Patent Application
20200141141
Not Applicable
Not Applicable
Not Applicable
Not Applicable
The disclosure and prior art relates to leveling devices and more particularly pertains to a new leveling device for leveling floor paneling on a subfloor.
An embodiment of the disclosure meets the needs presented above by generally comprising a subfloor of a floor system in a building. A leveling compound is provided that comprises wood particles that are mixed with a fluid resin. The leveling compound is spread over the subfloor to completely cover the subfloor thereby facilitating the leveling compound to settle through gravity. In this way the leveling compound defines a level surface on the subfloor. Floor paneling is provided and the floor paneling is positionable on the leveling compound when the leveling compound is spread over the subfloor. In this way the floor paneling is leveled on the subfloor.
There has thus been outlined, rather broadly, the more important features of the disclosure in order that the detailed description thereof that follows may be better understood, and in order that the present contribution to the art may be better appreciated. There are additional features of the disclosure that will be described hereinafter and which will form the subject matter of the claims appended hereto.
The objects of the disclosure, along with the various features of novelty which characterize the disclosure, are pointed out with particularity in the claims annexed to and forming a part of this disclosure.
The disclosure will be better understood and objects other than those set forth above will become apparent when consideration is given to the following detailed description thereof. Such description makes reference to the annexed drawings wherein:
With reference now to the drawings, and in particular to
As best illustrated in
The leveling compound 17 is spread over the top surface 16 of the subfloor 12 to completely cover the subfloor 12. In this way the leveling compound 17 can settle through gravity thereby defining a level surface on the subfloor 12. A box 22 is provided for containing the wood particles 18 and a container 24 is provided for containing the fluid resin 20. The fluid resin 20 is added to the wood particles 18 in the box 22 in a predetermined amount thereby facilitating the leveling compound 17 to be created in the box 22. The container 24 may be a jar with a lid or other air tight container 24 capable of storing the fluid resin 20 over a long duration of time.
Floor paneling 25 is positionable on the leveling compound 17 when the leveling compound 17 is spread over the subfloor 12. In this way the floor paneling 25 can be leveled on the subfloor 12 without requiring the subfloor 12 to be leveled through approved reconstruction practices such as floor jacking or the like. The floor paneling 25 has a bottom surface 26 and the bottom surface 26 contacts the leveling compound 17 when the floor paneling 25 is positioned on the leveling compound 17. The floor paneling 25 may be wood floor paneling of any conventional design that is common to the construction industry.
In use, the wood particles 18 are collected and poured into the box 22. A predetermined amount of the fluid resin 20 is poured into the box 22 and the fluid resin 20 is mixed with the wood particles 18. In this way the leveling compound 17 is formed in the box 22 for subsequent spreading over the top surface 16 of the subfloor 12. The floor paneling 25 is laid on the leveling compound 17 once the leveling compound 17 has been applied to the subfloor 12 and the leveling compound 17 has rested for a sufficient amount of time to self-level. In this way the floor paneling 25 can be leveled on the subfloor 12 without requiring re-construction of the subfloor 12, joists, beams and columns of the floor system 14 in the building. Additionally, the leveling compound 17 adheres to the bottom surface 26 of the floor paneling 25 for enhancing fastening the floor paneling 25 to the subfloor 12.
With respect to the above description then, it is to be realized that the optimum dimensional relationships for the parts of an embodiment enabled by the disclosure, to include variations in size, materials, shape, form, function and manner of operation, assembly and use, are deemed readily apparent and obvious to one skilled in the art, and all equivalent relationships to those illustrated in the drawings and described in the specification are intended to be encompassed by an embodiment of the disclosure.
Therefore, the foregoing is considered as illustrative only of the principles of the disclosure. Further, since numerous modifications and changes will readily occur to those skilled in the art, it is not desired to limit the disclosure to the exact construction and operation shown and described, and accordingly, all suitable modifications and equivalents may be resorted to, falling within the scope of the disclosure. In this patent document, the word “comprising” is used in its non-limiting sense to mean that items following the word are included, but items not specifically mentioned are not excluded. A reference to an element by the indefinite article “a” does not exclude the possibility that more than one of the element is present, unless the context clearly requires that there be only one of the elements.
