BRIEF DESCRIPTION OF THE DRAWINGS
The drawings included herein provide a further understanding of the invention. A brief introduction of the drawings is as follows:
FIG. 1 is a flow chart of the manufacturing method for a straddling and supporting structure for the field emission display device of the present invention;
FIGS. 2A˜2F are perspective views of the manufacturing method for a straddling and supporting structure for the field emission display device of the present invention;
FIG. 3 is a perspective view of the straddling and supporting structure for the field emission display device of the first embodiment of the present invention;
FIG. 4 is a front view of the straddling and supporting structure for the field emission display device of the first embodiment of the present invention; and
FIG. 5 is a perspective view of the straddling and supporting structure for the field emission display device of the preferred embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Reference is made to FIG. 1, which shows a flow chart of the manufacturing method for a straddling and supporting structure for the field emission display device of the present invention. The manufacturing method for a straddling and supporting structure of the present invention includes providing a substrate (S101), forming an insulating layer on the substrate via a printing method (S103), preheating a surface of the insulating layer via a first preheating process (S105), stacking a second insulating layer on the insulating layer via the printing method (S107), preheating a surface of the second insulating layer via the first preheating process (S109), repeating steps (S107) and (S109) until a plurality of insulating layers are formed on the substrate (S111), stacking a conducting layer on the last insulating layer via the printing method (S113), preheating a surface of the conducting layer via a second preheating process (S115), forming a concave groove on the surface of the conducting layer via a mold-pressing method (S117), preheating the insulating layers and the conducting layer via a third preheating process (S119), and solidifying the insulating layers and the conducting layer via a burning process (S121).
The first preheating process in S105 and S109 is a 100° C. preheating process and lasts 10 minutes. The first preheating process removes part of the printing liquid of the insulating layer and solidifies the printing material of the insulating layer to support the incoming printing process. The second preheating process in S115 is a 100° C. preheating process and lasts 2 minutes. The second preheating process removes part of the liquid on the surface of the printing material and makes the conducting layer more malleable for processing in S117. The mold-pressing method in S117 presses the surface of the conducting layer to form a concave groove. The depth of the concave groove corresponds to the thickness of the convex mold. The third preheating process in S119 is a 100° C. preheating process and lasts 10 minutes. The third preheating process makes the insulating layers and the conducting layer have a specified strength so that they will not cracked during the solidifying process in S121. The burning process takes place at 400° C. and lasts 30 minutes.
Reference is made to FIGS. 2A˜2F and 1. FIGS. 2A˜2F show perspective views of the manufacturing method for a straddling and supporting structure for the field emission display device of the present invention. The manufacturing method for a straddling and supporting structure of the present invention includes providing a substrate 1 (as shown in FIG. 2A). Next, an insulating layer 2 is formed on the substrate 1 via a printing method, a surface of the insulating layer 2 is preheated via a first preheating process, a second insulating layer is stacked on the insulating layer via the printing method, a surface of the second insulating layer 2 is preheated via the first preheating process, and the above steps are repeated until a plurality of insulating layers 2 are formed on the substrate 1. In this embodiment, there are three insulating layers (as shown in FIG. 2B). Next, a conducting layer 3 is stacked on the last insulating layer 2 via the printing method (as shown in FIG. 2C). A surface of the conducting layer 3 is preheated via a second preheating process, and a mold board 4 having a convex mold 41 is adopted to correspond with the conducting layer 3 (as shown in FIG. 2D). A concave groove 31 is formed on the surface of the conducting layer 3 via a mold-pressing method (as shown in FIGS. 2E and 2F). The insulating layers 2 and the conducting layer 3 are preheated via a third preheating process. Finally, the insulating layers 2 and the conducting layer 3 are solidified via a burning process.
The first preheating process is a 100° C. preheating process and lasts 10 minutes. The first preheating process removes part of the printing material liquid of the insulating layer and solidifies the printing material of the insulating layer to support the upcoming printing process. The second preheating process is a 100° C. preheating process and lasts 2 minutes. The second preheating process removes part of the liquid on the surface of the printing material and makes the conducting layer 3 more malleable for being processed in the mold-pressing process. The thickness of the convex mold 41 is 10˜15 μm. The depth of the concave groove 31 of the conducting layer 3 corresponds to the thickness of the convex mold 41. The third preheating process is a 100° C. preheating process and lasts 10 minutes. The third preheating process makes the insulating layers 2 and the conducting layer 3 have a specified strength so that they will not crack during the burning process. After the straddling and supporting structure has been processed by the third preheating process and the high temperature burning process, the straddling and supporting structure is solidified. The high temperature burning process is a 400° C. burning process and lasts 30 minutes.
The thickness of the stacked insulating layers 2 is 50 μm, and the thickness of the conducting layer is 25˜30 μm. The printing material of the conducting layer 3 is the same as that of the electrode conducting lines. Both are made of silver glue printing material having glass powder. The preferred pressure pressing on the conducting layer 3 by the mold board 4 is 0.75 Kg/cm2. The mold board 4 is made of a rigid material so that the mold board 4 is not deformed when the mold board 4 is pressed on the conducting layer 3.
Reference is made to FIGS. 3 and 4, which show the first embodiment of the straddling and supporting structure for the field emission display device of the present invention. The straddling and supporting structure includes a plurality of insulating layers 2, and a conducting layer 3. The insulating layers 2 are stacked, and the conducting layer 3 is located on one surface of the last insulating layer 2 of the insulating layers 2 and there is a concave groove 31 on a surface of the conducting layer 3. The conducting layer 3 is located on an anode substrate 6. In this embodiment, the anode substrate 6 has an independent conducting circuit 7, a second independent conducting circuit 8, and two lighting units 9 (alternatively, the anode substrate 6 has a plurality of conducting circuits, and a plurality of lighting units 9). The two conducting circuits are individually connected with the two lighting units 9. The conducting layer 3 is straddled to the first end A and the second end B of the independent conducting circuit 7 of the anode substrate 6 via the two ends of the concave groove 31. Thereby, the independent conducting circuit 7 conducts to the lighting unit 9 with a shortest conducting path via the conducting layer 3 straddling cross the first end A and the second end B. At the same time, a second independent conducting circuit 8 passes through the concave groove 31 so that path disposition of the independent conducting circuit 8 is not disturbed by the second conducting circuit.
Reference is made to FIGS. 5 and 3. The straddling and supporting structure is applied to the cathode substrate 5 and the anode substrate 6 of the field emission structure. The straddling and supporting structure is used as a supporting structure and also forms a vacuum gap. The anode substrate 6 has a plurality of independent conducting circuits (in this embodiment, there is an independent conducting circuit 7 and a second independent conducting circuit 8). The straddling and supporting structure is jointed and packaged between the cathode substrate 5 and the anode substrate 6. One insulating layer 2 of the insulating layers 2 is located on the cathode substrate 5. The conducting layer 3 located on the last insulating layer 2 is installed on the anode substrate 6, and is electrically connected with the first end A of the independent conducting circuit 7 via one end of the concave groove 31 of the conducting layer 3. A second end of the concave groove 31 of the conducting layer 3 crosses over a second independent conducting circuit 8 and is electrically connected with the second end B of the independent conducting circuit 7. Thereby, a shorted conducting path for electrically connecting with the lighting unit 9 is achieved. The lighting unit 9 achieves a conducting effect via the wound wire of the independent conducting circuit 7, and also achieves a second conducting effect via the concave groove 31 of the conducting layer 3 of the straddling and supporting structure. When the original wound wire of the independent conducting circuit 7 is destroyed, the straddling and supporting structure provides a second conducting effect so that the lighting unit 9 still can light.
Because the concave groove 31 of the conducting layer 3 has a receiving function, a second independent conducting circuit 8 can pass through the concave groove 31 so that the problem of the independent conducting circuit 8 being disturbed and opening is avoided. By the same principle, a second independent conducting circuit 8 achieves the shortest conducting path via the concave groove 31 of the conducting layer 3.
The straddling and supporting structure for the field emission display device is located between the cathode substrate 5 and the anode substrate 6. The present invention has the following characteristics:
1. The thickness of the electrode structure is uniform and smooth, and the gap will not become smaller.
2. By disposing the straddling and supporting structure, the cathode substrate and the anode substrate maintain a fixed gap, and the electrode conducting line between the cathode and the anode achieves the shortest conducting path.
3. The electrode conducting line structure located between the cathode and the anode is uniform and stable, the conducting circuit is stable and has an improved effect.
4. The thickness of the vacuum gap between the cathode and the anode does not become larger.
5. A second conducting effect is achieved via the concave groove 31 of the conducting layer 3. When the original wound wire of the independent conducting circuit 7 is destroyed, the straddling and supporting structure provides a second conducting effect so that the lighting unit 9 can still light.
The description above only illustrates specific embodiments and examples of the invention. The invention should therefore cover various modifications and variations made to the herein-described structure and operations of the invention, provided they fall within the scope of the invention as defined in the following appended claims.
Patent Application
20080018218
