Patent Application
20140049897
1. Technical Field
The present disclosure generally relates to an information handling system and in particular to a storage carrier apparatus and method for providing a common platform in an information handling system to support storage devices of different transverse dimensions.
2. Description of the Related Art
As the value and use of information continue to increase, individuals and businesses seek additional ways to process and store information. One option available to users is information handling systems. An information handling system generally processes, compiles, stores, and/or communicates information or data for business, personal, or other purposes thereby allowing users to take advantage of the value of the information. Because technology and information handling needs and requirements vary between different users or applications, information handling systems may also vary regarding what information is handled, how the information is handled, how much information is processed, stored, or communicated, and how quickly and efficiently the information may be processed, stored, or communicated. The variations in information handling systems allow for information handling systems to be general or configured for a specific user or specific use such as financial transaction processing, airline reservations, enterprise data storage, or global communications. In addition, information handling systems may include a variety of hardware and software components that may be configured to process, store, and communicate information and may include one or more computer systems, data storage systems, and networking systems.
An information handling system (IHS), such as a computer system, may include a plurality of storage devices, such as hard disk drives (HDDs), each coupled to a backplane of the IHS via a backplane connector. As technologies advance, there has been a trend to decrease the physical sizes/dimensions of storage devices, while increasing the capacity and/or storage densities of the storage devices. Thus, for example, the densities of solid state drives (SSD) have continued to increase, commensurate with a decrease in one or more transverse dimensions of SSDs. As a specific example of this trend, 7 mm SSDs and backplanes supporting these 7 mm 2.5″ SSDs have become the standard drive sizes, replacing the traditional 15 mm 2.5″ SSDs and supporting backplanes. A 7 mm SSD (i.e., an SSD which is typically 7.5 mm or less in width or thickness) is about one half in width or thickness when compared to the conventional 15 mm 2.5″ SSD, while providing as much storage as, and in some instances greater storage capacity than, the 15 mm width SSD.
Manufacturers embrace a smaller double density 7 mm 2.5″ HDD, such as 7 mm 2.5″ SSD, by manufacturing IHSs with a backplane having double dense SAS connectors configured for coupling 7 mm 2.5″ SSDs to the backplane. With the double density backplane, a 15 mm 2.5″ SSD cannot be coupled to the backplane as the drive's greater width causes the drive to abut one or more adjacent double dense SAS backplane connectors, which prevents the coupling of the drive's data interface to an opposing backplane connector.
Occasionally, for an IHS built and configured to support storage devices of a higher density and a smaller size, a user may wish to use storage devices of a lower density in such an IHS due to cost consideration and other factors. For example, a user may wish to re-use previously purchased 15 mm 2.5″ SSDs either exclusively or in conjunction with the double density 7 mm 2.5″ SSDs in an IHS with a double density backplane. However, with an IHS that provides the double density backplane, the user would be forced to either have the old 15 mm 2.5″ SSDs externally installed or use an older system with single density backplane to transfer data to the new 7 mm 2.5″ SSDs and completely abandon the old 15 mm 2.5″ SSDs.
One obvious approach to address this issue is adding to the IHS a separate single density backplane. Alternately, the backplane and/or the chassis of the IHS may be modified to support individual 15 mm 2.5″ SSDs. These approaches, however, will inevitably increase backplane and chassis complexity of an IHS, thereby increasing the manufacturing cost thereof.
Disclosed are a storage assembly, system and method for providing a common platform in an information handling system (IHS) to support storage devices of different transverse dimensions. The storage assembly comprises: a first storage device having a data interface for coupling the first storage device to an opposing connector within an array of connectors of an information handling system; and an interposer assembly coupled to the data interface of the first storage device such that the interposer assembly is disposed between and enables coupling of the first storage device to the opposing connector when the first storage device is positioned for coupling to the opposing connector. The interposer assembly causes the first storage device to be displaced laterally away from an adjacent connector of the array of connectors without causing any physical contact with the adjacent connector, while allowing the first storage device to be physically and communicatively coupled to the opposing connector. Also, the first storage device has a transverse dimension which is larger than a corresponding transverse dimension of second storage devices that are specifically designed to compactly couple to adjacent connectors of the array of connectors. Accordingly, a cross spacing available for directly coupling to the adjacent connectors is smaller than the transverse dimension of the first storage device.
According to one aspect, the storage assembly further comprises: a first storage carrier within which the first storage device is physically secured at a first position that provides sufficient spacing at a coupling end of the first storage device for coupling the interposer assembly to the data interface of the first storage device without extending an overall length of the storage assembly. The interposer assembly is positioned in a connecting end of the first storage carrier that is physically proximate to an opposing connector and an adjacent backplane connector array when the first storage carrier is disposed for coupling of the first storage device to the opposing connector. Also, the connecting end of the storage assembly has a corresponding transverse dimension that is substantially close to the transverse dimension of the first storage device. The array of connectors are physically configured to allow an array of second storage devices to compactly couple thereto such that the transverse dimension of each individual space allocated between adjacent connectors is smaller than the transverse dimension of the first storage carrier. In one or more embodiments, the transverse dimension of the first storage device is larger than the corresponding transverse dimension of the second storage devices by a proportional size that allows each first storage device to extend across at least one adjacent connector, while coupled to the opposing connector.
According to one aspect of the disclosure, disclosed is a storage assembly comprising a first storage device compactly disposed in a first storage carrier, with the first storage device having the size of at least one transverse dimension being larger than the size of the similar dimension of a second storage device. The storage assembly further comprises an interposer assembly coupled to a data interface of the first storage device such that the interposer assembly is positioned in a space of the first storage carrier that is physically proximate to an opposing connector and an adjacent connector of an array of connectors when the first storage carrier is placed for coupling the first storage device to the opposing connector. The interposer assembly is disposed between the first storage device and the opposing connector to cause the first storage device to be displaced laterally away from the adjacent connector while allowing the first storage device to be physically and communicatively coupled to the opposing connector without causing any physical contact with the adjacent connector. The array of connectors are physically configured to allow an array of second storage devices to compactly couple to the individual connectors; However, the transverse size of each individual space allocated for coupling is smaller than the transverse dimension of the first storage carrier.
According to another aspect of the disclosure, disclosed is a system that provides a common platform in an information handling system (IHS) to simultaneously support a first storage device and a second storage device with the size of one transverse dimension of the first storage device being bigger/larger than the size of the same transverse dimension of the second storage device. The system includes a first storage assembly comprising a first storage device compactly disposed in a first storage carrier with the first storage device having the size of a transverse dimension that is bigger than the size of the same dimension of each second storage device. The first storage assembly further comprises an interposer assembly coupled to a data interface of the first storage device. The system further comprises the information handling system having an array of connectors physically configured to allow an array of second storage devices to compactly couple thereto, where the transverse dimension/size of each individual space allocated for coupling is smaller than the transverse dimension of the first storage carrier. The interposer assembly is positioned in a space of the first storage carrier that is physically proximate to an opposing connector and an adjacent connector of the connector array when the first storage carrier is placed for coupling the first storage device to the opposing connector. The interposer assembly is disposed between the first storage device and the opposing connector to cause the first storage device to be displaced laterally away from the adjacent connector while allowing the first storage device to be physically and communicatively coupled to the opposing connector without causing any physical contact with the adjacent connector.
According to yet another aspect of the disclosure, disclosed is a method of providing a common platform in an information handling system (IHS) to simultaneously support a first storage device and a second storage device with the transverse dimension of the first storage device being larger than the corresponding transverse dimension of the second storage device. The method comprises coupling an interposer assembly to the first storage device disposed in a first storage carrier to form a first storage assembly. The method further comprises inserting the first storage assembly into the IHS towards an array of connectors, so that the interposer assembly is positioned in a space of the first storage carrier that is physically proximate to an opposing connector and at least one adjacent connector of the connector array. The array of connectors are configured to allow an array of second storage devices to compactly couple to individual connectors, but the transverse dimension of each individual space allocated for coupling is smaller than the transverse dimension of the first storage carrier. The interposer assembly is disposed between the first storage device and the opposing connector to cause the first storage device to be displaced laterally away from the adjacent connector while allowing the first storage device to be physically and communicatively coupled to the opposing connector without causing any physical contact with the adjacent connector.
The above summary contains simplifications, generalizations and omissions of detail and is not intended as a comprehensive description of the claimed subject matter but, rather, is intended to provide a brief overview of some of the functionality associated therewith. Other systems, methods, functionality, features and advantages of the claimed subject matter will be or will become apparent to one with skill in the art upon examination of the following figures and detailed written description.
The description of the illustrative embodiments can be read in conjunction with the accompanying figures. It will be appreciated that for simplicity and clarity of illustration, elements illustrated in the figures have not necessarily been drawn to scale. For example, the dimensions of some of the elements are exaggerated relative to other elements. Embodiments incorporating teachings of the present disclosure are shown and described with respect to the figures presented herein, in which:
The illustrative embodiments provide a storage assembly, system and method for providing a common platform in an information handling system (IHS) to support storage devices of different transverse dimensions. The storage assembly comprises a first storage device compactly disposed in a first storage carrier. The first storage device has a transverse dimension (e.g., a width) that is larger than that of second storage devices specifically designed to be compactly coupled to the common platform via an array of connectors. The storage device further comprises an interposer assembly coupled to a data interface of the first storage device. When the first storage carrier is placed for coupling the first storage device to an opposing connector of the array of connectors, the interposer assembly is disposed between the first storage device and the opposing connector to cause the first storage device to be displaced laterally away from an adjacent connector while coupling the first storage device to the opposing connector.
In the following detailed description of exemplary embodiments of the disclosure, specific exemplary embodiments in which the disclosure may be practiced are described in sufficient detail to enable those skilled in the art to practice the disclosed embodiments. For example, specific details such as specific method orders, structures, elements, and connections have been presented herein. However, it is to be understood that the specific details presented need not be utilized to practice embodiments of the present disclosure. It is also to be understood that other embodiments may be utilized and that logical, architectural, programmatic, mechanical, electrical and other changes may be made without departing from general scope of the disclosure. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present disclosure is defined by the appended claims and equivalents thereof.
References within the specification to “one embodiment,” “an embodiment,” “embodiments”, or “one or more embodiments” are intended to indicate that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present disclosure. The appearance of such phrases in various places within the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Further, various features are described which may be exhibited by some embodiments and not by others. Similarly, various requirements are described which may be requirements for some embodiments but not other embodiments.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Moreover, the use of the terms first, second, etc. do not denote any order or importance, but rather the terms first, second, etc. are used to distinguish one element from another.
Those of ordinary skill in the art will appreciate that the hardware components and basic configuration depicted in the following figures may vary. For example, the illustrative components within information handling system 100 and features of a single density storage carrier 211 are not intended to be exhaustive, but rather are representative to highlight essential components that are utilized to implement the present disclosure. For example, other devices/components may be used in addition to or in place of the hardware depicted. The depicted example is not meant to imply architectural or other limitations with respect to the presently described embodiments and/or the general disclosure.
Within the descriptions of the different views of the figures, the use of the same reference numerals and/or symbols in different drawings indicates similar or identical items, and similar elements can be provided similar names and reference numerals throughout the figure(s). The specific identifiers/names and reference numerals assigned to the elements are provided solely to aid in the description and are not meant to imply any limitations (structural or functional or otherwise) on the described embodiments.
Various aspects of the disclosure are described from the perspective of an information handling system. For purposes of this disclosure, an information handling system, such as information handling system 100, may include any instrumentality or aggregate of instrumentalities operable to compute, classify, process, transmit, receive, retrieve, originate, switch, store, display, manifest, detect, record, reproduce, handle, or utilize any form of information, intelligence, or data for business, scientific, control, or other purposes. For example, an information handling system may be a handheld device, personal computer, a server, a network storage device, or any other suitable device and may vary in size, shape, performance, functionality, and price. The information handling system may include random access memory (RAM), one or more processing resources such as a central processing unit (CPU) or hardware or software control logic, ROM, and/or other types of nonvolatile memory. Additional components of the information handling system may include one or more disk drives, one or more network ports for communicating with external devices as well as various input and output (I/O) devices, such as a keyboard, a mouse, and a video display. The information handling system may also include one or more buses operable to transmit communications between the various hardware components.
With reference now to the figures, and beginning with
Information handling system 100 further includes one or more input/output (I/O) controllers 130 which support connection by and processing of signals from one or more connected input device(s) 132, such as a keyboard, mouse, touch screen, or microphone. I/O controllers 130 also support connection to and forwarding of output signals to one or more connected output devices 134, such as a monitor or display device or audio speaker(s). Additionally, in one or more embodiments, one or more device interfaces 136, such as an optical reader, a universal serial bus (USB), a card reader, Personal Computer Memory Card International Association (PCMIA) slot, and/or a high-definition multimedia interface (HDMI), can be associated with IHS 100. Device interface(s) 136 can be utilized to enable data to be read from or stored to corresponding removal storage device(s) 138, such as a compact disk (CD), digital video disk (DVD), flash drive, or flash memory card. In one or more embodiments, device interfaces 136 can further include General Purpose I/O interfaces such as I2C, SMBus, and peripheral component interconnect (PCI) buses.
Information handling system 100 comprises a network interface device (NID) 140. NID 140 enables information handling system 100 and/or components within information handling system 100 to communicate and/or interface with other devices, services, and components that are located external to information handling system 100. These devices, services, and components can interface with information handling system 100 via an external network, such as example network 150, using one or more communication protocols. Network 150 can be a local area network, wide area network, personal area network, and the like, and the connection to and/or between network 150 and IHS 100 can be wired or wireless or a combination thereof. For purposes of discussion, network 150 is indicated as a single collective component for simplicity. However, it is appreciated that network 150 can comprise one or more direct connections to other devices as well as a more complex set of interconnections as can exist within a wide area network, such as the Internet.
In the illustrative embodiment, network 150 also provides access to data storage facility 170, which can include a plurality of physical disks or other storage media. In an alternate embodiment, and as represented by the second set of dashed interconnecting lines, data storage facility 170 can be directly connected to IHS 100 as an external storage device.
Non-volatile storage 120 also includes storage bay 201 configured for housing both double density storage carriers 210 (in each of which a double density storage device 206 is compactly disposed) and single density storage carriers 211 (in each of which a single density storage device 207 is compactly disposed). According to one aspect of the disclosure and as described herein, a single density storage device 207 is disposed in a single density storage carrier 211 that is approximately double the width of a double density storage carrier 210 in which a double density storage device is housed/disposed. According to the described embodiments, a double density storage device 206 can be a 7 mm 2.5″ SSD (which is typically 7.5 mm or less in width or thickness) while a single density storage device 207 can be a 15 mm 2.5″ SSD, where the label “7 mm” and the label “15 mm” represent the respective approximate widths of the storage device and/or the storage carriers. Within the description, reference is made to a transverse dimension and/or width of the storage devices and/or the storage carriers. These references to transverse dimension and width describe the dimension of the drives/carriers that extend from the left edge to the right edge as shown in
With this configuration, the interposer assembly 301 routes data and/or signals being communicated between the opposing double density backplane connector 204 and the single density storage device 207, while creating an amount of separation distance from the closest edge/surface of the storage device 207 to an adjacent double density backplane connector 204, which abuts into the space behind the single density storage device 207. This separation distance prevents the single density storage device 207 from coming in contact with the adjacent double density backplane connector 204. This configuration also enables the single density storage device 207 to be physically and communicatively coupled to the double density backplane 203 via the opposing double density backplane connector 204. Thus, a common platform is realized, which, in this example, can simultaneously support storage devices of different transverse dimensions—namely, single density storage devices 207 and double density storage devices 206. As illustrated, eight double density storage devices 206 dock directly into the double density backplane 203, without requiring an interposer assembly. The example double density backplane 203 provides sixteen double density backplane connectors, and can thus support connection of up to sixteen double density storage devices 206 or eight single density storage devices 207. While
Referring to the top diagram of
Referring to the bottom diagram of
As a skilled artisan appreciates, although FIGS. 3 and 4A-4D illustrate one or more embodiments where a double density backplane connector 204 is a male connector, for different situations where, e.g., a double density backplane connector 204 is a female connector, changes can be made to achieve same or similar objectives without departing form the scope and spirit of the disclosure. For example, if a double density backplane connector 204 is a female connector, the interposer assembly 301 may have a male connector 412 (rather than a female connector 412) at one end to detachably mate with the corresponding female double density backplane connector 204 and a female connector 410 at the opposing end to detachably mate with a male connector 413 (i.e., data interface) of the single density storage device 207.
Compared to a storage bay of similar size (not shown) of an IHS 100 configured for coupling an array of single density storage devices 207 to a single density backplane having deployed thereon an array of single density backplane connectors, storage bay 201 is provided twice as many guiding features 501. This is due to the fact that a double density storage device 206, as defined herein and in the industry, is approximately half the width of a single density storage device 207. As a result, there are approximately twice as many backplane connectors 204 deployed on a similarly-dimensioned double density backplane 203 in storage bay 201 as the number of backplane connectors that can be deployed on the single density backplane.
With this configuration, the cleared pair of guiding features 501 of storage bay 201 engages with the storage carrier 211, thereby helping to secure the insertion of the single density storage carrier 211 into storage bay 201. Further, one or both vertical pairs of double dense guiding features 501 that are adjacent to the cleared pair of guiding features—which usually guide insertions of double density storage carriers —can now be utilized to guide the insertion of the single density storage carrier 211.
In an alternate embodiment, moveable double dense guiding features 501 in storage bay 201 may be provided to facilitate provision of a common platform supporting storage devices of double and single densities. In one or more examples, intermediate double dense guiding features 501, each of which is moveable or removable, are each disposed in a vertical plane in-between the two vertical planes defining the vertical boundaries of a space allocated in storage bay 201 for insertion of a single density storage device 207. For the embodiment implementing the moveable guiding feature, as a single density storage device 207 is being inserted into an allocated space, the corresponding vertical pair of intermediate double dense guiding features 501 are forced to move away (e.g. backwards) into an unoccupied space of storage bay 201, thereby facilitating the single density storage device 207 to be fully inserted into storage bay 201.
Referring to
In step 602, the single density storage device 207 is disposed in the modified single density storage carrier 211 according to, for example, the second configuration illustrated in
In step 604, the modified single density storage carrier 211 is inserted into storage bay 201, which is partly enabled by the clearance of a vertical pair of guiding features 501. The single density storage carrier 211 is inserted at an orientation of the carrier at which the guiding feature disposed in the storage bay is cleared as a result of the at least one protrusion of the guiding features being received into the slot of/on the guiding rail. The insertion causes the interposer assembly to be disposed between a double density backplane connector 204 and the single density storage device 207, as illustrated in
With this configuration, as shown in
With the embodiments illustrated above, an IHS 100 is able to provide a common platform supporting different combinations of double density storage devices 206 and single density storage devices 207, which are storage devices of different transverse dimensions (widths). Further, an IHS 100 is obviated of any need to have in place an additional backplane separately configured for supporting single density storage devices 207 as well as any need to add complexity to the existing backplane and chassis.
According to one embodiment, the storage assembly comprises: a first storage device having a data interface for coupling the first storage device to an opposing connector within an array of connectors of an information handling system; and an interposer assembly coupled to the data interface of the first storage device such that the interposer assembly is disposed between and enables coupling of the first storage device to the opposing connector when the first storage device is positioned for coupling to the opposing connector. The interposer assembly causes the first storage device to be displaced laterally away from an adjacent connector of the array of connectors without causing any physical contact with the adjacent connector, while allowing the first storage device to be physically and communicatively coupled to the opposing connector. Also, the first storage device has a transverse dimension which is larger than a corresponding transverse dimension of second storage devices that are specifically designed to compactly couple to adjacent connectors of the array of connectors. Accordingly, a cross spacing available for directly coupling to the adjacent connectors is smaller than the transverse dimension of the first storage device.
According to one aspect, the storage assembly further comprises: a first storage carrier within which the first storage device is physically secured at a first position that provides sufficient spacing at a coupling end of the first storage device for coupling the interposer assembly to the data interface of the first storage device without extending an overall length of the storage assembly. The interposer assembly is positioned in a connecting end of the first storage carrier that is physically proximate to an opposing connector and an adjacent backplane connector array when the first storage carrier is disposed for coupling of the first storage device to the opposing connector. Also, the connecting end of the storage assembly has a corresponding transverse dimension that is substantially close to the transverse dimension of the first storage device. The array of connectors are physically configured to allow an array of second storage devices to compactly couple thereto such that the transverse dimension of each individual space allocated between adjacent connectors is smaller than the transverse dimension of the first storage carrier. In one or more embodiments, the transverse dimension of the first storage device is larger than the corresponding transverse dimension of the second storage devices by a proportional size that allows each first storage device to extend across at least one adjacent connector, while coupled to the opposing connector.
While the disclosure has been described with reference to exemplary embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the disclosure. In addition, many modifications may be made to adapt a particular system, device or component thereof to the teachings of the disclosure without departing from the essential scope thereof.
As one example, with respect to guiding configurations, a skilled artisan appreciates that there can be various guiding configurations incorporated into a single density device carrier 211 without departing from the scope and spirit of the present invention. For instance, instead of incorporating into a single density storage carrier 211 a slot 502 on either or both guide rails 420 and 421, a groove, or a combination of grooves and slots, may be incorporated into a single density storage carrier 211 for clearing guiding features 501 of storage bay 201. Further, depending upon relative locations of guiding features 501 pre-disposed in storage bay 501 and/or characteristics of guiding features 501, various guiding configurations may be incorporated into a single density storage carrier 211 to adapt the single density storage carrier 211 to guiding features 501 accordingly.
As another example, although the exemplary embodiments are directed to providing a common platform supporting storage devices having different widths (namely, double density storage devices and single density storage devices), changes can be made to provide a similar common platform supporting devices of other different transverse dimensions, without departing from the scope and spirit of the disclosure.
As yet another example, although the exemplary embodiments described above are directed to an IHS 100 with a backplane (or a front panel) configured for coupling vertically inserted storage device carriers, similar embodiments can be provided to be directed to an IHS 100 with a backplane (or a front panel) configured for coupling horizontally inserted storage carriers, without departing from the scope and spirit of the disclosure.
Therefore, it is intended that the disclosure not be limited to the particular embodiments disclosed for carrying out this disclosure, but that the disclosure will include all embodiments falling within the scope of the appended claims.
