Patent Application
20220193989
The invention concerns the technology of stereolithographic 3D printing, also known as stereolithographic additive manufacturing. In particular, the invention concerns stereolithography apparatuses with photomask-based exposure arrangements.
Stereolithography is a 3D printing or additive manufacturing technique in which optical radiation is used to photopolymerize suitable raw material to produce the desired object. The raw material comes to the process in the form of a resin. A vat is used to hold an amount of resin, and a build platform is moved in the vertical direction so that the object to be produced grows layer by layer, beginning on a build surface of the build platform. The optical radiation used for photopolymerizing may come from above the vat, in which case the build platform moves downwards through the remaining resin as the manufacturing proceeds. The present description concerns in particular the so-called “bottom up” variant of stereolithography, in which the photopolymerizing optical radiation comes from below the vat and the build platform moves upwards away from the remaining resin as the manufacturing proceeds.
Resins used in stereolithographic 3D printing have a recommended operating temperature in which the resin fluidness and viscosity is optimal for the printing process. In most cases the recommended temperature is greater than the typical room temperature. In known solutions, the resin is heated by heating resistors which may be integrated in the vat. The problem of such solutions is that the heating process is slow and inefficient because the heating energy is first transferred into the vat then into the resin. For the same reason, it is difficult to control the temperature (heating and cooling) of the resin as the temperature change is slow.
The invention is aimed to present a stereolithography apparatus and a method of operating it so that heating of the resin in a stereolithography apparatus is improved.
According to a first aspect, a stereolithography apparatus has an exposure arrangement, comprising a radiative element configured to emit optical radiation, and a masking element configured to form an exposure pattern by partially masking optical radiation from the radiative element, a table having a horizontal upper surface on which a vat is placeable for holding resin to be photopolymerized in a stereolithographic 3D printing process by the optical radiation, wherein the masking element is arranged in thermal connection with the horizontal upper surface, and the apparatus further comprises a controller, coupled to said radiative element, for emitting optical radiation from the radiative element to the masking element, and to said masking element, for keeping the masking element closed, wherein the controller is configured to execute a pre-heating process for the resin to heat the resin in the vat by emitting optical radiation from the radiative element to the closed masking element whereby the masking element is heated by the optical radiation absorbed in the masking element and thermal energy is further transferred to the resin.
In an embodiment of the stereolithography apparatus a temperature detector is provided within the apparatus for measuring the temperature of the resin.
In an embodiment of the stereolithography apparatus said controller is coupled to the temperature detector to receive resin temperature data from said temperature detector, wherein said controller is configured to use said resin temperature data in controlling the pre-heating process of the stereolithography apparatus.
In an embodiment of the stereolithography apparatus said masking element comprises a liquid crystal element.
In an embodiment of the stereolithography apparatus said radiative element comprises a light-emitting diode (LED) source.
In an embodiment of the stereolithography apparatus said light-emitting diode source comprises an array of LED elements, which surface area is substantially equal to the surface area of the masking element.
In an embodiment of the stereolithography apparatus said apparatus comprises a cooling channel between the radiative element and the masking element.
In an embodiment of the stereolithography apparatus said cooling channel is planar and extends along that side surface of said masking element that is directed towards the radiative element.
In an embodiment of the stereolithography apparatus said apparatus further comprises an optical imaging detector having a field of view, directed so that at least part of a working region above the horizontal upper surface is within said field of view when said optical imaging detector is in an operating position.
In an embodiment of the stereolithography apparatus said a controller coupled to the optical imaging detector for receiving optical imaging data from said optical imaging detector, wherein the controller is configured to use said optical imaging data in the pre-heating process for the resin.
In an embodiment of the stereolithography apparatus said controller is configured to execute a machine vision process to recognize objects from said optical image data and to make decisions based on such recognized objects.
According to a second aspect, a method for pre-heating the resin within the stereolithography apparatus according to any of the preceding claims, comprises the steps of:
According to a third aspect, a computer program comprises instructions which, when the program is executed by a computer, cause the computer to carry out the steps of:
It is to be understood that the embodiments of the invention described above may be used in any combination with each other. Several of the embodiments may be combined together to form a further embodiment of the invention.
The accompanying drawings, which are included to provide a further understanding of the invention and constitute a part of this specification, illustrate embodiments of the invention and together with the description help to explain the principles of the invention. In the drawings:
Concerning the stereolithography apparatuses discussed in this detailed description, the following shall be noted.
A stereolithography apparatus can also be called a stereolithographic 3D printer, or a stereolithographic additive manufacturing apparatus. A stereolithography apparatus may be a 3D printer for fabrication of dental objects. It may be a 3D printer for creating dental splints, models, surgical guides, temporary fillings, and orthodontic models with true precision and efficiency. Additionally or alternatively, a stereolithography apparatus may be a 3D printer for fabrication of any stereolithographically 3D-printable objects other than dental objects.
A vat 401 may be provided in the base part 101 for holding resin for use in the stereolithographic 3D printing process. The vat 401 may be a fixed part of the stereolithography apparatus or the base part 101 may comprise a holder for receiving a removable vat. The holder may be for example a table having an essentially horizontal upper surface on which a vat 401 is placeable. Additionally or alternatively the holder may comprise support rails, alignment aids, locking mechanisms, and/or other comparable means configured to support a vat and/or to ensure that it assumes and remains in the appropriate location. In this description all references to the vat 401 are to be understood to cover both a fixed vat arrangement and an arrangement in which a removable vat 401 can be received in a holder of said kind. The bottom of the vat 401 may be transparent or translucent for the kind of optical radiation used for photopolymerizing the resin.
A build platform 402 with a build surface 403 is supported above the vat 401 so that the build surface 403 faces the vat 401. This arrangement is typical to the so-called “bottom up” variant of stereolithography, in which the photopolymerizing radiation comes from below the vat. The bottom of the vat 401 is or can be selectively made transparent or translucent for the kind of radiation used for said photopolymerizing.
A moving mechanism is provided and configured to move the build platform 402 in a working movement range between first and second extreme positions. Of these, the first extreme position is the one proximal to the vat 401, and the second extreme position is the one distant from the vat 401. In the first extreme position the build surface 403 is very close to the bottom of the vat 401. The first layer of the object to be manufactured will be photopolymerized onto the build surface 403 when the build platform 402 is in the first extreme position. Consequently, in said first extreme position the distance between the build surface 403 and the bottom of the vat 401 is in the order of the thickness of one layer in the stereolithographic 3D printing process.
The position shown in
In the embodiment of
The horizontal support 404 of the build platform 402 is shown only schematically in the drawings. In a practical implementation a support of the build platform 402 may comprise various advanced technical features, like joints and/or fine tuning mechanisms for ensuring that the orientation of the build surface 403 is appropriate. However, such features are out of the scope of this description and are therefore omitted here.
Another feature of the exemplary stereolithography apparatus of
A “radiative element” may refer to an element which may form, as such, a complete, operable source of optical radiation. Alternatively, a radiative element may be used as one element of a complete radiative assembly comprising also other elements, units, and/or structures.
A radiative element may comprise any type of radiation source, e.g., an incandescent or other thermal radiation source, a luminescent radiation source, and/or an electric arc or a gas discharge lamp. In a preferred embodiment, a radiative element comprises a light-emitting diode (LED) source. Said LED source may comprise one LED element (601) or a plurality of LED elements, for example, an array of LED elements (601).
In the embodiments of
A “masking area” may refer to a part of a surface of a masking element configured to receive and/or to be illuminated by optical radiation emitted by a radiative element. Additionally or alternatively, “masking area” may refer to a part of a surface of a masking element such that the masking element has spatially and/or temporally variable transmissive and/or reflective properties for optical radiation to be emitted by a radiative element and incident onto the part of the surface of the masking element.
A masking area may be partially or entirely definable based on a spatial intensity distribution of optical radiation to be emitted by a radiative element and incident onto the masking element. For example, a masking area may be definable as parts of at least one surface of a masking element, wherein intensity of optical radiation to be emitted by a radiative element is configured to be at least 50% of a maximum intensity of optical radiation to be emitted by the radiative element on the surface of the masking element. A “substantially rectangular masking area” may refer to a projection of a masking area having a substantially rectangular shape on at least one plane. A substantially rectangular masking area may preferably be substantially planar. In this specification, the term “substantially rectangular” is used in a broad sense, comprising, for example, rectangles with rounded or beveled corners.
“Forming an exposure pattern by partially masking” may refer to configuring a masking element such that optical radiation emitted by a radiative element may propagate onto the masking area and, from the masking area, a part of the optical radiation may propagate further into a working region.
A masking element may comprise a sheet, plate, or film with spatially varying transmittance and/or reflectance for optical radiation emitted by a radiative element, forming at least a part of a masking area. The sheet, plate, or film may comprise a substrate material transparent or translucent to optical radiation emitted by the radiative element, e.g., glass, quartz, plastic, and/or sapphire, and a masking material, e.g., a metal and/or ink, on the substrate material for partially masking optical radiation emitted by the radiative element.
In the embodiment of
A transmissive liquid crystal element may comprise, for example: a first polarizing filter for polarizing optical radiation, which is emitted by a radiative element and incident onto a masking area, along a first direction; a first substrate transparent for optical radiation emitted by the radiative element; a first plurality of transparent electrodes arranged onto the first substrate, shapes thereof at least partially defining exposure patterns producible in a working region; a twisted nematic liquid crystal layer; a second plurality of transparent electrodes, shapes thereof at least partially defining the exposure patterns producible in the working region; a second substrate transparent for optical radiation emitted by the radiative element, wherein the second plurality of transparent electrodes may be arranged onto the second substrate; and a second polarizing filter with its polarizing axis oriented perpendicular to the first direction.
In the embodiments of
As commonly known in the art, an “optical path” may refer to a path that optical radiation takes, while propagating through an optical medium or system. Consequently, an “optical path between a radiative element and a masking area” may refer to parts of an exposure arrangement being arranged such that at least some optical radiation from a radiative element may be incident onto a masking area. Generally, an exposure arrangement may comprise a plurality of optical paths between a radiative element and a masking area. An exposure arrangement may also comprise a plurality of optical paths between any of a plurality of radiative elements and any of a plurality of masking areas.
An exposure arrangement may comprise reflective optical components, e.g., mirrors and/or beamsplitters; refractive optical components, e.g., prisms and/or lenses; diffractive optical components, e.g., diffusers, gratings and/or Fresnel lenses; and/or fiber-optical components along an optical path. In some embodiments, an optical path may exist even if said components were to be removed from the stereolithography apparatus. In some embodiments, removal of said components may break an optical path. In such case, said components may be central to the operation of the exposure arrangement. In some embodiments, an exposure arrangement may comprise none of said components along an optical path.
The embodiment shown in
The masking element 506 is provided at a suitable location between the radiative element 505 and the vat 401, which is placed on the horizontal upper surface 503, for allowing only selected portions of the generated radiation to reach the resin in the vat 401. In order to avoid diffraction-induced inaccuracy in the borderlines between photopolymerized and unpolymerized resin, it is advantageous to place the masking element 506 as close to the currently affected layer of resin as possible. The “bottom up” variant of stereolithography is considered here, which means that the masking element 506 is most advantageously under the bottom surface of the vat 401 and as close to it as possible. In typical applications of the “bottom up” variant of stereolithography the build surface of the build platform is planar, and consequently also the bottom of the vat 401 and the masking element 506 are both planar.
As the radiative element is turned on and kept on, and the optical radiation is emitted towards the masking element 506, the optical radiation is absorbed in the masking element causing it to warm up. The masking element may be closed, i.e. the masking element is turned black for masking as much as possible of the optical radiation from the radiative element and, thus, warming up in the most efficient way. As the masking element 506 is in thermal connection with the horizontal upper surface 503, thermal energy may be transferred into the object placed on the horizontal upper surface 503, i.e. the bottom of the vat, placed on the surface, is warmed up. Further, when the resin is supplied into the vat 401, the resin may be warmed up by the thermal energy transferred from the masking element 506.
The stereolithography apparatus may comprise at least one controller, which is described in more detail below.
In an embodiment, a controller 605 may be coupled to the radiative element 505 and to the masking element 506, and said controller 605 may be configured to execute a pre-heating process for the resin to heat the resin in the vat by emitting of the optical radiation from the radiative element and the keeping the masking element closed. The coupling between the controller 605 and radiative element 506 and the masking element may be a wired coupling or a wireless coupling, or it may comprise both wired and wireless elements either as alternatives of each other or augmenting each other.
In an embodiment, the radiative element 505 comprises a light-emitting diode (LED) source, which may comprise an array of LED elements 601. The array of LED elements 601 may have a surface area substantially equal to the surface area of the masking element 506. Consequently, the intensity of the optical radiation emitted from the radiative element may be uniform.
In an embodiment, the stereolithography apparatus comprises a temperature detector 604 for measuring the temperature of the resin. The temperature detector may comprise an infrared sensor to detect the infrared energy emitted from the resin and means to convert the radiant power to an electrical signal. The controller 605 may be coupled with the temperature detector 604 to receive the electrical signal, i.e. resin temperature data from the temperature detector 604. The controller 605 may be configured to use said resin temperature data in controlling the pre-heating process of the stereolithography apparatus. The controller 605 may receive resin temperature data from the temperature detector constantly and it may adjust the pre-heating process based on said resin temperature data, i.e. closed-loop system. The controller 605 may be configured to the pre-heating process when the resin temperature is desired, i.e. the temperature data received from the temperature detector is desired.
Significant advantage can be gained by providing the stereolithography apparatus with an optical imaging detector as in embodiment of
The stereolithography apparatus shown in
The controller 605 may be installed in the lid 102, but it could alternatively be installed in the base part 101. The controller functionality could even be distributed so that some parts of it could be implemented with circuits located in the lid 102 while other parts of the controller functionality could be implemented with circuits located in the base part 101. Placing the controller in the lid 102 may be advantageous if also a significant portion of the other electronics, like the user interface, is placed in the lid 102, because wiring may become simpler. The user interface is not shown in
The controller 605 may be configured to execute a machine vision process to recognize objects from the optical image data it receives from the optical imaging detector 802. The optical image data is essentially a digital representation of an image recorded by the optical imaging detector 802, and machine vision in general means extracting information from an image. Thus by executing a machine vision process the controller 605 is capable of extracting information that enables recognizing various objects seen by the optical imaging detector 802. The controller 605 may be configured to make decisions based on such recognized objects.
One example of an object that the controller 605 may recognize is a resin capsule, or a piece of graphically represented information carried by a resin capsule. In order to provide some background for this kind of applications, the task of resin handling is described in some more detail in the following.
The information carried by the piece 703 of graphically represented information is or reveals advantageously something that is pertinent to just that resin that is contained in that particular resin capsule 702. Additionally or alternatively the information carried by the piece 703 of graphically represented information may be or reveal something that is pertinent to that particular resin capsule itself. Said information may contain for example one or more of the following: an identifier of resin contained in the resin capsule 702, an indicator of amount of resin contained in the resin capsule 702, a manufacturing date of resin contained in the resin capsule 702, a best before date of resin contained in the resin capsule 702, unique identifier of the resin capsule 702, a digital signature of a provider of resin contained in the resin capsule 702.
As an interesting special case, the information carried by the piece 703 of graphically represented information may contain a piece of parameter data. The controller 605, on the other hand, may be configured to use such a piece of parameter data as a value of an operating parameter of the stereolithography apparatus. Examples of such operating parameters include but are not limited to the following: a preheating temperature of resin, a layer exposure time, a layer thickness, a moving speed of a build platform, or a waiting time between two successive method steps in stereolithographic 3D printing.
The use of an optical imaging detector involves the particular advantage that the same optical imaging detector can be used also for other purposes in the stereolithography apparatus. Such other purposes may even substantiate the provision of an optical imaging detector even if it is not used for reading graphically represented information from resin tanks. It may be used for example detecting the resin level in the vat.
In some cases, the resin may be warmer than the optimal operating temperature for said resin. For example, during the printing process, the resin may warm up above the optimal operating temperature. Thus, in an embodiment, the stereolithography apparatus comprises a cooling channel 901 between the masking element 506 and the radiative element 505 to for cooling the masking element and further cooling the resin in the vat 401. A cooling channel is generally defined as a passage through which a fluid cooling medium may flow. Liquids, such as water, may have a relatively high specific heat capacity and are therefore relatively efficient for use as fluid cooling mediums. However, in the particular framework of stereolithographic 3D printing they have also disadvantages. Water, for example, attenuates quite strongly ultraviolet radiation, i.e. the wavelengths that should pass through to the desired portions of resin to cause photopolymerization. Gas bubbles may form in water when it gets heated, which causes anomalies in the propagation of radiation through the water. Water may leak into unwanted parts in the apparatus or even out of the apparatus, which in turn may cause all kind of harm and even hazards.
For these reasons it has been considered more advantageous to use a coolant gas as the fluid cooling medium. The most readily available coolant gas is air. As illustrated schematically in
The most important cooling mechanism achieved with a forced flow of coolant gas is forced heat convection, which means that the coolant gas absorbs heat from the walls of the cooling channel(s) and transports the absorbed heat away when it flows through the outlet(s) of the cooling channel(s). Forced heat convection works the most effectively when the temperature difference is large between the surface to be cooled and the fluid cooling medium flowing past it, and when the flow of the fluid cooling medium is strong and turbulent. A strong flow is easy to take care of by providing a sufficiently powerful blower 902 and a sufficiently large cross section of all channels through which the coolant gas must flow. In order to make the temperature difference larger it is possible to equip the stereolithography apparatus with a precooler, through which the coolant gas is made to flow before it flows into the cooling channel(s) 901. Precoolers of various kinds are known as such and are therefore not described here in more detail. In order to make the flow turbulent the cooling channel(s) may be designed with some internal features and/or dimensions that disturb any otherwise laminar flow and cause turbulence.
In an embodiment, the cooling channel 901 is a planar and extends along that side surface of said masking element 506 that is directed towards the radiative element.
In an embodiment, a controller is connected to a memory comprising a computer program comprising instructions which, when the program is executed by a computer, cause the computer for pre-heating a resin within a stereolithography apparatus to carry out the steps of:
closing the exposure pattern of the masking element 506,
keeping on the radiative element 505 and emitting optical radiation from the radiative element to the masking element for heating the masking element from which the thermal energy is transferred into the resin in the vat.
A controller 1001 has a central role in the operation of the apparatus. Structurally and functionally it may be based on one or more processors configured to execute machine-readable instructions stored in one or more memories that may comprise at least one of built-in memories or detachable memories.
A lid mechanism 1002 comprises the mechanical and electrical parts that serve the purpose of moving the lid that opens or closes the working region.
A build platform mechanism 1003 comprises the mechanical and electrical parts that serve the purpose of moving the build platform between its first and second extreme positions. The build platform mechanism 1003 may also comprise parts that serve to ensure correct angular positioning of the build platform.
A resin delivery mechanism 1004 comprises the mechanical and electrical parts that serve the purpose of pumping resin into the vat, and possibly draining unused resin from the vat back into some long-term repository.
An exposure arrangement 1005 comprises the mechanical, electrical, and optical parts that serve the purpose of controllably emitting radiation that causes selective photopolymerization of resin during the stereolithographic 3D printing process.
A reader(s) and/or sensor(s) block 1006 comprises all devices that can be classified as readers or sensors. For example all optical imaging detectors of the kind described earlier, as well as optical radiation emitters that serve other purposes than photopolymerizing resin during the stereolithographic 3D printing process belongs to the reader(s) and/or sensor(s) block 1006.
The stereolithography apparatus may comprise a data interface 1007 for exchanging data with other devices. The data interface 1007 can be used for example to receive from some other device the 3D modelling data that describes, what kind of an object should be produced through stereolithographic 3D printing. The data interface 1007 can also be used to provide diagnostic data about the operation of the stereolithography apparatus to other devices, such as a monitoring computer.
The stereolithography apparatus may comprise a user interface 1008 for exchanging information with one or more users. The user interface 1008 may comprise tangible, local user interface means for facilitating immediate interaction with a user next to the stereolithography apparatus. Additionally or alternatively the user interface 1008 may comprise software and communication means for facilitating remote operation of the stereolithography apparatus for example through a network or through an app installed on a separate user's device such as a smartphone or other personal wireless communications device.
The stereolithography apparatus may comprise a power block 1009 configured to convert operating power, such as AC from an electricity distribution network, into voltages and currents needed by the various parts of the apparatus and to safely and reliably deliver such voltages and currents to said parts of the apparatus.
Example embodiments may be implemented in software, hardware, application logic or a combination of software, hardware and application logic. The example embodiments can store information relating to various methods described herein. This information can be stored in one or more memories, such as a hard disk, optical disk, magneto-optical disk, RAM, and the like. One or more databases can store the information used to implement the example embodiments. The databases can be organized using data structures (e.g., records, tables, arrays, fields, graphs, trees, lists, and the like) included in one or more memories or storage devices listed herein. The methods described with respect to the example embodiments can include appropriate data structures for storing data collected and/or generated by the methods of the devices and subsystems of the example embodiments in one or more databases.
The components of the example embodiments may include computer readable medium or memories for holding instructions programmed according to the teachings and for holding data structures, tables, records, and/or other data described herein. In an example embodiment, the application logic, software or an instruction set is maintained on any one of various conventional computer-readable media. In the context of this document, a “computer-readable medium” may be any media or means that can contain, store, communicate, propagate or transport the instructions for use by or in connection with an instruction execution system, apparatus, or device, such as a computer. A computer-readable medium may include a computer-readable storage medium that may be any media or means that can contain or store the instructions for use by or in connection with an instruction execution system, apparatus, or device, such as a computer. A computer readable medium can include any suitable medium that participates in providing instructions to a processor for execution. Such a medium can take many forms, including but not limited to, non-volatile media, volatile media, transmission media, and the like.
It is obvious to a person skilled in the art that with the advancement of technology, the basic idea of the invention may be implemented in various ways. The invention and its embodiments are thus not limited to the examples described above; instead they may vary within the scope of the claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 20195330 | Apr 2019 | FI | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/FI2020/050274 | 4/24/2020 | WO | 00 |
