The present application claims priority to Japanese Patent Application No. 2007-331348 entitled STRUCTURE FOR DRAWING OUT LEAD WIRES FROM A COIL DEVICE filed on Dec. 25, 2007.
Not Applicable
1. Field of the Invention
The present invention relates to a structure for drawing out lead wires from a coil device, which is used for energizing a coil winding wound around a coil bobbin, such as an electromagnetic coil device or the like.
2. Description of the Related Art
A conventional electromagnetic valve described in Japanese patent publication No. 2005-291266 gazette, as shown in
In the above-mentioned construction, after the exposed conductor portion 68a of the lead 68 is inserted into the reception hole of the wiring board 67, the exposed conductor portion 68a is directly be soldered to the conductive pattern. Before the soldering, the exposed conductor portion 68a is required to be subject to preliminary soldering, which causes the portion subject to preliminary soldering to be hardened and resiliency of the portion to be lost. Therefore, after the exposed conductor portion 68a is soldered to the conductive pattern of the wiring board 67, a load to the lead 68 may break the portion of the exposed conductor portion 68a subject to preliminary soldering, and there is a problem that uneasiness remains in respect of strength.
The present invention has been achieved in consideration of the above problems in the conventional art, and the object thereof is to prevent the exposed conductor portion from breaking and to maintain the connection state between the lead and the wiring board when a load is added to the lead wires under the condition that the lead wires of the coil device are connected to and retained on the wiring board.
To achieve the above object, the present invention relates to a structure for drawing out lead wires from a coil device having a coil and a plurality of terminal pins to which ends of the coil are connected. The structure is characterized in that an end of the lead wires are connected to a connector, the connector is connected at a side face thereof to the wiring board for relay, and thus the wiring board is connected to the terminal pins.
According to the structure of the present invention, since ends of lead wires are connected to a connector, and the lead wires are connected to a wiring board for relay via the connector, exposed conductor portions of the lead wires are not subject to preliminary soldering. As a result, when a mechanical load is applied to the lead wires from outside, the breakage of the exposed conductor portion can be prevented, and the connection state between the lead wires and the coil is maintained in stable.
In the structure for drawing out lead wires from a coil device described above, connection terminals of the connector which are connected to the wiring board project in a direction perpendicular to a direction that the lead wire extends. Therefore, the connection state between the lead wires and the wiring board is stably maintained.
In the above-mentioned structure for drawing out lead wires from the coil device, the coil device may be a resin-molded type in which an outer periphery of the coil is resin-molded except for tip portions of the terminal pins, and a cover for covering the connector to which the lead wires are connected, the wiring board and the terminal pins can be connected to the resin-molded coil device, and an inner space of the cover may be filled with resin. By this structure, the wiring board is stably retained in the cover, which allows the lead wires also to be stably retained in the cover.
Further, the present invention relates to a structure for drawing out lead wires of a coil device for drawing lead wires from terminal pins of a coil device having a coil and a plurality of terminal pins to which ends of the coil are connected, and the structure is characterized in that to ends of the lead wires are connected crimp terminals; the crimp terminals are connected at a side face thereof to a wiring board for relay; and the wiring board is connected to the terminal pins. According to the present invention, since ends of lead wires are connected to crimp terminals, and the lead wires are connected to a wiring board for relay via the crimp terminals, exposed conductor portions of the lead wires are not subject to preliminary soldering. As a result, when mechanical load is added to the lead wires from outside, the breakage of the exposed conductor portions can be prevented, and the connection state between the lead wires and the coil is stably maintained.
In the above-mentioned structure for drawing out lead wires of the coil device, connection terminals of the crimp terminals to be connected to the wiring board may project in a direction perpendicular to a direction that the lead extends. By this construction, the connection state between the lead wires and the wiring board is stably maintained.
In the structure for drawing out lead wires from the coil device described above, the coil device can be a resin-molded coil device in which an outer periphery of the coil is resin-molded except for tip portions of the terminal pins, and a cover for covering the crimp terminals to which the lead wires are connected, the wiring board and the terminal pins may be connected to the resin-molded coil device, and an inner space of the cover can be filled with resin. By this structure, the wiring board is stably retained in the cover, which allows the lead wires also to be stably retained in the cover.
As described above, according to the present invention, when a load is added to lead wires under the condition that the lead wires of a coil device are connected to and retained on a wiring board, it becomes possible to prevent exposed conductor portions of the lead wires from breaking and to maintain the connection state between the lead wires and the wiring board.
The present invention will be more apparent from the ensuring description with reference to the drawings, wherein:
Embodiments of the present invention will be explained hereunder with reference to drawings. In the below explanation also, in the same manner as the above description of the related art, the present invention is adapted to the coil device 65 of a stepping motor for driving an electromagnetic valve show in
The crimp terminal 3 is made of thin metal, and as shown in
The housing 4 is made of synthetic resin, and as shown in
Next, a method of assembling a stepping motor with the structure for drawing out lead wires of the coil device will be explained.
At first, as illustrated in
Next, as shown in
Then, as shown in
Next, as illustrated in
In the construction described above, the lead wires 2 are mounted to the housing 4 through the crimp terminals 3 to form the connector 1. After the projecting portions 3c of the crimp terminals 3 retained in the connector 1 are inserted into the through holes 67a of the wiring board 67, the free end portions 3e are conductively connected to the conductive pattern 67b of the wiring board 67 through soldering or with conductive bonding agent, so that no preliminary soldering is applied to the exposed conductor portions 2a of the lead wires 2. As a result, even though a mechanical load is added from outside to the lead wire 2, breakage of the exposed conductor portion 2a of the lead wire 2 can be prevented, and the connection state between the lead 2 and the wiring board 67 can be maintained in stable.
Further, in a state that the stepping motor 20 is assembled, the engagement projections 6a of the cover 6 and the notches 67c of the wiring board 67 are engaged with each other, so that the wiring board 67 can stably be retained in the cover 6, which allows the lead wires 2 also to be stably retained in the cover 6.
In addition, after a plurality of the lead wires 2 is mounted to the housing 4 to constitute the connector 1, the connector 1 and the wiring board 67 are assembled, so that it is unnecessary to mount the lead wires 2 to the wiring board 67 and to solder the lead wires 2 thereto one by one, and then the work for mounting the lead wires 2 to the wiring board 67 is reduced effectively.
Meanwhile, in the above embodiment, as clearly shown in
In addition, although in the above embodiment, the lead wires 2 are connected to and retained on the wiring board 67 through the connector 1 as an example, without through the connector 1, as illustrated in
Moreover, also in the construction shown in
Meanwhile, also in the construction shown in
In each embodiment described above, a distance between land portions of the conductive pattern 67b of the wiring board 67, that is, a pitch between the coil terminal pins 63 and a pitch between the projecting portions 3c of the crimp terminal 3 should be determined so as not to arise a solder bridge between adjacent pins or adjacent terminals at automatic soldering with a solder dipping device (not shown), and approximately 2.5 mm pitches are preferable as an example.
Number | Date | Country | Kind |
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2007-331348 | Dec 2007 | JP | national |