cordless steam mop (e.g., configured to be powered by one or more batteries), a corded steam mop (e.g., configured to be powered by an AC power source such as an electrical outlet), or a combination of a corded and cordless steam mop. The steam mop 600 may include handle 610 having a bottom portion connected to an upper portion of body 612, wherein body 612 may include one or more liquid reservoirs (e.g., a cold water tank, detergent tank, and/or liquid container) 620. The one or more liquid reservoirs 620 may be in fluid communication with one or more pumps 630. Further, steam mop 600 may include mop module (also referred to as a steam nozzle or steam head) 614 hingedly coupled to the body 612, wherein mop module 614 may include mister 640 in fluid communication with liquid reservoir 620. Further, mop module 614 may include boiler 650 in fluid communication with liquid reservoir 620 and be configured to generate steam from liquid supplied from mister 640. For example, boiler 650 may include thick film heating elements configured to generate heat to increase the temperature of liquid sourced from mister and dispense the heated liquid as steam 644 to a surface or out to the proximate environment. It should be appreciated, however, that the boiler 650 may include any boiler known to those skilled in the art.


In an embodiment, mister (also referred to herein as an atomizer) 640 may be configured to dispense at least some of the mist 646 generated into the environment. The mister 640 may include any known atomizer such as, but not limited to, a piezoelectric atomizer or the like, configured to combine air and a fluid (e.g., water, cleaning and/or disinfection agents) to generate a mist including droplets of the fluid suspended in the air. Optionally, at least some of the mist 646 may contact one or more chemical components 642. For example, at least some of the mist 646 may flow through and/or around at least a portion of the chemical component 642. At least some of the chemical component 642 may be combined with the mist 646, and ultimately dispensed into the environment. For example, at least some of the mist 646 may entrain some of the chemical component 642 such that the chemical component 642 is disposed along with the mist 646 from the steam mop 600. The mist 646 and the chemical component 642 may be dispensed into the air in the environment surrounding the steam mop 600 and/or onto the surface to be cleaned. The chemical component 642 may include, but is not limited to, an aromatic compound and/or an anti-microbial (e.g., but not limited to, anti-bacterial, anti-fungal, anti-virial, and/or anti-protozoa). Alternatively (or in addition), the mister 640 may be configured to dispense mist 646 at least partially through or on one or more steam pads (e.g., steam pad 105) coupled to the mop module 614.


The mister 640 may be configured to receive liquid (e.g., water and/or detergents) prior to the liquid being heated by the boiler 650. For example, the mister 640 and boiler 650 may be fluidly coupled to one or more liquid reservoir 620 via one or more pumps 630 and/or one or more valves 615. The one or more pumps 630 and/or one or more valves 615 may be selectively adjusted by a controller (e.g., controller 126, FIG. 1) to adjust a flow rate to mister 640 and/or the boiler 650.


For example, the mister 640 may be fluidly coupled to a single pump 630 that provides a liquid to both the mister 640 and the boiler 650 as generally illustrated in FIG. 6A. Alternatively (or in addition), the mister 640 and the boiler 650 may be fluidly coupled to the liquid reservoir 620 via one or more controllable valves 615. In at least one example, the pump 630 may be eliminated and the supply of liquid to the mister 640 and/or the boiler 650 may be gravity fed via valves 615.



FIG. 6B illustrates a steam mop 600′ consistent with another embodiment of the present disclosure. In the embodiment of FIG. 6B, the flow of liquid from the liquid reservoir 620 to the mister 640 may be provided separately and independently from the flow of liquid from the liquid reservoir 620 to the boiler 650. For example, the steam mop 600′ may include a first and a second pump configured to separately and independently provide liquid from one or more liquid reservoirs 620 to the mister 640 and the boiler 650, respectively. Alternatively, the steam mop 600′ may include a first pump configured to provide liquid from one or more liquid reservoirs 620 to the boiler 650, while the liquid may be gravity fed from one or more liquid reservoirs to the mister 640. In yet another example, the steam mop 600′ may include a first pump configured to provide liquid from one or more liquid reservoirs 620 to the mister 640, while the liquid may be gravity fed from one or more liquid reservoirs 620 to the boiler 650. Alternatively, the liquid may be gravity fed from one or more liquid reservoirs 620 to the boiler 650 and separately the liquid may be gravity fed from one or more liquid reservoirs 620 to the mister 640.


In any event, providing the liquid to the mister 640 prior to heating by the boiler 650 may improve the overall efficiency of the steam mop 600′ since the mist 646 is generated without consuming energy used by the boiler 650. This may be particularly useful in battery operated (cordless) steam mops 600/600′.


Any of the steam mops described herein may further include one or more motion sensors configured to detect movement of steam mop. For example, a motion sensor may be coupled to the handle 610, body 612, and/or mop module 614. Steam mop 600 and 600′ may include a controller (e.g., controller 126 as shown in FIG. 1) in communication with the one or more sensors, wherein the one or more sensors may be configured to transmit motion data to the controller. Upon receiving the motion data, the controller may be configured to determine when steam mop 600/600′ is moving and toggle from an active mode (e.g., when power is supplied to boiler 650 and/or mister 640) to an inactive mode (e.g., when power is not supplied to boiler 650 and/or mister 640) responsive to determining that steam mop 600/600′ is not moving.


As will be appreciated, the controller 126 is configured to determine if the steam mop is connected to main AC power (corded), or if AC power is not present, in which the mop operates in a cordless (battery operated) mode. In cordless mode, the controller 126 may control the boiler 650 and mister 640 to operate in a plurality of operational modes. In a first operational mode, the controller 126 may provide a reduced amount of power (e.g., 50% full power) to the boiler 650. In this first mode, power to the mister 640 may be omitted to extend battery life. The steam mop 600/600′ may operate in a second operational mode in which the amount of power provided to the boiler 650 is greater than the amount of power to the boiler 650 in the first operational mode. For example, the first operational mode may be referred as to a low power mode while the second operational mode may be referred to as a high power mode.


The steam mop 600 may also include a third operational mode. In the third operational mode, the steam mop 600 may provide power to both the boiler 650 and the mister 640. In at least one example, the amount of power provided to the boiler 650 in the third operational mode is greater than the amount of power provided to the boiler 650 in the first operational mode. Alternatively (or in addition), the amount of power provided to the boiler 650 in the third operational mode may be less than the amount of power provided to the boiler 650 in the first operational mode. The third operational mode may optionally include a low power mode and a high power mode. In the low power mode, the amount of power provided to the boiler 650 and/or the mister 640 is less than the amount of power provided to the boiler 650 and/or mister 640 in the high power mode.


If the controller 126 determines that AC power is present, the controller 126 may control the boiler 650 and mister 640 to operate in a first operation mode that provides full power to the boiler 650, and a second operational mode that provides full power to the boiler 650 and the mister 640. It should be understood that any of the steam mops described herein may be configured for battery-only mode operation, in which AC power is used only to recharge a rechargeable battery associated with the steam mop (via, for example, a wall-mountable docking station, etc.). In such a configuration, the stem mop may be configured to operate in low power (longer run time) and high power (faster steam production) modes, described above. In addition, such a steam mop configuration may include a mister (as described herein) that may be user-selectable to an ON operation in the low power mode and/or the high power mode. Alternatively, the battery may include one or more disposable batteries, and in such an implementation, the steam mop may be configured to operate on disposable batteries only without connectivity to AC power.


As used herein, “low power” and “low power mode” represents an operational condition that is generally designed to provide an extended run-time, based on available battery power, total battery power capabilities, etc. “High power” and “high power mode” represents an operational condition where an increased amount of power is delivered to a heating element as compared to the “low power mode”. The high power mode may enable, for example, a user to have steam available faster than the low power mode and/or an increased steam production compared to low power mode.


In the embodiment of FIG. 6B, the mister 640 may be in fluid communication with the fluid reservoir 620 via fluid communication path 670. As illustrated, fluid communication path 670 may bypass the pump 630, and thus the mister 640 may be gravity fed. The boiler 650 may be in fluid communication with the fluid reservoir 620 via fluid communication path 672. Fluid communication path 672 may bypass the mister 640.



FIGS. 7A and 7B illustrate ultra-sonic mister 700, in accordance with several embodiments of the present disclosure.


In an embodiment, ultra-sonic mister 700 may be a piezo vaporizer and may include an upper portion 702 affixed to a lower portion 704, forming a cavity between the upper portion 702 and the lower portion 704, wherein the cavity may be configured to be in fluid communication with a water source or water supply via inlet 710 and dispel the supplied water through outlet 712. For example, as the liquid (e.g., water) is provided through inlet 710 and accesses the cavity, ultra-sonic mister 700 may be configured to generate mist vapors 714 through an opening of upper portion 702, wherein the mist vapors 714 may be emitted into the proximate environment.


In an embodiment, water may be distributed by various methods. For example, water may be heated/boiled through the boiler and dispensed through the mop module. As another example, unheated water may be dispensed through ultra-sonic mister 700, as described above herein.



FIG. 8 illustrates a flowchart 800 of operations according to one embodiment of the present disclosure. The operations depicted in FIG. 8 are directed to operations of a controller (e.g., controller 126) of a steam mop. Operations of this embodiment include determining if AC power is present 802. If AC power is not present, the controller will cause the steam mop to operate in a cordless mode. In the cordless mode, operations of this embodiment include determining if a high or low power mode is selected 804. If low power mode is selected, the controller controls a heating element to heat liquid to a first temperature to produce steam 806. If high power mode is selected, the controller controls a heating element to heat liquid to a first temperature to produce steam 808. In either (or both) the low power and/or high power modes, operations according to this embodiment may also include determining if a mister operation is selected 810.


If AC power is present (802), the controller will cause the steam mop to operate in a corded mode. In the corded mode, operations of this embodiment include controlling a heating element to heat liquid to produce steam 812, for example, using all available power to heat the liquid as quickly as possible. In the corded mode, operations according to this embodiment may also include determining if a mister operation is selected 814. As described above, some implementations of the steam mop described herein may be enabled for battery-operated mode only (i.e., cordless). In such implementations, operation 802 may be modified to determine if the steam mop is connected to AC to recharge a rechargeable battery associated with the steam mop, and operations 812 and 814 may be omitted. Of course, in still other embodiments, the steam mop may be configured to run on disposable batteries only, in which case operations 802, 812 and 814 may be omitted.


The steam mop described herein may also include one or more user-selectable switches to allow a user to switch between the various modes described herein (e.g., low power/high power modes), and to switch the mister on/off.



FIG. 9 illustrates a block diagram of a computing device 900 (e.g., controller 126) of cleaning apparatus 100 according to an embodiment of the present disclosure.


Computing device 900 includes communications fabric 902, which provides communications between cache 916, memory 906, persistent storage 908, communications unit 910, and input/output (I/O) interface(s) 912. Communications fabric 902 can be implemented with any architecture designed for passing data and/or control information between processors (such as microprocessors, communications and network processors, etc.), system memory, peripheral devices, and any other hardware components within a system. For example, communications fabric 902 can be implemented with one or more buses or a crossbar switch.


Memory 906 and persistent storage 908 are computer readable storage media. In this embodiment, memory 906 includes random access memory (RAM). In general, memory 906 can include any suitable volatile or non-volatile computer readable storage media. Cache 916 is a fast memory that enhances the performance of computer processor(s) 904 by holding recently accessed data, and data near accessed data, from memory 906.


Programs may be stored in persistent storage 908 and in memory 906 for execution and/or access by one or more of the respective computer processors 904 via cache 916. In an embodiment, persistent storage 908 may include a magnetic hard disk drive. Alternatively, or in addition to a magnetic hard disk drive, persistent storage 908 may include a solid-state hard drive, a semiconductor storage device, read-only memory (ROM), erasable programmable read-only memory (EPROM), flash memory, or any other computer readable storage media that is capable of storing program instructions or digital information.


The media used by persistent storage 908 may also be removable. For example, a removable hard drive may be used for persistent storage 908. Other examples include optical and magnetic disks, thumb drives, and smart cards that are inserted into a drive for transfer onto another computer readable storage medium that is also part of persistent storage 908.


Communications unit 910, in these examples, provides for communications with other data processing systems or devices. In these examples, communications unit 910 includes one or more network interface cards. Communications unit 910 may provide communications through the use of either or both physical and wireless communications links. Programs, as described herein, may be downloaded to persistent storage 908 through communications unit 910.


I/O interface(s) 912 allows for input and output of data with other devices that may be connected to controller 140. For example, I/O interface 912 may provide a connection to external devices 918 such as a surface cleaning module (e.g., a mop module), a surface module, a keyboard, a keypad, a touch screen, and/or some other suitable input device. External devices 918 can also include portable computer readable storage media such as, for example, thumb drives, portable optical or magnetic disks, and memory cards. Software and data 914 used to practice embodiments of the present disclosure can be stored on such portable computer readable storage media and can be loaded onto persistent storage 908 via I/O interface(s) 912. I/O interface(s) 912 also connect(s) to a display 920.


Display 920 provides a mechanism to display data to a user and may be, for example, a computer monitor.


Software and data 914 described herein is identified based upon the application for which it is implemented in a specific embodiment of the invention. However, it should be appreciated that any particular program nomenclature herein is used merely for convenience, and thus the invention should not be limited to use solely in any specific application identified and/or implied by such nomenclature.


The programs described herein are identified based upon the application for which they are implemented in a specific embodiment of the invention. However, it should be appreciated that any particular program nomenclature herein is used merely for convenience, and thus the invention should not be limited to use solely in any specific application identified and/or implied by such nomenclature.


The present disclosure may be a computer system, a computer-implemented method, and/or a computer program product. The computer program product may include a computer readable storage medium (or media) having computer readable program instructions thereon for causing a processor to carry out aspects of the present disclosure.


The computer readable storage medium can be any tangible device that can retain and store instructions for use by an instruction execution device. The computer readable storage medium may be, for example, but is not limited to, an electronic storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination of the foregoing. A non-exhaustive list of more specific examples of the computer readable storage medium includes the following: a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), a static random access memory (SRAM), a portable compact disc read-only memory (CD-ROM), a digital versatile disk (DVD), a memory stick, a floppy disk, a mechanically encoded device such as punch-cards or raised structures in a groove having instructions recorded thereon, and any suitable combination of the foregoing. A computer readable storage medium, as used herein, is not to be construed as being transitory signals per se, such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagating through a waveguide or other transmission media (e.g., light pulses passing through a fiber-optic cable), or electrical signals transmitted through a wire.


Computer readable program instructions described herein can be downloaded to respective computing/processing devices from a computer readable storage medium or to an external computer or external storage device via a network, for example, the Internet, a local area network, a wide area network and/or a wireless network. The network may comprise copper transmission cables, optical transmission fibers, wireless transmission, routers, firewalls, switches, gateway computers and/or edge servers. A network adapter card or network interface in each computing/processing device receives computer readable program instructions from the network and forwards the computer readable program instructions for storage in a computer readable storage medium within the respective computing/processing device.


Computer readable program instructions for carrying out operations of the present disclosure may be assembler instructions, instruction-set-architecture (ISA) instructions, machine instructions, machine dependent instructions, microcode, firmware instructions, state-setting data, or either source code or object code written in any combination of one or more programming languages, including an object oriented programming language such as Smalltalk, C++ or the like, and conventional procedural programming languages, such as the “C” programming language or similar programming languages. The computer readable program instructions may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the latter scenario, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet Service Provider). In some embodiments, electronic circuitry including, for example, programmable logic circuitry, field-programmable gate arrays (FPGA), or programmable logic arrays (PLA) may execute the computer readable program instructions by utilizing state information of the computer readable program instructions to personalize the electronic circuitry, in order to perform aspects of the present disclosure. Aspects of the present disclosure are described herein with reference to flowchart illustrations and/or block diagrams of computer-implemented methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and/or block diagrams, and combinations of blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer readable program instructions.


These computer readable program instructions may be provided to a processor of a general purpose computer, a special purpose computer, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions/acts specified in the flowchart and/or block diagram block or blocks. These computer readable program instructions may also be stored in a computer readable storage medium that can direct a computer, a programmable data processing apparatus, and/or other devices to function in a particular manner, such that the computer readable storage medium having instructions stored therein comprises an article of manufacture including instructions which implement aspects of the function/act specified in the flowchart and/or block diagram block or blocks.


The computer readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device to cause a series of operational steps to be performed on the computer, other programmable apparatus or other device to produce a computer implemented process, such that the instructions which execute on the computer, other programmable apparatus, or other device implement the functions/acts specified in the flowchart and/or block diagram block or blocks.


The flowchart and block diagrams in the Figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present disclosure. In this regard, each block in the flowchart or block diagrams may represent a module, a segment, or a portion of instructions, which comprises one or more executable instructions for implementing the specified logical function(s). In some alternative implementations, the functions noted in the blocks may occur out of the order noted in the Figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems that perform the specified functions or acts or carry out combinations of special purpose hardware and computer instructions.


Embodiments of the present disclosure recognize that boiler or hot water tank systems suffer from rudimentary thermal heating elements (e.g., resistive) provide intentional heating processes in various settings. For example, some resistance-based heating elements consume relatively large volumes of space within a tank or boiler. They also limit the time required to increase temperatures to a desired temperature for a particular application. To improve on these technical challenges, embodiments described herein employ thick film boiler systems to improve efficiencies and user results when employed in an application requiring the use of hot water and/or steam.


Accordingly, in one embodiment the present disclosure provides a steam mop comprising: a battery to provide battery power; a fluid reservoir for holding liquid; at least heating element in fluid communication with the fluid reservoir; one or more temperature sensors coupled to the at least one heating element; and a controller in communication with the one or more temperature sensors and the at least one heating element, the controller is configured to operate in a cordless mode to control and energize the at least one heating element in a first high power mode and a second low power mode using battery power, based on, at least in part, temperature data received from the one or more temperature sensors; wherein the high power mode provides a greater amount of power to the at least one heating element than the low power mode.


In another embodiment, the present disclosure provides a steam mop comprising: a battery to provide battery power; a fluid reservoir for holding liquid; at least one heating element in fluid communication with the fluid reservoir; one or more temperature sensors coupled to the at least one heating element; a mister in fluid communication with the fluid reservoir, the mister is configured to generate a mist; and a controller in communication with the one or more temperature sensors and the at least one heating element, the controller is configured to operate in a cordless mode to control and energize the at least one heating element in a first high power mode and a second low power mode using battery power, based on, at least in part, temperature data received from the one or more temperature sensors; wherein the high power mode provides a greater amount of power to the at least one heating element than the low power mode; the controller is further configured to control and energize the mister to generate mist using battery power.


In still another embodiment, the present disclosure provides a steam mop comprising: a body portion that includes: a battery to provide battery power; a fluid reservoir for holding liquid; and a controller; and a steam head portion that includes: at least one heating element in fluid communication with the fluid reservoir; one or more temperature sensors coupled to the at least one heating element; and a mister in fluid communication with the fluid reservoir, the mister is configured to generate a mist; wherein the controller is in communication with the one or more temperature sensors and the at least one heating element, the controller is configured to operate in a cordless mode to control and energize the at least one heating element in a first high power mode and a second low power mode using battery power, based on, at least in part, temperature data received from the one or more temperature sensors; wherein the high power mode provides a greater amount of power to the at least one heating element than the low power mode; the controller is further configured to control and energize the mister to generate mist using battery power.


The descriptions of the various embodiments of the present disclosure have been presented for purposes of illustration but are not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the present disclosure. The terminology used herein was chosen to best explain the principles of the embodiment, the practical application or technical improvement over technologies found in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.


As used in this application and in the claims, a list of items joined by the term “and/or” can mean any combination of the listed items. For example, the phrase “A, B and/or C” can mean A; B; C; A and B; A and C; B and C; or A, B and C. As used in this application and in the claims, a list of items joined by the term “at least one of” can mean any combination of the listed terms. For example, the phrases “at least one of A, B or C” can mean A; B; C; A and B; A and C; B and C; or A, B and C.


The terms and expressions which have been employed herein are used as terms of description and not of limitation, and there is no intention, in the use of such terms and expressions, of excluding any equivalents of the features shown and described (or portions thereof), and it is recognized that various modifications are possible within the scope of the claims. Accordingly, the claims are intended to cover all such equivalents. Various features, aspects, and embodiments have been described herein. The features, aspects, and embodiments are susceptible to combination with one another as well as to variation and modification, as will be understood by those having skill in the art. The present disclosure should, therefore, be considered to encompass such combinations, variations, and modifications.


Reference throughout this specification to “one embodiment” or “an embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, appearances of the phrases “in one embodiment” or “in an embodiment” in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

Claims
  • 1. A steam mop comprising: a battery to provide battery power;a fluid reservoir for holding liquid;at least heating element in fluid communication with the fluid reservoir;one or more temperature sensors coupled to the at least one heating element; anda controller in communication with the one or more temperature sensors and the at least one heating element, the controller is configured to operate in a cordless mode to control and energize the at least one heating element in a first high power mode and a second low power mode using battery power, based on, at least in part, temperature data received from the one or more temperature sensors; wherein the high power mode provides a greater amount of power to the at least one heating element than the low power mode.
  • 2. The steam mop of claim 1, wherein the one or more temperature sensors includes a first thermostat configured to operate at a first temperature and a second thermostat configured to operate at a second temperature.
  • 3. The steam mop of claim 2, wherein the first temperature corresponds to a temperature of the second operating mode, and the second temperature corresponds to a temperature of the first operating mode; wherein the first temperature is approximately 50% less than the second temperature.
  • 4. The steam mop of claim 1, wherein the at least one heating element comprises at least one of: a thick film heating element including a 2-dimensional composite layer and comprises at least a substrate layer as a base layer, a heater track layer on top of the substrate layer, and an enamel protective layer on top of the heater track layer; and/or a thick film tubular boiler heating element.
  • 5. The steam mop of claim 1, wherein the controller is configured to determine if AC power is available or if only battery power is available; if AC power is available, the controller is configured to operate in a corded mode to: control and energize the at least one thick film heating to heat the liquid to selected temperature to produce steam and wherein the at least one temperature sensor provides temperature data of the heated liquid to the controller; and if only battery power is available, the controller is configured to operate in the cordless mode.
  • 6. The steam mop of claim 1, further comprising a mister in fluid communication with the fluid reservoir, the mister is configured to generate a mist.
  • 7. The steam mop of claim 6, wherein the controller is further configured to control operation of the mister in the corded and cordless operating modes.
  • 8. The steam mop of claim 6, wherein the at least one heating element is in fluid communication with the fluid reservoir via a first fluid communication path; and wherein the mister is in fluid communication with the fluid reservoir via a second fluid communication path.
  • 9. The steam mop of claim 6, wherein the mister is a piezoelectric mister.
  • 10. The steam mop of claim 1, further comprising a controllable valve disposed between the at least one heating element and the fluid reservoir; wherein the controller is further configured to control the controllable valve to deliver a selected amount of liquid from the fluid reservoir to the at least one heating element.
  • 11. The steam mop of claim 1, wherein the liquid includes water, cleaning, and/or disinfection agents.
  • 12. The steam mop of claim 1, further comprising a steam head including a steam pad in fluid communication with a steam output of the at least one heating element.
  • 13. A steam mop comprising: a battery to provide battery power;a fluid reservoir for holding liquid;at least one heating element in fluid communication with the fluid reservoir;one or more temperature sensors coupled to the at least one heating element;a mister in fluid communication with the fluid reservoir, the mister is configured to generate a mist; anda controller in communication with the one or more temperature sensors and the at least one heating element, the controller is configured to operate in a cordless mode to control and energize the at least one heating element in a first high power mode and a second low power mode using battery power, based on, at least in part, temperature data received from the one or more temperature sensors; wherein the high power mode provides a greater amount of power to the at least one heating element than the low power mode; the controller is further configured to control and energize the mister to generate mist using battery power.
  • 14. The steam mop of claim 13, wherein the one or more temperature sensors includes a first thermostat configured to operate at a first temperature and a second thermostat configured to operate at a second temperature.
  • 15. The steam mop of claim 14, wherein the first temperature corresponds to a temperature of the second operating mode, and the second temperature corresponds to a temperature of the first operating mode; wherein the first temperature is approximately 50% less than the second temperature.
  • 16. The steam mop of claim 13, wherein the at least one heating element comprises at least one of: a thick film heating element including a 2-dimensional composite layer and comprises at least a substrate layer as a base layer, a heater track layer on top of the substrate layer, and an enamel protective layer on top of the heater track layer; and/or a thick film tubular boiler heating element.
  • 17. The steam mop of claim 13, wherein the controller is configured to determine if AC power is available or if only battery power is available; if AC power is available, the controller is configured to operate in a corded mode to: control and energize the at least one thick film heating to heat the liquid to selected temperature to produce steam and wherein the at least one temperature sensor provides temperature data of the heated liquid to the controller; and if only battery power is available, the controller is configured to operate in the cordless mode.
  • 18. The steam mop of claim 17, wherein the controller is further configured to control and energize the mister in the corded operating mode to generate mist.
  • 19. The steam mop of claim 13, wherein the at least one heating element is in fluid communication with the fluid reservoir via a first fluid communication path; and wherein the mister is in fluid communication with the fluid reservoir via a second fluid communication path.
  • 20. The steam mop of claim 13, wherein the mister is a piezoelectric mister.
  • 21. The steam mop of claim 13, further comprising a controllable valve disposed between the at least one heating element and the fluid reservoir; wherein the controller is further configured to control the controllable valve to deliver a selected amount of liquid from the fluid reservoir to the at least one heating element.
  • 22. The steam mop of claim 13, wherein the liquid includes water, cleaning, and/or disinfection agents.
  • 23. The steam mop of claim 13, further comprising a steam head including a steam pad in fluid communication with a steam output of the at least one heating element.
  • 24. A steam mop comprising: a body portion that includes: a battery to provide battery power;a fluid reservoir for holding liquid; anda controller; anda steam head portion that includes: at least one heating element in fluid communication with the fluid reservoir;one or more temperature sensors coupled to the at least one heating element; anda mister in fluid communication with the fluid reservoir, the mister is configured to generate a mist;wherein the controller is in communication with the one or more temperature sensors and the at least one heating element, the controller is configured to operate in a cordless mode to control and energize the at least one heating element in a first high power mode and a second low power mode using battery power, based on, at least in part, temperature data received from the one or more temperature sensors; wherein the high power mode provides a greater amount of power to the at least one heating element than the low power mode; the controller is further configured to control and energize the mister to generate mist using battery power.
  • 25. The steam mop of claim 24, wherein the one or more temperature sensors includes a first thermostat configured to operate at a first temperature and a second thermostat configured to operate at a second temperature.
  • 26. The steam mop of claim 25, wherein the first temperature corresponds to a temperature of the second operating mode, and the second temperature corresponds to a temperature of the first operating mode; wherein the first temperature is approximately 50% less than the second temperature.
  • 27. The steam mop of claim 24, wherein the at least one heating element comprises at least one of: a thick film heating element including a 2-dimensional composite layer and comprises at least a substrate layer as a base layer, a heater track layer on top of the substrate layer, and an enamel protective layer on top of the heater track layer; and/or a thick film tubular boiler heating element.
  • 28. The steam mop of claim 24, wherein the controller is configured to determine if AC power is available or if only battery power is available; if AC power is available, the controller is configured to operate in a corded mode to: control and energize the at least one thick film heating to heat the liquid to selected temperature to produce steam and wherein the at least one temperature sensor provides temperature data of the heated liquid to the controller; and if only battery power is available, the controller is configured to operate in the cordless mode.
  • 29. The steam mop of claim 28, wherein the controller is further configured to control and energize the mister in the corded operating mode to generate mist.
  • 30. The steam mop of claim 24, wherein the at least one heating element is in fluid communication with the fluid reservoir via a first fluid communication path; and wherein the mister is in fluid communication with the fluid reservoir via a second fluid communication path.
  • 31. The steam mop of claim 24, wherein the mister is a piezoelectric mister.
  • 32. The steam mop of claim 24, further comprising a controllable valve disposed between the at least one heating element and the fluid reservoir; wherein the controller is further configured to control the controllable valve to deliver a selected amount of liquid from the fluid reservoir to the at least one heating element.
  • 33. The steam mop of claim 24, wherein the liquid includes water, cleaning, and/or disinfection agents.
  • 34. The steam mop of claim 24, wherein the steam head further comprising a steam pad in fluid communication with a steam output of the at least one heating element.
  • 35. The steam mop of claim 24, wherein the steam head further comprising an agitator assembly configured to scrub and loosen dirt and debris on a surface to be cleaned.
  • 36. The steam mop of claim 24, further comprising at least one user-selectable switch to enable the controller to operate the at least one heating element in the low power mode and the high power mode, and the mister.
  • 37. The steam mop of claim 24, further comprising at least one motion sensor in communication with the controller, the at least one motion sensor is configured to detect motion of the body and steam head; wherein the controller is further configured to discontinue power to the at least one heating element if the motion sensor detects that the body and steam head are stationary.
  • 38. The steam mop of claim 5, wherein the battery comprises a rechargeable battery and wherein the controller is configured to recharge the rechargeable battery based on the determination if AC power is present.
  • 39. The steam mop of claim 17, wherein the battery comprises a rechargeable battery and wherein the controller is configured to recharge the rechargeable battery based on the determination if AC power is present.
  • 40. The steam mop of claim 28, wherein the battery comprises a rechargeable battery and wherein the controller is configured to recharge the rechargeable battery based on the determination if AC power is present.
CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application Ser. No. 63/460,552, filed 19 Apr. 2023, which is hereby incorporated by reference in its entirety.

Provisional Applications (1)
Number Date Country
63460552 Apr 2023 US