Patent Application
20210360781
The field of invention is printed circuit board and more particularly relates to flexible printed circuit boards.
Printed circuits are popularly used in fabrication of sensors, actuators, radio-frequency identification (RFID), health care devices, and display panel. In these applications, it is crucial for the printed circuit to be flexible and stretchable. The printed circuits are composed of two primary components, namely a substrate and the conductive ink.
However, there are intrinsic problems with the stretchable conductive circuit packages. Specifically, the adhesion of the conductive ink to the substrate, the compatibility of elastic modulus between the ink and substrate phases, as well as the inhomogeneity of conductive filler in the ink matrix, are intrinsic problems with the stretchable conductive circuit packages known in the art.
Adhesion between the ink and the substrate is critically important in a flexible printed circuit package. In a flexible printed circuit package, the adhesion between the ink and the substrate needs to be sufficiently strong so as no peeling occurs during stretching or deformation. In addition, the elastic modulus between the conductive ink and the underlying substrate needs to be compatible so that during stretching, both the conductive ink and the underlying substrate stretch at the same rate. Further, the dispersion of conductive filler in the conductive matrix needs to be homogeneous, thus establishing an efficient conductivity pathway.
The dual curing mechanism of the present invention alleviates the aforementioned drawbacks during development of the conductive circuit.
Embodiments of the present invention utilize both an addition mechanism and a condensation mechanism performed simultaneously to form a stretchable conductive ink for a circuit package. When the stretchable conductive ink is used in the circuit package, the circuit package has high reliability and durability.
The stretchable conductive circuit package includes a conductive ink and a substrate that have a similar flexibility modulus. If the elastic moduli of either the conductive ink or the substrate is higher than the other, then this will result in local rupture while both remain adhered strongly to each other during strain. Embodiments of the present invention are able to produce a conductive ink and a substrate package with similar flexibility moduli by forming the conductive ink and the substrate from the same material type.
The homogeneity between the conductive filler and the binder used in the conductive ink of the stretchable conductive circuit packages further increases the reliability and durability of the stretchable conductive circuit packages. However, the effect of blooming as well as settling of these particles to the lower level disrupts particulate distribution and homogeneity. These effects are particularly severe in the case of isotropic particulate. The inhomogeneity of the conductive filler and the binder will eventually deteriorate conductivity of the electrical circuit and cause the stretchable conductive circuit packages to fail. Embodiments of the present invention are able to produce a homogenous conductive ink by designing an optimized crosslink network in terms of density and network juxta positioning such that the particles are embedded and become immobilized in the network.
Other embodiments include formulations designed to fabricate a polysiloxane-based conductive ink package utilizing dual mechanism of addition and condensation curing. These formulations may include formulations for both components involved in a condensation reaction, namely Polydimethylsiloxane (PDMS) bearing hydroxyl end group as well as addition curing involving vinyl terminated and organohydrogensiloxane PDMS. These formulations may also include respective catalysts systems. Other formulations may include adhesion promoters and plasticizers that may be used to affect efficient curing.
In addition, in many embodiments, the substrate and the conductive ink may be formed of similar base materials. By virtue of similar types of base materials, the matrix of conductive ink is able to adhere strongly onto the substrate. The interlayer bonding is promoted by the formation of hydrogen bond, polar interaction and van Der Waal forces.
Embodiments also relate to methods of curing protocols and printing of the conductive ink onto the substrate.
Polysiloxane may be utilized to fabricate both the polymer substrate 120 and the conductive ink 110 of the stretchable conductive circuit package 100. Polysiloxane may be utilized because of its desirable elastic modulus, stretchability and high thermal stability. In addition, Polysiloxane is transparent which may be desirable in certain applications. For both the conductive ink and the substrate, the basic polysiloxane material may be a hydroxyl or alkoxyl terminated PDMS with dibutyltin dilaurate as catalyst.
The alkoxy terminated PDMS may include any group, other than hydroxyl, (including methoxy, ethoxy, propoxy etc.) provided the other group is hydrolyzable to provide, in situ, a reactive group (e.g., reactive hydrogen). This reactive group is utilized in the condensation reaction.
The functional groups of alkoxy terminated PDMS, in addition to the hydroxyl group (by hydrolysis) may form three-dimensional or cross-linked structures. These structures allow entrapment of conductive filler so as to induce homogeneity and improve thermal and mechanical properties of the resulting material.
In one embodiment, the molecular weight Mn of linear chain hydroxyl terminated PDMS is in the range of 10000-150000 g/mol, preferably in the range of 50000-80000 g/mol. In one embodiment of the substrate formulation, the weight percent of hydroxyl terminated PDMS is in the range of 50% to 95%, more preferably in the range of 80% to 95% or yet more preferably in the range of 90% to 95% based on total weight of the mass of the formulation. In the case of ink formulation, in one embodiment, the weight percent of hydroxyl terminated PDMS is in the range of 5% to 30%, more preferably in the range 11% based on total weight of the mass of the formulation.
For substrate formulation, in one embodiment, fume silica as reinforcing agent having surface area of 300 square meter per gram is added in the range of 3% to 10%, more preferably in the range of 3% to 5% on total mass of the formulation.
For ink formulation, a liquid triorganosiloxy PDMS and liquid organohydrogensiloxane terminated PDMS is added:
In one embodiment, the triorganosiloxy groups are vinyldimethylsiloxy or vinylmethylphenylsiloxy. In one embodiment, at least 95% of the diorganosiloxane groups are dimethylsiloxane.
The liquid organohydrogensiloxane is in an amount sufficient to provide a silicon-bonded hydrogen atoms per vinyl group present in vinyl terminated PDMS components, said organohydrogensiloxane having an average of at least a silicon-bonded hydrogen atoms per molecule and consisting essentially of units selected from the group consisting of methylhydrogensiloxy, dimethylsiloxy, dimethylhydrogensiloxy and trimethylsiloxy.
For ink formulation, metal catalyst is added. Examples of the catalyst include platinum and rhodium catalyst. Other multivalent metals may be used that are able to form many coordinate bonds with the substrates and, therefore, assist in catalyzing the reaction.
In one embodiment of the invention, the weight percent of the platinum catalyst range from 0.1 ppm to 50 ppm, preferably from 0.1 ppm 10 ppm on total mass of the formulation. The platinum catalyst can be present in an amount sufficient to provide at least one part by weight of platinum for every one million parts by weight of triorganosiloxy PDMS component. In some embodiments, it is preferred to use sufficient catalyst so that there is present from 5 to 50 parts by weight platinum for every one million parts by weight of component triorganosiloxy PDMS component. Although amounts of platinum greater than 50 parts per million are also effective, those amounts are unnecessary and wasteful, especially when the preferred catalyst is used.
For conductive ink formulation, filler is added to encompass materials in which the components are electrically conductive materials suspended and/or dissolved in a liquid as well as pastes. In one embodiment, its viscosity is in the range 3500-10000 cP, preferably in the range 5000-10000 cP.
The conductive materials can take a variety of forms, including particles, powders, flakes and foils. Examples of metals include silver, copper, aluminum, platinum, palladium, nickel, chromium, gold, bronze, colloidal metals, and other highly conductive metals.
In some embodiments, an average particle size within a range of 0.05-100 μm, and especially 0.1-10 μm, is preferred. The metal powder may have any suitable particle shape, including granular, dendritic or flake-like, or may be of irregular shape. Alternatively, a mixture of metal powders having a combination of these shapes may be used.
In some embodiments, the conducting material may include carbon nanotubes, graphene or other conductive organic materials. In addition, in some embodiments the conducting material may have isotropic particle shape.
Further, in an example embodiment of the formulation, the weight percent of the conductive filler is in the range of 5% -15%, preferably in the range of 10%-12% based on the total weight of the mass of the formulation.
Conductive properties may be improved by mixing different geometry of a similar filler type. In one embodiment, the mixing of silver particles in a spherical shape was made with flakes shape in a ratio of 20:1 weight ratio.
The viscosity of conductive ink 110 may be in the range of 3500-10000 cP, preferably in the range of 5000-10000 cP. To obtain the desired viscosity, plasticizer is added. For example, hexamethylcyclotrisiloxane, tetramethylcyclotetrasiloxane and preferably polydimethylsiloxane may be added to the ink 110. In some embodiments, the conductive ink 110 may have a degradation temperature of greater than 280° C.
Embodiments of the formulation can optionally contain adhesion promoters to facilitate interfacial adhesion between the conductive ink with the substrate. The adhesion promoter contains bipolar head-group with a long hydrophobic alkyl chain connecting the two ends. Examples of such molecules include glycidyloxypropyltrimethoxysilane and amino-terminated tripropyl tetraethoxysilane. In some embodiments, other polar molecules where one end is polar, the other end is non-polar may be utilized. In one embodiment, the amount of adhesion promoters is added into the formulation in the range of 0.1%-10% weight percent, preferably in the range of 0.1% to 5% weight percent of the total mass of the formulation.
There are two mechanisms of polysiloxane fabrication, addition 200 and condensation 210. The addition mechanism 200 and the condensation mechanism 210 are differentiated based on the mechanism of crosslink network formation.
In the addition mechanism 200, also known as hydrosilylation, a transition metal catalyst (e.g. Platinum or Rhodium) is used to affect reaction between Si—H and a vinyl functional group. The addition mechanism 200 forms new Si—C bond (carbosilane). The addition mechanism is schematically depicted in
In the condensation mechanism 210, a tin catalyst with a trace amount of an acid is used to catalyze the formation of linkage between two hydroxyl or alkoxyl groups. This reaction mechanism is generally utilized by those familiar in the art prior to the present invention. This reaction also triggers the release of byproducts. The condensation mechanism 210 forms new Si—O bonds that are polarized and susceptible to further hydrolysis. The condensation mechanism 210 is schematically depicted in
The condensation mechanism 210 undergoes a post-curing stage once it has been thermally initiated. Inducement of a post-curing reaction ensures optimization of crosslink density. A material with a high level of crosslink density displays improved thermal and mechanical properties. Nevertheless, the process itself could induce the chances of settling or blooming of conductive particulates or other additives as these fillers might be segregated out from the binder phase during the process of network formation. Within the period of post curing, the conductive particulate is still immobilized and freely moved about the matrix affecting inhomogeneity distribution. This may result in a common phenomenon whereby a conductive ink displays deteriorating properties within a short period of duration when adopting purely condensation type of curing.
Examples of post curing performed on reacted product include 10 hours at 80° C., preferably 5 hours at 80° C., and most preferably at 3 hours at 80° C.
The advantage of the addition mechanism 200 is that the reaction proceeds at a faster rate and does not produce low-molecular weight by-products. [ref: Polymer Degradation and Stability, (2011), 96, 2064-2070]. Further, curing reaction is terminated once the reactive Si—H or vinyl group has been used up. These affect the establishment of a rigid crosslink network in a shorter time which induces immobilization of any filler or additives present in the system. The chances of the effect of blooming or settling of these additives and the particulates is overcome with an increase in rate of crosslink formation. Arguably, addition mechanism results in crosslink network of reduced shrinkage effect.
Embodiments of the present invention utilize both the addition mechanism 200 and the condensation mechanism 210 to form the stretchable conductive circuit package 100.
Then, in step 320, the substrate 120 is cast using the polysiloxane material formulated in step 310. The substrate 120 may be allowed to cure at ambient temperature for 24 hours but preferably 5 hours, and more preferably 3 hours. In many embodiments, the curing of the substrate 120 may utilize a condensation mechanism 200. Post curing is performed where the substrate 120 is annealed at 80° C. for 24 hours.
In step 330, a conducting material is added to the polysiloxane material formulated in step 310 to form the conductive ink 110. The same basic polysiloxane material is used in forming the matrix of conductive ink as the substrate to ensure the materials have similar Young's modulus and sufficient interfacial compatibility. For example, the conductive ink may be in the range of 0.4 to 2.0 ohm with maximum stretchability of 70%.
Next, in step 340 the conductive ink made in step 330 is printed on the substrate cast in step 320. The inks may be applied to the substrate using any suitable method familiar to the prior art, including, but not limited to, painting, pouring, spin casting, solution casting, dip coating, powder coating, by syringe or pipette, spray coating, curtain coating, lamination, co-extrusion, electrospray deposition, ink-jet printing, spin coating, thermal transfer (including laser transfer) methods, doctor blade printing, screen printing, rotary screen printing, gravure printing, capillary printing, offset printing, flexographic printing, pad printing, stamping, xerography, microcontact printing, dip pen nanolithography, laser printing, via pen or similar means, etc.
When applied to a substrate, the inks can have a variety of forms. They can be present as a film or lines, patterns, circuitry, and other shapes.
When applied to a substrate, the ink can preferably have a thickness of at least about 0.01 mm, or more preferably at least about 0.5 mm. In various embodiments of the invention, the coatings can have a width of about 0.1 mm to 2 mm, and preferably of about about 0.01 mm to 1 mm,
In some embodiments, after the ink is printed, additional electronic components are mounted onto conductive ink 110 prior to curing. The electronic components may include transistors, diodes, capacitors, or other known electrical components. When the electronic components are mounted onto the conductive ink 110, the conductive ink 110 electrically connects the components to form an electrical circuit. Collectively, these electronic components may form device modules such as sensors and actuators.
Finally in step 350, a circuit pattern is thermally cured to the substrate. The thermal curing process includes both the addition mechanism 200 and the condensation mechanism 210. Curing time is from approximately 5 hours to 24 hours, preferably approximately 8 hours to 10 hours, while the temperature is in the range of 40° C. to 200° C., preferably between 80° C. to 100° C. The addition mechanism 200 and the condensation mechanism 210 are performed concurrently. At elevated temperature, both mechanisms start to cure. For both mechanisms, a minimum temperature of 40° C. is required, however it should be noted that curing time may be prolonged at this minimum temperature.
By employing the addition curing mechanism 210, the conductive ink 110 does not display any significant shrinkage due to the rigid crosslink network. Further, blooming or settling of conductive material are limited because the conductive material is tightly trapped in between the cross-linkages. To this effect, no coupling agent or coating layer need be applied on these particulate surfaces to improve dispersion in the polymeric binder. Crosslink density resulting from curing using the condensation mechanism 210 is significantly increased due to the multi-functionality of the curing agent. The synergetic effect from the addition and condensation curing system contribute to the thermal stability and filler dispersion in the ink.
The term “volume resistivity” as the term applied here means a value of electrical resistance expressed in a unit volume (1 cm×1cm×1 cm), ρv (ohm−cm). This value is usually obtained by measuring the potential difference (V) between two electrodes separated in a distance (L) when a constant current (I) flows through a cross-sectional area (A); where ρ=(V/I)(A/L) as referenced in Loresta-G P, Instruction Manual for Low Resistivity Meter (Mitsubishi Chemical Corporation). The volume resistivity as a function of applied strain of the resulting stretchable conductive circuit package 100 is depicted in
Applications of this circuitry include, but are not limited to, passive and active devices and components; electrical and electronic circuitry, integrated circuits; flexible printed circuit boards; transistors; field-effect transistors; microelectromechanical systems (MEMS) devices; microwave circuits; antennas; diffraction gratings; indicators; chipless tags (e.g. for theft deterrence from stores, libraries, etc.); smart cards; sensors; liquid crystalline displays (LCDs); signage; lighting; flat panel displays; flexible displays, including light-emitting diode, organic light-emitting diode, and polymer lighting diode displays; backplanes and frontplanes for displays; electroluminescent and OLED lighting; photovoltaic devices, including backplanes; product identifying chips and devices; batteries, including thin film batteries; electrodes; indicators; printed circuits in portable electronic devices (for example, cellular telephones, computers, personal digital assistants, global positioning system devices, music players, games, calculators, etc.); electronic connections made through hinges or other movable/bendable junctions in electronic devices such as cellular telephones, portable computers, folding keyboards, etc.); wearable electronics; and circuits in vehicles, medical devices, diagnostic devices, instruments, etc.
It is to be understood that the present invention is not limited to the embodiments described above, but encompasses any and all embodiments within the scope of the following claims. Additionally, although the features and elements of the present application are described in the example embodiments in particular combinations, each feature or element can be used alone (without the other features and elements of the example embodiments) or in various combinations with or without other features and elements of the present application.
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/MY2018/050029 | 5/8/2018 | WO | 00 |
