Claims
- 1. A brass alloy, consisting, by weight, of:from 2% to the maximum that maintains an alpha brass microstructure of zinc; from 0.2% to 2% nickel; from 0.15% to 1% tin; from 0.033% to 0.2% phosphorous; optional from 0.07% to 0.25% iron; from about 2 ppm to about 50 ppm of oxygen, sulfur, carbon or a mixture thereof; less than 2% in total of bismuth, lead, tellurium, sulfur and selenium; less than 0.25% each and 1% in total of magnesium, aluminum, silver, silicon, cadmium, antimony, manganese, cobalt, germanium, arsenic, gold, platinum, palladium, hafnium, zirconium, indium, antimony, chromium, vanadium and titanium; and the balance copper and inevitable impurities with a nickel:phosphorous weight ratio of between 4.5:1 and 9:1.
- 2. The brass alloy of claim 1 wherein the nickel:phosphorous weight ratio is between 5:1 and 7.5:1.
- 3. The brass alloy of claim 2 wherein said nickel:phosphorous weight ratio is about 6.75:1.
- 4. The brass alloy of claim 2 further including between 0.07% and 0.25% of iron.
- 5. The copper alloy of claim 2 wherein said zinc is present in an amount of from 8% to 12%.
- 6. The copper alloy of claim 5 having a composition of:nickel 0.25%-1.50%; tin 0.15%-0.85%; phosphorous 0.033%-0.20%; copper 86.6%-91.0%; and zinc balance.
- 7. An electrical connector having a conductivity equal to or greater than 25% IACS and a resistance to stress relaxation at least a 125° C. operating temperature formed from the alloy of claim 6 in a relief anneal temper.
- 8. The electrical connector of claim 8 having a conductivity equal to or greater than 35% IACS and a resistance to stress relaxation at least a 125° C. operating temperature formed from the alloy of claim 6 in a relief anneal temper.
CROSS REFERENCE TO RELATED APPLICATION
This patent application is a continuation in part of U.S. patent application Ser. No. 09/192,766 that was filed on Nov. 16, 1998. That patent application is incorporated by reference in its entirety herein.
US Referenced Citations (17)
Foreign Referenced Citations (23)
Number |
Date |
Country |
A2-0-795-693 |
Sep 1997 |
EP |
A1-0-859-065 |
Aug 1998 |
EP |
57-2849 |
Jan 1982 |
JP |
59047751 |
Mar 1984 |
JP |
59126742 |
Jul 1984 |
JP |
59197542 |
Nov 1984 |
JP |
61127840 |
Nov 1984 |
JP |
62199741 |
Sep 1987 |
JP |
63026320 |
Feb 1988 |
JP |
1062429 |
Mar 1989 |
JP |
1068436 |
Mar 1989 |
JP |
3-2341 |
Jan 1991 |
JP |
3-87341 |
Apr 1991 |
JP |
4231430 |
Aug 1992 |
JP |
4354843 |
Dec 1992 |
JP |
5059467 |
Mar 1993 |
JP |
5311278 |
Nov 1993 |
JP |
5311292 |
Nov 1993 |
JP |
6184679 |
Jul 1994 |
JP |
6-220594 |
Jul 1994 |
JP |
6-73474 |
Oct 1994 |
JP |
6299275 |
Oct 1994 |
JP |
7126779 |
May 1995 |
JP |
Non-Patent Literature Citations (1)
Entry |
New Higher Conductivity Alloys Within The Improved Phosphor Bronze and Improved Copper-Tin-Zinc Alloy Families, by Ashok K. Bhargava, pp. 119-129, 1997. |
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
09/192766 |
Nov 1998 |
US |
Child |
09/429871 |
|
US |