Patent Grant
11936123
The present application claims priority to Japanese patent application JP 2019-102041, filed May 31, 2019, and PCT/JP2020/019205, filed May 14, 2020, the entire contents of each of which being incorporated herein by reference.
The present disclosure relates to an antenna module and a communication device equipped with the same and more particularly to a technique for improving characteristics of an array antenna.
Japanese Unexamined Patent Application Publication No. 2016-213927 discloses an array antenna in which a large number of antenna elements are arranged on one substrate.
Patent Document 1: Japanese Unexamined Patent
In the array antenna disclosed in Japanese Unexamined Patent Application Publication No. 2016-213927, since the large number of antenna elements are directly arranged on the one substrate, the substrate on which each antenna element is mounted tends to be increased in size. For this reason, as recognized by the present inventor, there is a concern that the substrate on which each antenna element is mounted is easily warped, or a facility for mounting each antenna element on the substrate is increased in size.
As a countermeasure against this, it is assumed that a large number of antenna elements are divided and arranged on a plurality of sub-substrates (sub-array antennas), and the plurality of sub-array antennas are arranged on a main substrate. However, in such an array antenna, depending on a distance relationship between the antenna element and an end surface of the sub-substrate, there is a concern that characteristics of a single antenna element are deteriorated or that a side lobe level of an entire array antenna is raised.
Additionally, as another countermeasure, it is also assumed to provide a groove portion (slit) for absorbing warpage in one substrate on which a large number of antenna elements are arranged. However, also in such an array antenna, depending on a distance relationship between the antenna element and the groove portion, there is a concern that characteristics of a single antenna element are deteriorated or that a side lobe level of an entire array antenna is raised.
The present disclosure has been made to solve such a problem, as well as other problems, and an aspect thereof is, in a case where a plurality of sub-array antennas are arranged to form an array antenna, to suppress a side lobe level in an entire array antenna without deteriorating characteristics of a single antenna element.
Additionally, another aspect of the present disclosure is, in an array antenna formed by arranging a plurality of antenna elements on a substrate including a groove portion, to suppress a side lobe level in the entire array antenna without deteriorating characteristics of a single antenna element.
A sub-array antenna according to the present disclosure includes a substrate, and a plurality of antenna elements having a flat plate shape. The substrate has a first surface, a second surface facing the first surface, and an end surface connecting the first surface and the second surface. The plurality of antenna elements are aligned and arranged along the first surface at equal intervals on the first surface or in a layer between the first surface and the second surface. Under a condition λ is a wavelength of a radio wave in free space, a distance between centers of two of the plurality of antenna elements adjacent to each other is equal to or greater than λ/2. A distance between a center of an outer antenna element, which is one of the plurality of antenna elements that is arranged at a position adjacent to the end surface, and the end surface is equal to or greater than λ/9, and equal to or less than half a distance between respective centers of two of the plurality of antenna elements adjacent to each other.
In the above-described sub-array antenna, a distance between a center of an outer antenna element and an end surface of a sub-substrate is equal to or greater than λ/9, and equal to or less than half a distance between centers of two respective antenna elements adjacent to each other. Accordingly, in a case where a plurality of sub-array antennas are arranged to form an array antenna, it is possible to suppress a side lobe level in the array antenna as a whole, without deteriorating characteristics of a single antenna element.
An array antenna according to the present disclosure includes a substrate, and a plurality of antenna elements having a flat plate shape. The substrate has a first surface, a second surface facing the first surface, and a groove portion recessed to a side of the second surface from the first surface. The plurality of antenna elements are aligned and arranged along the first surface at equal intervals on the first surface or in a layer between the first surface and the second surface. Under a condition λ is a wavelength of a radio wave in free space, a distance between respective centers of two of the plurality of antenna elements adjacent to each other is equal to or greater than λ/2. A distance between a center of an antenna element, which is one of the plurality of antenna elements and is arranged at a position adjacent to the groove portion, and the groove portion is equal to or greater than λ/9 and equal to or less than half a distance between respective centers of two of the plurality of antenna elements adjacent to each other.
In the array antenna described above, a distance between a center of an antenna element, which is arranged at a position adjacent to the groove portion, and the groove portion is equal to or greater than λ/9, and equal to or less than half a distance between centers of two respective antenna elements adjacent to each other. This makes it possible to suppress a side lobe level in the array antenna as a whole, without deteriorating characteristics of a single antenna element.
Another sub-array antenna according to the present disclosure includes a substrate, and a plurality of antenna elements having a flat plate shape. The substrate has a first surface, a second surface facing the first surface, and an end surface connecting the first surface and the second surface. The plurality of antenna elements are aligned and arranged along the first surface at equal intervals on the first surface or in a layer between the first surface and the second surface. Under a condition a distance between respective centers of two of the antenna elements adjacent to each other is P, a distance between a center of an outer antenna element, which is one of the plurality of antenna elements and is arranged at a position adjacent to the end surface, and the end surface is equal to or greater than 2/9 of P and equal to or less than half of P.
In the above-described sub-array antenna, a distance between the center of an outer antenna element and an end surface of a sub-substrate is equal to or greater than λ/9 of P (distance between centers of two respective antenna elements adjacent to each other), and equal to or less than half of P. Accordingly, in a case where a plurality of sub-array antennas are arranged to form an array antenna, it is possible to suppress a side lobe level in the array antenna as a whole, without deteriorating characteristics of a single antenna element.
According to the present disclosure, it is possible to suppress a side lobe level in an entire array antenna, without deteriorating characteristics of a single antenna element.
Hereinafter, an embodiment of the present disclosure will be described in detail with reference to the drawings. Note that, in the drawings, the same or equivalent portions are denoted by the same reference numerals, and description thereof will not be repeated.
(Basic Configuration of Communication Device)
Referring to
Note that, in
Further, the sub-array antenna 20 according to the present embodiment is a so-called dual-polarization type antenna device capable of radiating two radio waves having polarization directions different from each other from each of the antenna elements 22. Thus, a radio frequency signal for first polarization and a radio frequency signal for second polarization are supplied from the RFIC 110 to each antenna element 22. Note that, the sub-array antenna 20 is not limited to the dual-polarization type antenna device and may be a single-polarization type antenna device.
The RFIC 110 includes switches 111A to 111H, 113A to 113H, 117A, and 117B, power amplifiers 112AT to 112HT, low-noise amplifiers 112AR to 112HR, attenuators 114A to 114H, phase-shifters 115A to 115H, signal multiplexers/demultiplexers 116A and 116B, mixers 118A and 118B, and amplifier circuits 119A and 119B. Among these, a configuration of the switches 111A to 111D, 113A to 113D, and 117A, the power amplifiers 112AT to 112DT, the low-noise amplifiers 112AR to 112DR, the attenuators 114A to 114D, the phase-shifters 115A to 115D, the signal multiplexer/demultiplexer 116A, the mixer 118A, and the amplifier circuit 119A is a circuit for a radio frequency signal for the first polarization. Additionally, a configuration of the switches 111E to 111H, 113E to 113H, and 117B, the power amplifiers 112ET to 112HT, the low-noise amplifiers 112ER to 112HR, the attenuators 114E to 114H, the phase-shifters 115E to 115H, the signal multiplexer/demultiplexer device 116B, the mixer 118B, and the amplifier circuit 119B is a circuit for a radio frequency signal for the second polarization.
When a radio frequency signal is transmitted, the switches 111A to 111H and 113A to 113H are switched to sides of the power amplifiers 112AT to 112HT, respectively, and the switches 117A and 117B are connected to transmission side amplifiers of the amplifier circuits 119A and 119B, respectively. When a radio frequency signal is received, the switches 111A to 111H and 113A to 113H are switched to sides of the low-noise amplifiers 112AR to 112HR, respectively, and the switches 117A and 117B are connected to reception side amplifiers of the amplifier circuits 119A and 119B, respectively.
The filter device 130 includes filter devices 130A to 130H. Note that, in the following description, the filter devices 130A to 130H may be collectively referred to as the “filter device 130”. The filter devices 130A to 130H are connected to the switches 111A to 111H in the RFIC 110, respectively. As will be described later, each of the filter devices 130A to 130H has a function of attenuating a radio frequency signal in a specific frequency band.
A signal transmitted from the BBIC 200 is amplified by the amplifier circuit 119A and up-converted by the mixer 118A or amplified by the amplifier 119B and up-converted by the mixer 118B. Transmission signals, which are the up-converted radio frequency signals, are demultiplexed into four by the signal multiplexer/demultiplexer 116A or 116B, passed through corresponding signal paths, and are each fed to a different feeding element (signal path).
A radio frequency signal from the switch 111A is supplied to a first part of a feeding element (an electrical connection from the respective filter to the feed point on the corresponding antenna element) via the filter device 130A, and a radio frequency signal from the switch 111E is supplied to a second part of the feeding element via the filter device 130E for the antenna element 22A. In this context, two signal paths are provided as constituent parts of feeding element for each antenna element. However, each signal path may be construed as a feeding element as well. Similarly, a radio frequency signal from the switch 111B is supplied to a first part of a feeding element via the filter device 130B, and a radio frequency signal from the switch 111F is supplied to a second part of the feeding element via the filter device 130F for the antenna element 22B. A radio frequency signal from the switch 111C is supplied to a first-part of the feeding element via the filter device 130C, and a radio frequency signal from the switch 111G is supplied to the second part of the feeding element via the filter device 130G for the antenna element 22C. A radio frequency signal from the switch 111D is supplied to a first part of a feeding element via the filter device 130D, and a radio frequency signal from the switch 111H is supplied to a second part of the feeding element via the filter device 130H for the antenna element 22D.
Directivity of the antenna device 120 can be adjusted by a phase shift degree of each of the phase-shifters 115A to 115H arranged in respective signal paths being individually adjusted.
Reception signals, which are radio frequency signals input to the feeding elements via the respective the antenna elements, are transmitted to the RFIC 110 via the filter device 130, correspondingly passed through four different signal paths, and are multiplexed in the signal multiplexer/demultiplexer 116A or 116B. The multiplexed reception signal is down-converted by the mixer 118A and amplified by the amplifier circuit 119A or down-converted by the mixer 118B and amplified by the amplifier circuit 119B and is transmitted to the BBIC 200.
The RFIC 110 is formed as, for example, a one-chip integrated-circuit component including the above-described circuit configuration. Alternatively, the device (switch, power amplifier, low-noise amplifier, attenuator, or phase-shifter) in the RFIC 110 corresponding to each feeding element 121 may be formed as a one-chip integrated-circuit component per corresponding feeding element 121.
(Configuration of Antenna Module)
The antenna module 100 includes a main substrate 10 in addition to the RFIC 110 and the plurality of sub-array antennas 20. In the example illustrated in
Each sub-array antenna 20 includes a sub-substrate 21 and a plurality of antenna elements 22. In the example illustrated in
As described above, by arranging, on the main substrate 10, the four sub-array antennas 20 each having the 16 antenna elements 22 arranged on the sub-substrate 21, the antenna module 100 is formed in which 64 antenna elements in total are arranged in a 8×8 two-dimensional array. In other words, the antenna module 100 is an array antenna in which the 64 antenna elements are divided and mounted on the four sub-substrates 21.
In each sub-array antenna 20, the antenna elements 22 are aligned and arranged at equal intervals in the X-axis direction and the Y-axis direction on the upper surface 21a of the sub-substrate 21. In each sub-array antenna 20, a distance between respective plane centers (each being an intersection point of diagonal lines) of two antenna elements 22 adjacent to each other in each of the X-axis direction and the Y-axis direction (hereinafter, also referred to as a “distance P between antenna elements”) is set to a value equal to or greater than λ/2. “λ” is a wavelength of a radio wave in free space.
The main substrate 10, the sub-substrate 21, and the antenna element 22 are all formed in a substantially rectangular shape in plan view from the Z-axis direction. A space S is formed between the sub-substrates 21 of the sub-array antennas 20 adjacent to each other.
When an antenna element 22 arranged at a position adjacent to an end surface 21b of the sub-substrate 21 is defined as an “outer antenna element”, a distance between surface centers of outer antenna elements of the sub-array antennas 20 adjacent to each other (hereinafter, also simply referred to as a “distance A between outer antenna elements”) is set to the same value as the “distance P between antenna elements”, which is a distance between plane centers of two antenna elements 22 adjacent to each other in each sub-array antenna 20. That is, in the antenna module 100, all the antenna elements 22 are arranged at equal pitches at intervals equal to or greater than λ/2 in the X-axis direction and the Y-axis direction.
Among the antenna elements 22, an antenna element 22 arranged at a position adjacent to the end surface 21b of the sub-substrate 21 is the above-described “outer antenna element”. In the present embodiment, a distance between a plane center C of the outer antenna element and the end surface 21b (hereinafter also referred to as a “substrate end distance B”) is set to a value equal to or greater than λ/9 and equal to or less than P/2.
Here, since the distance P between antenna elements is a value equal to or greater than λ/2, and a relationship “λ≤2P” holds, the substrate end distance B can be rephrased as a value equal to or greater than 2P/9 and equal to or less than P/2. That is, the substrate end distance B is equal to or greater than 2/9 of the distance P between antenna elements and equal to or less than half the distance P between antenna elements.
Note that, hereinafter, when the sub-array antenna 20 is viewed in plan view from the Z-axis direction, a region between an outer antenna element and the end surface 21b (a region outside a frame line L1 indicated by a one-dot chain line in
The feeding point SP1 is arranged at a position offset from the plane center C of the antenna element 22 in a positive direction of the X-axis in
The feeding point SP2 is arranged at a position offset from the plane center C of the antenna element 22 in a negative direction of the Y-axis in
The sub-substrate 21 is formed in a substantially rectangular shape as described above and includes an end surface 21b perpendicular to the X-axis direction (hereinafter also referred to as an “X end surface 21bx”) and an end surface 21b perpendicular to the Y-axis direction (hereinafter also referred to as a “Y end surface 21by”).
Both a distance Bx between a plane center C of an outer antenna element and the X end surface 21bx, and a distance By between a plane center C of an outer antenna element and the Y end surface 21by are set to a value equal to or greater than λ/9 and equal to or less than P/2.
Note that, when the sub-array antenna 20 is a single polarization type antenna device, for example, the feeding point SP2 may be omitted to provide only the feeding point SP1. Note that, for example, when only the feeding point SP1 is provided, the distance Bx between the plane center C of the outer antenna element and the X end surface 21bx is set to a value equal to or greater than λ/9, but the distance By between the plane center C of the outer antenna element and the Y end surface 21by need not necessarily be set to a value equal to or greater than λ/9.
Each sub-array antenna 20 includes the sub-substrate 21 and the antenna element 22. Note that, the antenna element 22 illustrated in
The sub-substrate 21 is, for example, a low temperature co-fired ceramics (LTCC) multilayer substrate, a multilayer resin substrate formed by laminating a plurality of resin layers formed of resin such as epoxy or polyimide, a multilayer resin substrate formed by laminating a plurality of resin layers formed of liquid crystal polymer (LCP) having a lower dielectric constant, a multilayer resin substrate formed by laminating a plurality of resin layers formed of a fluorine-based resin, or a ceramic multilayer substrate other than LTCC. Note that, the sub-substrate 21 is not limited to a multilayer substrate and may be a substrate having single-layer structure. The main substrate 10 may also have composition and layer structure similar to those of the sub-substrate 21.
Additionally, the sub-substrate 21 may be a multilayer resin substrate, and the main substrate 10 may be a low-temperature co-fired ceramics (LTCC) substrate. In general, an insertion loss of a filter directly below an antenna is correlated with transmission power (EIRP: Equivalent Isotropically Radiated Power) and reception sensitivity and is required to be as low as possible in order to improve performance of a radio device. At the same time, the filter also needs attenuation performance in a vicinity of a passband. Thus, it is necessary to increase a Q value of the filter. In order to increase the Q value of the filter, increasing a substrate thickness is a significant method. A millimeter wave filter has an advantage of reduction in size when a base material having a high dielectric constant is used. From this point of view, it is advantageous to use an LTCC substrate as the main substrate 10. On the other hand, in a patch antenna as well, a substrate thickness is necessary for ensuring a band, but a lower dielectric constant is advantageous for ensuring a band and improving gain. That is, a filter and an antenna are different in characteristics required for a base material, and when a filter and an antenna are formed in the same base material, performance of either of them is restricted. In addition, in a case of an LTCC substrate, since there is a limit to a possible substrate thickness in manufacturing, thickness limits arise for both a filter and an antenna, and design restrictions arise for both the filter and the antenna when formed of the same base material. In view of the above, the sub-substrate 21 on which the antenna element 22 is arranged and the main substrate 10 on which the filter device 130 is arranged may be formed of different base materials, and specifically, as described above, the sub-substrate 21 may be a multilayer resin substrate and the main substrate 10 may be a low temperature co-fired ceramics (LTCC) substrate.
The sub-substrate 21 has the upper surface 21a, a lower surface 21c facing the upper surface 21a, and the end surface 21b connecting the upper surface 21a and the lower surface 21c. Further, the sub-substrate 21 includes a feed line 23, ground electrodes 24 and 25, vias 26 and 27, and a ground terminal 28.
The feed line 23 is connected to the feeding point SP2 of the antenna element 22. The feed line 23 is formed of a wiring pattern arranged in a layer extending in the X-axis direction and the Y-axis direction, and a via extending in the Z-axis direction. A radio frequency signal from the RFIC 110 is transmitted to the feeding point SP2 via the feed line 23. Note that, although not illustrated in
The ground terminal 28 is arranged on the lower surface 21c of the sub-substrate 21. In a state where the sub-array antenna 20 is mounted on the main substrate 10, the ground terminal 28 is connected to the ground terminal 11 of the main substrate 10 via a solder bump 29. The ground terminal 28 and the solder bump 29 are arranged in the outer region Rout.
The ground electrode 24 is connected to the ground terminal 28 through the via 27. The ground electrode 25 is arranged in a layer closer to a side of the upper surface 21a than the ground electrode 24, and is connected to the ground electrode 24 through the via 26. The ground electrodes 24, 25, and the vias 26 and 27 are formed in a layer between the layer in which the antenna element 22 is arranged and the lower surface 21c. Note that, when the sub-substrate 21 is a multilayer substrate in which an upper substrate and a lower substrate are laminated, the antenna element 22 may be arranged on the upper substrate, and the ground electrodes 24, 25, and the vias 26, 27 may be arranged on the lower substrate.
The ground electrodes 24 and 25 extend from the inner region Rin to the outer region Rout. That is, a part of the ground electrodes 24 and 25 is arranged in the outer region Rout. However, an outer end portion of each of the ground electrodes 24 and 25 does not reach the end surface 21b. That is, the ground electrodes 24 and 25 are not exposed to the end surface 21b.
The via 26 connecting the ground electrode 24 and the ground electrode 25, and the via 27 connecting the ground electrode 24 and the ground terminal 28 are both arranged in the outer region Rout. Note that, a part of the vias 26 and 27 may be arranged in the inner region Rin.
The antenna element 22 includes a parasitic element 22a and a feeding element 22b. The parasitic element 22a is arranged on the upper surface 21a of the sub-substrate 21, and the feeding element 22b is arranged in a layer between the upper surface 21a and the lower surface 21c. In the example illustrated in
Further, the antenna element 22 may include only the feeding element 22b. In this case, the feeding element 22b may be arranged in a layer between the upper surface 21a and the lower surface 21c as illustrated in
Note that in
In the antenna module 100 according to the present embodiment, a part of the ground electrodes 24 and 25, and the vias 26 and 27 are arranged in the outer region Rout in the sub-array antenna 20. This strengthens grounding in the sub-array antenna 20, and makes it unlikely for characteristics of the outer antenna elements to deteriorate.
Further, in the antenna module 100 according to the present embodiment, as illustrated in
As shown in
Note that, in the present embodiment, both the distance Bx between the plane center C of an outer antenna element and the X end surface 21bx, and the distance By between the plane center C of an outer antenna element and the Y end surface 21by, are set to a value equal to or greater than λ/9 (see
Furthermore, in the antenna module 100 according to the present embodiment, as illustrated in
As can be understood from
Further, in the antenna module 100 according to the present embodiment, the adjacent sub-substrates 21 are not in contact with each other, and the space S having a lower effective dielectric constant compared to the sub-substrate 21 is formed. This makes it easy to ensure isolation between the sub-array antennas 20 adjacent to each other. In addition, since the space S is formed between the sub-substrates 21 adjacent to each other, and the sub-substrates 21 are not in contact with each other, it is possible to suppress variations in beams for both a radio wave with the X-axis direction as a polarization direction, and a radio wave with the Y-axis direction as a polarization direction.
Furthermore, in the antenna module 100 according to the present embodiment, the outer end portion of each of the ground electrodes 24 and 25 is not exposed to the end surface 21b in the sub-array antenna 20. Accordingly, isolation between the sub-array antennas 20 adjacent to each other can be more appropriately ensured.
In
From the simulation results illustrated in
As described above, in the sub-array antenna 20 according to the present embodiment, the “substrate end distance B”, which is a distance between a plane center of an outer antenna element and the end surface 21b, is set to a value equal to or greater than λ/9 and equal to or less than P/2. Accordingly, all the antenna elements 22 can be arranged at equal pitches by setting the distance A between outer antenna elements to the same value as the distance P between antenna elements, while ensuring the area of each of the ground electrodes 24 and 25 in the outer region Rout with respect to the outer antenna elements. As a result, when a plurality of sub-array antennas 20 are arranged to form an array antenna, a side lobe level of the array antenna as a whole can be suppressed without characteristics of a single antenna element 22 deteriorating.
In the above-described embodiment, the example in which the ground terminal 28 and the solder bump 29 are arranged in the outer region Rout has been described. However, a modification may be adopted in which the ground terminal 28 and the solder bump 29 are arranged in the inner region Rin.
In the sub-array antenna 20A, the ground terminal 28 is arranged in the inner region Rin. Accordingly, the solder bump 29 is also arranged in the inner region Rin. In this manner, by arranging the ground terminal 28 and the solder bump 29 in the inner region Rin, a path from the ground terminal 28 of one sub-array antenna 20A of the sub-array antennas 20A adjacent to each other to the ground terminal 28 of another sub-array antenna 20A can be made longer. Accordingly, a path from the ground electrode 24 of one sub-array antenna 20A of the sub-array antennas 20A adjacent to each other to the ground electrode 24 of another sub-array antenna 20A via the respective ground terminals 28 can be made longer. This makes it possible to reduce a current flowing from the one sub-array antenna 20A to the other sub-array antenna 20A via the respective ground terminals 28. As a result, isolation between the sub-array antennas 20A adjacent to each other can be further improved.
In
From the simulation results illustrated in
In the above-described embodiment, the example in which the lower surface 21c of the sub-substrate 21 is exposed has been described. However, the lower surface 21c of the sub-substrate 21 may be molded with resin.
The sealing resin M has a thickness in the Z-axis direction. The ground terminal 28B extends in the Z-axis direction in a state of penetrating the sealing resin M. One end portion of the ground terminal 28B is connected to the via 27 on an upper surface of the sealing resin M (the lower surface 21c of the sub-substrate 21), and another end portion of the ground terminal 28B is connected to the ground electrode 12 of the main substrate 10 via the solder bump 29. Note that, a space corresponding to a thickness of the solder bump 29 is formed between a lower surface of the sealing resin M and the upper surface 10a of the main substrate 10.
In this manner, by molding the lower surface 21c of the sub-substrate 21 with the sealing resin M that has the thickness in the Z-axis direction, a path from the ground electrode 24 of one sub-array antenna 20B of the sub-array antennas 20B adjacent to each other to the ground electrode 24 of another sub-array antenna 28B via the respective ground terminals 20B is made longer. Thus, it is possible to reduce a current flowing from the one sub-array antenna 20A of the sub-array antennas 20A adjacent to each other to the other sub-array antenna 20A via the respective ground terminals 28B. As a result, isolation between the sub-array antennas 20B adjacent to each other can be further improved.
In the above-described embodiment, an example in which a space is formed between the lower surface 21c of the sub-substrate 21 and the upper surface 10a of the main substrate 10 has been described. However, the space between the lower surface 21c of the sub-substrate 21 and the upper surface 10a of the main substrate 10 may be molded with resin.
The sealing resin M1 is filled in between the lower surface 21c of the sub-substrate 21 and the upper surface 10a of the main substrate 10. Note that,
In this manner, the space between the lower surface 21c of the sub-substrate 21 and the upper surface 10a of the main substrate 10 may be molded with the sealing resin M1.
In the above-described embodiment, an example has been described in which a substrate on which the large number of antenna elements 22 are mounted is divided into the plurality of sub-substrates 21. However, the substrate on which the large number of antenna elements 22 are mounted is not necessarily limited to being divided and may be a single substrate.
That is, the antenna module 100D includes one sub-substrate 21D and a plurality of antenna elements 22 having a flat plate shape. The sub-substrate 21D has the upper surface 21a, the lower surface 21c facing the upper surface 21a, and the groove portion G recessed toward a side of the lower surface 21c of the upper surface 21a. Among the antenna elements 22, a distance Bg between a plane center of an antenna element arranged at a position adjacent to the groove portion G and the groove portion G is equal to or greater than λ/9 and equal to or less than P/2.
In such an antenna module 100D as well, a side lobe level of an entire array antenna can be suppressed, without characteristics of a single antenna element 22 deteriorating, similar to Embodiment described above.
In addition, deformation of the sub-substrate 21D due to heat or the like can be absorbed by the groove portion G in the sub-substrate 21D. Thus, even when the sub-substrate 21D is increased in size, it is possible to suppress warpage of the sub-substrate 21D.
Although the example in which the 16 antenna elements 22 are arranged in a 4×4 two-dimensional array on each sub-substrate 21 has been described in the above-described embodiment, the number of antenna elements 22 and the arrangement thereof on each sub-substrate are not limited thereto. For example, two of the antenna elements 22 may be one-dimensionally arranged 1×2 on each sub-substrate. By reducing the number of antenna elements 22 per sub-substrate and forming a larger space (an air layer) between the sub-substrates adjacent to each other, variations in beams radiated from the respective antenna elements 22 can be further suppressed.
Note that, in
The inventors of the present application confirmed the characteristics of the radio waves radiated from the respective antenna elements 22 by simulation, in each of the case illustrated in
Note that, in each of
From simulation results illustrated in
The embodiment disclosed herein is to be considered in all respects as illustrative and not restrictive. The scope of the present disclosure is defined not by the description of the above-described embodiments but by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2019-102041 | May 2019 | JP | national |
| Number | Name | Date | Kind |
|---|---|---|---|
| 6496158 | Ksienski et al. | Dec 2002 | B1 |
| 10714840 | West | Jul 2020 | B1 |
| 20160285172 | Kishigami et al. | Sep 2016 | A1 |
| 20190081414 | Kao | Mar 2019 | A1 |
| Number | Date | Country |
|---|---|---|
| 2001-7628 | Jan 2001 | JP |
| 2005-86603 | Mar 2005 | JP |
| 2007-312082 | Nov 2007 | JP |
| 2014-179985 | Sep 2014 | JP |
| 2016-180720 | Oct 2016 | JP |
| 2016-213927 | Dec 2016 | JP |
| 2014-0112446 | Sep 2014 | KR |
| 2016067906 | May 2016 | WO |
| Entry |
|---|
| Office Action dated Aug. 1, 2023 in Chinese Patent Application No. 202080054902.7, 13 pages. |
| Office Action dated Oct. 12, 2022, in corresponding Korean patent Application No. 10-2021-7038424, 4 pages. |
| International Search Report and Written Opinion dated Aug. 18, 2020, received for PCT Application PCT/JP2020/019205, Filed on May 14, 2020, 10 pages including English Translation. |
| Number | Date | Country | |
|---|---|---|---|
| 20220085502 A1 | Mar 2022 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/JP2020/019205 | May 2020 | US |
| Child | 17536115 | US |
