Structure-Property Relationships for Polyquinolines for Use in Electronics

Information

  • NSF Award
  • 9360334
Owner
  • Award Id
    9360334
  • Award Effective Date
    4/1/1994 - 31 years ago
  • Award Expiration Date
    3/31/1995 - 30 years ago
  • Award Amount
    $ 74,722.00
  • Award Instrument
    Standard Grant

Structure-Property Relationships for Polyquinolines for Use in Electronics

Lee 9360334 A critical deficiency in current dielectric materials that prevents their use in the next generations of ultra fast computing systems. Organic polymers offer the most promise in this area and are already beginning to displace inorganic material such as silicon dioxide in these applications due to the performance advantages offered by organic systems. New organic materials with the right combinations of properties are desired. Polyquinolines of not have the deficiencies that plague polymides and polyquinolines are ideally suited to serve as dielectric materials due in part to their inherently low dielectric constants (2.6-2.8), low moisture uptakes (0.15%), and excellent thermal stability's. In addition, a facile synthesis of polyquinolines has recently been developed at Maxdem which greatly simplifies their preparation and allows for the easy modification of their structure to yield new polyquinoline derivatives. However, trial and error methods of preparing new derivatives are to time consuming and costly because of the complex interrelationships between polymer properties. This will establish structure-property relationships essential to the development of optimum polyquinoline derivatives for electronic applications. ***

  • Program Officer
    Darryl G. Gorman
  • Min Amd Letter Date
    3/25/1994 - 31 years ago
  • Max Amd Letter Date
    1/11/1995 - 30 years ago
  • ARRA Amount

Institutions

  • Name
    MAXDEM INC
  • City
    SAN DIMAS
  • State
    CA
  • Country
    United States
  • Address
    140 E ARROW HWY
  • Postal Code
    917733336
  • Phone Number
    7143940644

Investigators

  • First Name
    Virgil
  • Last Name
    Lee
  • Email Address
    vlee@maxdem.com
  • Start Date
    4/1/1994 12:00:00 AM

FOA Information

  • Name
    Materials NEC
  • Code
    18