1. Technical Field
The present invention relates to illuminating devices, and particularly, to a street illuminating device with a number of solid state light emitting elements.
2. Description of Related Art
Solid state light emitting elements, such as light emitting diodes (LEDs) have been widely used in street illuminating devices.
An LED is capable of producing a visible light in a certain wavelength. However, 80% to 90% energy of the LED is converted to heat, which needs to be dissipated, and only the small remainder is converted to the light.
The light from an LED needs to be gathered if a higher light concentration and brightness are needed. However, if a number of LEDs are used, it becomes complicated to efficiently gather light for each LED.
What is needed, therefore, is a street illuminating device with a number of solid state light emitting elements, which is compact, and in which light gather and heat dissipation are simply accomplished.
A street illuminating device includes a retaining frame, a light source module, and a heat dissipating module. The light source module includes a printed circuit board retained in the retaining frame, a number of solid state lighting elements, and a light reflecting plate. The printed circuit board has a first surface and an opposite second surface. The solid state lighting elements are arranged on the first surface of the printed circuit board. The light reflecting plate includes a number of through holes with inner reflecting surfaces. The light reflecting plate is disposed on the first surface of the printed circuit board with the solid state lighting elements received in the respective through holes. The heat dissipating module is in thermal contact with the second surface of the printed circuit board.
Other advantages and novel features of the present street illuminating device will become more apparent from the following detailed description of embodiment when taken in conjunction with the accompanying drawings.
Many aspects of the street illuminating device can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present street illuminating device. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Embodiment of the present street illuminating device will now be described in detail below and with reference to the drawings.
Referring to
Also referring to
The light source module 12 includes a printed circuit board 121, a number of solid state lighting elements 122, and a light reflecting plate 123. The printed circuit board 121 is retained on the first step 111 of the retaining frame 11. The printed circuit board 121 has a first surface 121a and an opposite second surface 121b. Each of the solid state lighting elements 122 is an LED. The solid state lighting elements 122 are arranged the first surface 121a of the printed circuit board 121, and are evenly spaced apart from each other. The light reflecting plate 123 is engaged with an inner wall of the retaining frame 11. The light reflecting plate 123 includes a number of through holes 124 with inner reflecting surfaces 124a. The through holes 124 each are truncated cone shaped, and have a smaller opening 123a and a larger opening 123b. The light reflecting plate 123 is attached on the first surface 121a of the printed circuit board 121, with each of the solid state lighting elements 122 received in the respective one of the through holes 124. The smaller opening 123a of each of the through holes 124 is adjacent to the respective one of the solid state lighting elements 122, and the larger opening 123b of each of the through holes 124 is apart from the respective one of the solid state lighting elements 122.
The heat dissipating module 13 includes a heat conduction plate 133, a number of ring-shaped heat pipes 132 with working fluid (not shown) therein, and a number of heat sinks 131. The heat conduction plate 133 is retained on the second retaining step 112 of the retaining frame 11. The heat conduction plate 133 can be made from the same material as the retaining frame 11, or from some other material with heat transfer capability higher than that of the material of the retaining frame 11. The heat conduction plate 133 is in thermal contact with the second surface 121b of the printed circuit board 121. Each of the ring-shaped heat pipes 132 has an evaporator section 132a, and a condenser section 132b. The evaporator sections 132a of the heat pipes 132 are in thermal contact with the heat conduction plate 133. The condenser sections 132b of the heat pipes 132 penetrate through the heat sinks 131, such that the heat sinks 131 are in thermal contact with the heat pipes 132.
Due to the compact nature of the retaining frame 11, the entire street illuminating device 20 is compact. Due to the reflectivity of the respective inner reflecting surfaces 124a of the light reflecting plate 123, light emitted by the respective solid state lighting elements 122 can be gathered and output only from the respective through holes 124, thus reducing light loss, increasing brightness, and providing a higher light concentration. Heat generated by the solid state lighting elements 122 can be conducted out by the heat conduction plate 133 and also by the retaining frame 11. Configuration and cooperation of the ring-shaped heat pipes 132 with the heat sinks 131 help provide a compact efficient module.
It is understood that the above-described embodiments are intended to illustrate rather than limit the invention. Variations may be made to the embodiments and methods without departing from the spirit of the invention. Accordingly, it is appropriate that the appended claims be construed broadly and in a manner consistent with the scope of the invention.
Number | Date | Country | Kind |
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2008 1 0300686 | Mar 2008 | CN | national |
Number | Name | Date | Kind |
---|---|---|---|
4733335 | Serizawa et al. | Mar 1988 | A |
20060164858 | Park et al. | Jul 2006 | A1 |
20070103908 | Tabito et al. | May 2007 | A1 |
20070189011 | Song et al. | Aug 2007 | A1 |
20080232118 | Liu | Sep 2008 | A1 |
20090262542 | Li et al. | Oct 2009 | A1 |
Number | Date | Country | |
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20090237929 A1 | Sep 2009 | US |