Claims
- 1. Storage-stable, one package quick-curing resin moulding materials consisting essentially of:
- a. epoxide resin consisting essentially of an adduct containing free epoxide groups and formed from a low molecular weight epoxide resin and a polyamine,
- b. pre-adducts containing free amino groups and formed from polyamines containing aromatic groups and a diepoxide, as curing agents, wherein the ratio of the number of the reactive hydrogen atoms of the polyamine on the amine nitrogen atoms to that of the epoxide groups of the epoxide is in the range of 3:1 to 5:1, and
- c. mineral or organic pulverulent or fibrous fillers, with the epoxide resins and the curing agents softening between 45.degree. and 120.degree. C, and having a melting point higher by 5.degree. to 30.degree. C than the softening point, and the epoxide resins and curing agents being present in the moulding materials predominantly as discrete particles.
- 2. Moulding materials according to claim 1 which also contain lubricants.
- 3. Moulding materials according to claim 1, wherein epoxide resin and curing agent have softening points of between 50.degree. and 90.degree. C.
- 4. Moulding materials according to claim 1, wherein the epoxide resin is an adduct from a glycidylated bisphenol A and 4,4'-diaminediphenylmethane.
- 5. Moulding material according to claim 1 containing
- a. 223 parts by weight of a resin adduct with epoxide group equivalents/kg = 3.00, softening point = 58.degree. C and melting point = 72.degree. C, produced from 1000 parts by weight of a liquid bisphenol-A-epoxide resin having a content of 5.35 epoxide group equivalents/kg and a viscosity at 25.degree. C of 13'500 cP, and from 100 parts by weight of 4,4'-diaminodiphenylmethane,
- b. 77 parts by weight of a curing agent adduct with amino group equivalents/kg = 4.2, softening point = 63.degree.C and melting point = 76.degree. C produced from 4,4'-diamino-diphenylmethane and a liquid bisphenol-A-epoxide resin having a content of 5.35 epoxide group equivalents/kg and a viscosity at 25.degree. C of 13'500 cP, in a weight ratio of 1.2:1.0,
- c. 695 parts by weight calcined kaolin,
- d. 2 parts by weight of a partially esterified polymethylene wax, and
- e. 3 parts by weight of gas black.
- 6. Moulding material according to claim 1 containing
- a. 180 parts by weight of a resin adduct with epoxide group equivalents/kg = 3.00, softening point = 58.degree. C and melting point = 72.degree. C, produced from 1000 parts by weight of a liquid bisphenol-A-epoxide resin having a content of 5.35 epoxide group equivalents/kg and a viscosity at 25.degree. C of 13'500 cP, and from 100 parts by weight of 4,4'-diamino-diphenylmethane,
- b. 70 parts by weight of a curing agent adduct with amino group equivalents/kg = 4.2, softening point = 63.degree. C and melting point = 76.degree. C produced from 4,4'-diamino-diphenylmethane and a liquid bisphenol-A-epoxide resin having a content of 5.35 epoxide group equivalents/kg and a viscosity at 25.degree. C of 13'500 cP, in a weight ratio of 1.2:1.0,
- c. 693 parts by weight of wollastonite,
- d. 4 parts by weight of a partially esterified polymethylene wax, and
- e. 3 parts by weight of gas black.
- 7. Moulding material according to claim 1 containing
- a. 223 parts by weight of a resin adduct with epoxide group equivalents/kg = 3.00, softening point = 58.degree. C and melting point = 72.degree. C, produced from 1000 parts by weight of a liquid bisphenol-A-epoxide resin having a content of 5.35 epoxide group equivalents/kg and a viscosity at 25.degree. C of 13'500 cP, and from 100 parts by weight of 4,4'-diamino-diphenylmethane,
- b. 77 parts by weight of a curing agent adduct with amino group equivalents/kg = 4.2, softening point = 63.degree. C and melting point = 76.degree. C produced from 4,4'-diamino-diphenylmethane and a liquid bisphenol-A-epoxide resin having a content of 5.35 epoxide group equivalents/kg and a viscosity at 25.degree. C of 13'500 cP, in a weight ratio of 1.2:1.0,
- c. 300 parts by weight of ground glass fibres,
- d. 390 parts by weight of kaolin,
- e. 2 parts by weight of gas black, and
- f. 1 part by weight of a partially esterified polymethylene wax.
- 8. Process for the production of storage-stable, quick-curing moulding materials, in which process a polyamine containing an aromatic group is reacted with a diepoxide resin, the respective amounts being such that the ratio of the number of the reactive hydrogen atoms of the polyamine on the amine nitrogen atoms to that of the epoxide groups of the epoxide resin is in the range of 3:1 to 5:1; the formed pre-adduct, which has a softening point in the range of 45.degree. to 120.degree. C and a melting point 5.degree. to 30.degree. C higher than this, and which acts as a curing agent for epoxide resins, is then mixed and ground with an epoxide resin softening between 45.degree. and 120.degree. C and having a melting point higher by 5.degree. to 30.degree. C than the softening point, and also with a filler, whereby there occurs to a slight degree at the most a fusing together of the particles of the resin and of the curing agent.
- 9. Process according to claim 8, wherein lubricants are also employed.
- 10. Process according to claim 8, wherein the ratio of the number of the reactive hydrogen atoms in the polyamine on the amine nitrogen atoms to the number of the epoxide groups in the epoxide resin is, in the production of the curing agent, between 3.5:1 and 4.5:1.
- 11. Process according to claim 8, wherein the formation of the curing agent is performed in the absence of solvents and at a temperature of between 50.degree. and 200.degree. C.
- 12. Process according to claim 8, in which process the curing agent, the lubricant and the filler are mixed with an epoxide resin without regard for the sequence in which the individual constituents of the moulding materials are added and mixed in, the said epoxide resin being an adduct containing free epoxide groups and formed from a low-molecular weight epoxide resin and a polyamine.
- 13. Process according to claim 12, wherein the epoxide resin employed is an adduct from an epoxidised bisphenol A and 4,4'-diaminodiphenylmethane.
- 14. Process according to claim 8, wherein curing agents and epoxide resins are employed which have softening points of between 50.degree. and 90.degree. C.
Priority Claims (1)
Number |
Date |
Country |
Kind |
9351/71 |
Jun 1971 |
CH |
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Parent Case Info
This is a continuation of application Ser. No. 257,799 filed on May 30, 1972, and now abandoned.
US Referenced Citations (4)
Non-Patent Literature Citations (1)
Entry |
Lee et al.; Handbook of Epoxy Resins; McGraw-Hill Book Co.; 1967; pp. 8-15. |
Continuations (1)
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Number |
Date |
Country |
Parent |
257799 |
May 1972 |
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