The disclosure relates to additive manufacturing techniques.
Additive manufacturing generates three-dimensional structures through addition of material layer-by-layer or volume-by-volume to form the structure, rather than removing material from an existing volume to generate the three-dimensional structure. Additive manufacturing may be advantageous in many situations, such as rapid prototyping, forming components with complex three-dimensional structures, or the like. In some examples, additive manufacturing may include fused deposition modeling, in which heated material, such as polymer, is extruded from a nozzle and cools to be added to the structure, or stereolithography, in which an energy source is used to selectively cure a liquid photopolymer resin to a desired shape of the component.
In some examples, the disclosure describes an additive manufacturing system that includes a substrate comprising a structured surface including at least one feature having a smallest dimension or a smallest radius of curvature smaller than a base resolution of the additive manufacturing system. The additive manufacturing system also may include means for additively forming layers of material using an additive manufacturing technique and a computing device. The computing device is configured to control the means for additively forming layers to form a layer of material on the structured surface of the substrate. The layer of material substantially reproduces a complementary shape to the at least one feature. The computing device is also configured to control the means for additively forming layers to form, on the layer of material, at least one additional layer of material to form an additively manufactured component that includes the complementary shape.
In some examples, the disclosure describes a method that includes forming, on a structured surface of a substrate, a layer of material using an additive manufacturing technique. The structured surface of the substrate includes at least one feature having a smallest dimension or a smallest radius of curvature smaller than a base resolution of the additive manufacturing technique. The layer of material substantially reproduces a complementary shape to the at least one feature. The method may further include forming, on the layer of material, at least one additional layer of material to form an additively manufactured component that includes the complementary shape.
In some examples, the disclosure describes a computer-readable storage device including instructions that, when executed, configure one or more processors of a computing device to control means for additively forming layers of material using an additive manufacturing technique to form, on a structured surface of a substrate, a layer of material using an additive manufacturing technique. The structured surface of the substrate includes at least one feature having a smallest dimension or a smallest radius of curvature smaller than a base resolution of the additive manufacturing technique. The layer of material substantially reproduces a complementary shape to the at least one feature. The computer-readable storage device also includes instructions that, when executed, configure the one or more processors of the computing device to control the means for additively forming layers of material to form, on the layer of material, at least one additional layer of material to form an additively manufactured component that includes the complementary shape.
The details of one or more examples are set forth in the accompanying drawings and the description below. Other features, objects, and advantages will be apparent from the description and drawings, and from the claims.
The disclosure generally describes techniques for forming additively manufactured components including at least one feature having a minimum size or a minimum radius of curvature that is less than a base resolution of the additive manufacturing technique used to form the components (in the absence of the structured substrate described herein). The technique uses a substrate that includes a structured surface including at least one surface feature having a smallest dimension or a smallest radius of curvature smaller than a base resolution of the additive manufacturing technique. Means for additively forming layers of material using an additive manufacturing technique may be used to form a layer of material on the structured surface of the substrate, including on the at least one surface feature. The layer of material may substantially reproduce a complementary shape to the at least one surface feature. In this way, the technique may enable production of additively manufactured components with features having dimensions or radii of curvature smaller than a base resolution of the additive manufacturing technique. The complementary shape may be on a surface of the additively manufactured component, or may be incorporated within the additively manufactured component following subsequent steps of the additively manufacturing technique. In some examples, the additive manufacturing technique may be fused deposition modeling or stereolithography.
In some examples, additive manufacturing system 10 includes enclosure 16, which at least partially encloses energy delivery device 14, stage 18, vat 20, and substrate 22. Enclosure 16 may provide physical protection to energy delivery device 14, stage 18, vat 20, and substrate 22 during operation of additive manufacturing system 10, may maintain an atmosphere within enclosure 16 in a desired state (e.g., filled with a gas that is substantially inert to a liquid photopolymer resin in vat 20 or maintained at a desired temperature), or the like.
In some examples, stage 18 is movable relative to energy delivery device 14 and/or energy delivery device 14 is movable relative to stage 18. For example, stage 18 may be translatable and/or rotatable along at least one axis to position substrate 22 relative to energy delivery device 14. Similarly, energy delivery device 14 may be translatable and/or rotatable along at least one axis to position energy delivery device 14 relative to substrate 22. Stage 18 may be configured to selectively position and restrain substrate 22 in place relative to stage 18 during manufacturing of the additively manufactured component.
Vat 20 may be positioned on stage 18 and may contain a liquid photopolymer resin. The photopolymer may include oligomers, such as epoxides, urethanes, polyethers, polyesters, or mixtures thereof. In some examples, the oligomers may be functionalized by a reactive group, such as an acrylate. The liquid photopolymer resin also may include monomers that may affect cure rates, crosslink density of the cured resin, viscosity of the liquid photopolymer resin, or the like. Example monomers may include styrene, N-vinylpyrrolidone, acrylates, or the like. The liquid photopolymer resin further may include a photoinitiator.
In some examples, as shown in
Energy delivery device 14 may include an energy source, such as a laser source, an electron beam source, plasma source, or another source of energy that may be absorbed by the liquid photopolymer resin. Example laser sources include a CO laser, a CO2 laser, a Nd:YAG laser, or the like. In some examples, the energy source may be selected to provide energy with a predetermined wavelength or wavelength spectrum that may be absorbed by the liquid photopolymer resin, e.g., a wavelength or wavelength range in the ultraviolet wavelength spectrum.
In some examples, energy delivery device 14 also includes an energy delivery head, which is operatively connected to the energy source. The energy delivery head may focus or direct the energy toward predetermined positions adjacent substrate 22 or within vat 20 during the additive manufacturing technique. As described above, in some examples, the energy delivery head may be movable in at least one dimension (e.g., translatable and/or rotatable) under control of computing device 12 to direct the energy toward a selected location adjacent substrate 22 or within vat 20.
Computing device 12 may include, for example, a desktop computer, a laptop computer, a workstation, a server, a mainframe, a cloud computing system, or the like. Computing device 12 is configured to control operation of additive manufacturing system 10, including, for example, energy delivery device 14, stage 18, or both. Computing device 12 may be communicatively coupled to energy delivery device 14, stage 18, or both using respective communication connections. In some examples, the communication connections may include network links, such as Ethernet, ATM, or other network connections. Such connections may be wireless and/or wired connections. In other examples, the communication connections may include other types of device connections, such as USB, IEEE 1394, or the like.
Computing device 12 may be configured to control operation of energy delivery device 14, stage 18, or both to position substrate 22 relative to energy delivery device 14. For example, as described above, computing device 12 may control stage 18 and energy delivery device 14 to translate and/or rotate along at least one axis to position substrate 22 relative to energy delivery device 14. Positioning substrate 22 relative to energy delivery device 14 may include positioning a structured surface (e.g., a surface to which material is to be added) of substrate 22 in a predetermined orientation relative to energy delivery device 14.
For example, during manufacturing of an additively manufactured component with additive manufacturing system 10, computing device 12 may control movement of energy delivery device 14, stage 18, or both, based on a computer aided manufacturing or computer aided design (CAM/CAD) file. Computing device 12 may control movement of energy delivery device 14 to cause energy beam 28 to trace a desired shape or design in a layer of the liquid photopolymer resin, e.g., a layer of the liquid photopolymer resin adjacent to structured surface 24 of substrate 22, curing the liquid photopolymer resin at locations substantially corresponding to the traced shape or design, e.g., in a layer 26. Computing device 12 then may control stage 18 to move, e.g., away from energy delivery device 14, which may result in uncured liquid photopolymer resin covering the traced shape or design. Computing device 12 may again control movement of energy delivery device 14 to cause energy beam 28 to trace a second desired shape or design in the uncured liquid photopolymer resin on the cured photopolymer, curing the liquid photopolymer resin at locations substantially corresponding to the second traced shape or design. Computing device 12 may control stage 18 and energy delivery device 14 in this manner to result in a plurality of cured photopolymer layers, each layer including a traced shape or design. Together, the plurality of cured photopolymer layers defines an additively manufactured component.
Like additive manufacturing system 10 of
Instead of energy delivery device 14, additive manufacturing system 30 includes filament delivery device 34. Filament delivery device 34 may include a filament reel that holds wound filament. The filament may include a polymeric material, such as a thermoplastic. Example thermoplastics include polyolefins, polystyrene, acrylonitrile butadiene styrene, polylactic acid, thermoplastic polyurethanes, aliphatic polyamides, or the like.
Filament delivery device 34 may advance the filament from the reel and heat the filament to above a softening or melting point of the filament. The softened or melted material 38 is then extruded from a nozzle and laid down in a road 36 on structured surface 24 of substrate 22 (or in subsequent layers, on a previously deposited road). The softened or melted material 38 cools and, in this way, is joined to other roads.
Similar to energy delivery device 14, computing device 12 may control movement and positioning of filament delivery device 34 relative to stage 18, and vice versa, to control the locations at which roads 36 are formed. Computing device 12 may control movement of energy delivery device 14, stage 18, or both, based on a computer aided manufacturing or computer aided design (CAM/CAD) file. For example, computing device 12 may control filament delivery device 34 to trace a pattern or shape to form a layer including a plurality of roads on structured surface 24. Computing device 12 may control filament delivery device 34 or stage 18 to move substrate 22 away from filament delivery device 34, then control filament delivery device 34 to trace a second pattern or shape to form a second layer including a plurality of roads on the first layer. Computing device 12 may control stage 18 and filament delivery device 34 in this manner to result in a plurality of layers, each layer including a traced shape or design. Together, the plurality of layers defines an additively manufactured component.
Fused filament modelling and stereolithography each have base resolutions. As used herein, base resolution refers to a minimum size controllably producible by the additive manufacturing technique. The base resolution of fused filament modelling may be related to a diameter of the filament, a diameter of the nozzle of the filament delivery device 34, or both. Further, the base resolution may be reduced at locations where a direction of travel of filament delivery device 34 changes, as softened or molten material 38 may lack mechanical properties to precisely reproduce the change of direction of filament delivery device 34. Further, for fused filament modelling, cooling of the roads may induce dimensional changes and shape distortion, reducing a base resolution of the fused filament modelling.
The base resolution of stereolithography may be related to a focal size of energy beam 28. Similar to fused filament modelling, temperature changes during the curing process may induce dimensional changes and shape distortion during stereolithography, reducing a base resolution of the stereolithography technique.
Fused filament modelling and stereolithography also may have accuracy limits, where accuracy refers to the shape of the additively manufactured component produced by the additive manufacturing technique compared to an intended shape of the additively manufactured component. This also may introduce unwanted surface roughness to the additively manufactured component. For example, during fused filament modelling, filament delivery device 34 may drag softened or molten material 38 during changes in direction used to define edges or surfaces of shapes. Similarly, during stereolithography, a focal size of energy beam 28 may affect the accuracy of the technique and introduce unwanted surface roughness to the additively manufactured component. Shape distortion and dimensional changes due to temperature changes may also reduce accuracy of fused filament modelling and stereolithography.
In accordance with examples of this disclosure, substrate 22 may include a structured surface 24 that includes at least one surface feature having a smallest dimension or a smallest radius of curvature that is smaller than a base resolution of additive manufacturing system 10 or additive manufacturing system 30, e.g., small than a base resolution of energy delivery device 14 or filament delivery device 34 or a base positioning resolution of stage 18 relative to energy delivery device 14 or filament delivery device 34. For example, some fused filament deposition manufacturing systems may have a base resolution of about 1.75 mm, which is the diameter of a filament. Other fused filament deposition manufacturing systems may have a base resolution of greater than about 300 micrometers, which is a diameter of a nozzle. Some stereolithographic manufacturing systems may have a base resolution of about 250 micrometers, which is a diameter of a focal point of energy beam 28. Thus, in some examples, a smallest dimension or a smallest radius of curvature of the at least one surface feature may be less than about 1.75 mm, less than about 500 micrometers, less than about 300 micrometers, or less than about 250 micrometers.
Substrate 22 may be formed from any suitable material with dimensional accuracy and stability sufficient to reproduce structured surface 24 and the surface features defined therein. Substrate 22 and structured surface 24 including the surface features may be formed by any appropriate manufacturing technique, including, for example, molding, casting, machining (e.g., milling, grinding, etching, or the like), additive manufacturing in a metal or alloy and post-processing to smooth the surface, or the like.
In some examples, rather than including a plurality of channels 56, substrate 52 may include a single channel. In other examples, rather than the plurality of channels 56 being substantially parallel to each other, plurality of channels 56 may be non-parallel, e.g., diverging, intersecting, or the like. For example, plurality of channels 56 may define a grid pattern in which respective channels of plurality of channels 56 intersect each other and define plateaus in structured surface 54. Alternatively, rather than being continuous channels 56, discrete depressions may be formed in structured surface 54.
In some examples, plurality of channels 56 may be substantially straight, while in other examples, plurality of channels 56 may define other shapes, such curved, curvilinear, sinusoidal, or the like. Plurality of channels 56 may define any cross-sectional shape, including rectangular (as shown in
The additively manufactured component formed using substrate 52 may include a complementary shape to structured surface 54 and, thus, may include channels, pillars, plateaus, or other protrusions with a smallest dimension that is smaller than a base resolution of the additive manufacturing technique.
Structured surfaces 44 and 54 may facilitate accurate reproduction of features 46 and 48 and channels 56, e.g., compared to defining features 46 and 48 or channels 56 using only rastering of energy delivery device 14 or filament delivery device 34. This may result in greater geometric accuracy, higher resolution, or both in an additively manufactured component formed using substrates 42 or 52. For example, in a stereolithographic printing system, the liquid photopolymer resin may flow into intimate contact with structured surface 44 or 54 such that the liquid photopolymer resin accurately reproduces the shape of features 46 and 48 or channels 56, respectively. Computing device 12 may cause energy delivery device 14 to trace a focal point of energy beam 28 along or around features 46 and 48 or channels 56. In some examples, computing device 12 may cause energy delivery device 14 to trace the focal point of energy beam 28 such that the focal point partially overlaps structured surface 44 or 54, such that the liquid photopolymer resin is cured at the structured surface 44 or 54 to substantially reproduce (e.g., reproduce or nearly reproduce) a complementary shape to structured surface 44 or 54 features 46 and 48 or channels 56.
Similarly, in a fused filament deposition technique, softened or melted material 38 may be sufficiently soft or non-viscous to flow into intimate contact with the features 46 and 48 or channels 56. Softened or melted material 38 may then cool and harden to substantially reproduce (e.g., reproduce or nearly reproduce) a complementary shape to structured surface 44 or 54, including features 46 and 48 or channels 56. In this way, structured surface 44 or 54 may enable greater geometric accuracy, higher resolution, smoother surfaces, or combinations thereof in the additively manufactured component formed using substrate 42 or 52.
In some examples, substrate 22 including structured surface 24 may be used to form features internal to an additively manufactured component.
The surface features may be used to define shapes of functional features in the additively manufactured components. For example, the additively manufactured component may be a component used in a high temperature environment, such as a gas turbine engine, and the functional features in the additively manufactured component may be cooling channels or other features used for thermal management for the additively manufactured component. By enabling formation of relatively closely spaced features, the structured surfaces described herein may allow formation of effective and efficient thermal management structures.
As another example, the additively manufactured component may be a component used in an application where aerodynamic performance is a consideration. Enabling higher accuracy and smaller features may improve aerodynamic performance of the additively manufactured component compared to additively manufactured components formed without using the structured surfaces described herein.
The additively manufactured component alternatively may be a component joined to another component, such that the shape of the surface of the additively manufactured component should be accurate and precise to improve adhesion, retention, or mechanical joining of the additively manufactured component to the other component. By improving accuracy and resolution of the additive manufacturing technique, the structured surfaces described herein may improve adhesion, retention, or mechanical joining of the additively manufactured component to another component compared to additively manufactured components formed without using the structured surfaces described herein.
The additively manufactured component also may be used in applications such as chemical sensing or purification, such as chromatography or the like.
In some examples, structured surface 24 may include features configured to modify the surface of layer 26 to be more hydrophobic or more hydrophilic than base hydrophilicity or hydrophobicity of the material from which layer 26 is formed. For example, structured surface 24 may define a plurality of relatively narrow, elongated depressions, such that the complementary shapes formed in layer 26 include relatively narrow, elongated spikes, cones, or pyramidal shapes. The relatively narrow, elongated spikes, cones, or pyramidal shapes may be spaced from each other at a distance, and together may result in the surface of layer 26 being more hydrophobic than the base hydrophobicity of the material from which layer 26 is formed.
In some examples, structured surface 24 may include features that result in features in layer 26 that increase mechanical adhesion of a subsequent coating to the additively manufactured component. For example,
Features 72, 74, 76, 78, 80, 82, 84, or 86 (collectively “features 72”) may be formed in structured surface 24 in an array comprising a plurality of features 72. Features 72 may result in complementary shaped features being formed in layer 26 or road 36. The complementary shaped features may improve adhesion between layer 26 or road 36 and a subsequent coating, e.g., by forming mechanical interlocks or mechanical interference with the complementary shaped features. The coating may include, for example, a metal or alloy coating selected to provide desired properties to the surface of the additively manufactured part.
An example technique that may be implemented by system 10 or 30 will be described with concurrent reference to
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As described above, in some examples, the techniques described herein may be used to form features internal to an additively manufactured component. An example technique that may be implemented by system 10 or 30 will be described with concurrent reference to
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The techniques described in this disclosure may be implemented, at least in part, in hardware, software, firmware, or any combination thereof. For example, various aspects of the described techniques may be implemented within one or more processors, including one or more microprocessors, digital signal processors (DSPs), application specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), or any other equivalent integrated or discrete logic circuitry, as well as any combinations of such components. The term “processor” or “processing circuitry” may generally refer to any of the foregoing logic circuitry, alone or in combination with other logic circuitry, or any other equivalent circuitry. A control unit including hardware may also perform one or more of the techniques of this disclosure.
Such hardware, software, and firmware may be implemented within the same device or within separate devices to support the various techniques described in this disclosure. In addition, any of the described units, modules or components may be implemented together or separately as discrete but interoperable logic devices. Depiction of different features as modules or units is intended to highlight different functional aspects and does not necessarily imply that such modules or units must be realized by separate hardware, firmware, or software components. Rather, functionality associated with one or more modules or units may be performed by separate hardware, firmware, or software components, or integrated within common or separate hardware, firmware, or software components.
The techniques described in this disclosure may also be embodied or encoded in an article of manufacture including a computer-readable storage medium encoded with instructions. Instructions embedded or encoded in an article of manufacture including a computer-readable storage medium encoded, may cause one or more programmable processors, or other processors, to implement one or more of the techniques described herein, such as when instructions included or encoded in the computer-readable storage medium are executed by the one or more processors. Computer readable storage media may include random access memory (RAM), read only memory (ROM), programmable read only memory (PROM), erasable programmable read only memory (EPROM), electronically erasable programmable read only memory (EEPROM), flash memory, a hard disk, a compact disc ROM (CD-ROM), a floppy disk, a cassette, magnetic media, optical media, or other computer readable media. In some examples, an article of manufacture may include one or more computer-readable storage media.
In some examples, a computer-readable storage medium may include a non-transitory medium. The term “non-transitory” may indicate that the storage medium is not embodied in a carrier wave or a propagated signal. In certain examples, a non-transitory storage medium may store data that can, over time, change (e.g., in RAM or cache).
Various examples have been described. These and other examples are within the scope of the following claims.
This application claims the benefit of U.S. Provisional Patent Application No. 62/620,795, filed Jan. 23, 2018, the entire contents of which are incorporated herein by reference.
Number | Date | Country | |
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62620795 | Jan 2018 | US |