Claims
- 1. A composition consisting essentially of:
- (A) about 1 to about 99% of an aromatic compound which has a boiling point over 180.degree. C. selected from the group consisting of aromatic phenols, aromatic primary amines, aromatic secondary amines, and mixtures thereof;
- (B) about 1 to about 99% of a carboxylic acid compound selected from the group consisting of carboxylic acids, esters of carboxylic acids, and mixtures thereof, which has a boiling point over 180.degree. C.; and
- (C) sufficient hydrogen bonding compound to react with any acid present in said composition plus about 20 to about 50 phr (parts by weight per 100 parts of said aromatic compound plus said carboxylic acid compound) in excess of that amount, said hydrogen bonding compound having a boiling point over 180.degree. C. and having at least one pair of unshared electrons capable of forming a hydrogen bond with said aromatic compound, said composition being a liquid at 150.degree. C.
- 2. A composition according to claim 1 wherein said carboxylic acid compound is selected from the group consisting of rosin acids, fatty acids, esters thereof, and mixtures thereof.
- 3. A composition according to claim 1 wherein said aromatic compound, said carboxylic acid compound, and said composition each have a boiling point over 250.degree. C.
- 4. A composition according to claim 1 wherein said carboxylic acid compound is tall pitch.
- 5. A composition according to claim 1 wherein said aromatic compound is a phenol.
- 6. A composition according to claim 5 wherein said phenol is selected from the group consisting of resorcinol, .beta.-naphthol, and mixtures thereof.
- 7. A composition according to claim 1 wherein the concentration of said aromatic compound is about 10 to about 50% and the concentration of said carboxylic acid compound is about 50 to about 90%.
- 8. A composition according to claim 1 wherein said hydrogen bonding compound has a boiling point over 250.degree. C. and has non-vicinal hydroxyl groups.
- 9. A composition according to claim 8 wherein said hydrogen bonding compound is triethylene glycol.
- 10. A composition according to claim 1 which includes up to about 50 phr of a swelling agent which has a boiling point over 180.degree. C.
- 11. A composition according to claim 10 wherein the concentration of said swelling agent is about 5 to about 30 phr.
- 12. A method of removing thermoset resins from an article comprising immersing the article in a composition heated between about 150.degree. and about 250.degree. C. which consists essentially of:
- (A) about 1 to about 99% of an aromatic compound which has a boiling point over 180.degree. selected from the group consisting of aromatic phenols, aromatic primary amines, aromatic secondary amines, and mixtures thereof;
- (B) about 1 to about 99% of a carboxylic acid compound selected from the group consisting of carboxylic acids, esters of carboxylic acids, and mixtures thereof, which has a boiling point over 180.degree. C.; and
- (C) sufficient hydrogen bonding compound to react with any acid present in said composition plus about 20 to about 50 phr (parts by weight per 100 parts of said aromatic compound plus said carboxylic acid compound) in excess of that amount, said hydrogen bonding compound having a boiling point over 180.degree. C. and having at least one pair of unshared electrons capable of forming a hydrogen bond with said aromatic compound, said composition being a liquid at 150.degree. C.
- 13. A method according to claim 12 wherein said article is an electric motor.
- 14. A method of removing the coils from an electrical apparatus having coils of insulated wire embedded in a laminated core comprising:
- (1) first, severing at least one end of said coils;
- (2) second, immersing said apparatus in a composition heated between about 150.degree. and about 250.degree. C. which consists essentially of:
- (A) about 1 to about 99% of an aromatic compound which has a boiling point over 180.degree. C. selected from the group consisting of aromatic phenols, aromatic primary amines, aromatic secondary amines, and mixtures thereof;
- (B) about 1 to about 99% of a carboxylic acid compound selected from the group consisting of carboxylic acids, esters of carboxylic acids, and mixtures thereof, which has a boiling point over 180.degree. C.; and
- (C) sufficient hydrogen bonding compound to react with any acid present in said composition plus about 20 to about 50 phr (parts by weight per 100 parts of said aromatic compound plus said carboxylic acid compound) in excess of that amount, said hydrogen bonding compound having a boiling point over 180.degree. C. and having at least one pair of unshared electrons capable of forming a hydrogen bond with said aromatic compound, said composition being a liquid at 150.degree. C.;
- (3) removing said laminated core from said composition after the insulation of said coils has been destroyed and removing the wire of said coils from said laminated core in either order; and
- (4) cleaning said laminated core.
- 15. A method according to claim 14 wherein said cleaning step comprises vapor degreasing followed by solvent leaching.
- 16. A method according to claim 14 wherein said carboxylic acid compound is selected from the group consisting of rosin acids, fatty acids, esters thereof, and mixtures thereof.
- 17. A method according to claim 14 wherein said aromatic compound, said carboxylic acid compound, and said composition each have a boiling point over 250.degree. C.
- 18. A method according to claim 14 wherein said carboxylic acid compound is tall pitch.
- 19. A method according to claim 14 wherein said aromatic compound is a phenol.
- 20. A method according to claim 19 wherein said phenol is selected from the group consisting of resorcinol, .beta.-naphthol, and mixtures thereof.
- 21. A method according to claim 14 wherein the concentration of said aromatic compound is about 10 to about 50% and the concentration of said carboxylic acid compound is about 50 to about 90%.
- 22. A method according to claim 14 wherein said hydrogen bonding compound has a boiling point over 250.degree. C. and has nonvicinal hydroxyl groups.
- 23. A method according to claim 22 wherein said hydrogen bonding compound is triethylene glycol.
- 24. A method according to claim 14 wherein said composition includes up to about 50 phr of a swelling agent which has a boiling point over 180.degree. C.
- 25. A method according to claim 24 wherein the concentration of said swelling agent is about 5 to about 30 phr.
Parent Case Info
This is a continuation of application Ser. No. 585,733, filed June 10, 1975, now abandoned.
US Referenced Citations (10)
Non-Patent Literature Citations (1)
Entry |
Hackh's Chem. Dictionary, 1969, p. 580. |
Continuations (1)
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Number |
Date |
Country |
Parent |
585733 |
Jun 1975 |
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