Patent Application
20240181796
The present disclosure relates generally to sublimation systems, methods, and devices. In particular, the present disclosure relates to heat press systems, methods, and devices configured for ink sublimation.
This section provides background information related to the present disclosure and is not necessarily prior art.
Heat presses and other sublimation devices are used to create artwork on a workpiece (e.g., a mug) via sublimation by applying a transfer sheet of infusible ink onto a surface of the workpiece and applying heat and pressure. The sublimation process is responsive to temperature, pressure, and duration such that variations in temperature, pressure, or time applied to the transfer sheet against the surface of the workpiece results in variations in ink transfer. For example, uneven heat distribution to the surface of the workpiece during sublimation may result in cooler surface portions, which causes less ink to transfer to the workpiece at those portions, which results in faded or dimmed portions of the transferred artwork on the surface of the workpiece.
An even distribution of heat onto the surface of a workpiece from the sublimation device may be difficult when, for example, differently sized workpieces having different geometries are interfaced with the sublimation device. Furthermore, the sublimation device may be subjected to a variety of ambient temperature conditions. Because of these difficulties, conventional sublimation devices result in uneven and inconsistent transfers of designs onto workpieces such that unsightly fading and dimming of the transferred designs appear on the workpiece.
Accordingly, there are a number of disadvantages in the art that can be addressed.
This section provides a general summary of the disclosure, and is not a comprehensive disclosure of its full scope or all of its features.
Implementations of the present disclosure relate generally to heat press systems, methods, and apparatus. In particular, the present disclosure relates to ink sublimation mug presses. For example, in one implementation of the present disclosure, a mug press includes a heater at least partially defining a receptacle and a base heater disposed at the bottom of the receptacle.
In one implementation of the present disclosure, the base heater comprises a top surface; and the top surface of the base heater is disposed perpendicular to a major axis of the receptacle.
In one implementation of the present disclosure, the heater comprises two or more distinct heat zones.
In one implementation of the present disclosure, the mug press further comprises an outer casing and an insulative layer disposed between the base heater and the outer casing.
In one implementation of the present disclosure, the mug press includes a power supply or other electronic components in communication with the base heater within the mug press are separated from the base heater by the insulative barrier.
One aspect of the disclosure provides a sublimation device. The sublimation device includes a first heater and a second heater. The first heater includes a proximal end, a distal end, and an inner surface. The distal end is disposed opposite the proximal end. The inner surface extends between the proximal end and the distal end and at least partially forms a cavity. The second heater is disposed proximate the distal end of the first heater.
Implementations of this aspect of the disclosure may include one or more of the following optional features. In some implementations, the cavity includes a major axis surrounded by the inner surface of the first heater. The second heater may include a top surface disposed perpendicular to the major axis.
In some implementations, the first heater includes two or more distinct heat zones. At least one of the two or more distinct heat zones may extend vertically along a side edge of the first heater such that the at least one of the two or more heat zones is configured to contact a portion of an outer surface of a workpiece adjacent to a flange of the workpiece when the workpiece is placed into the cavity. The two or more distinct heat zones may include a first side heat zone, a second side heat zone, and a middle heat zone. The first side heat zone may extend vertically along a first side edge of the first heater. The second side heat zone may extend vertically along a second side edge of the first heater. The middle heat zone may be disposed between the first side heat zone and the second side heat zone.
In some implementations, the second heater is configured to face a bottom surface of a workpiece when the workpiece is placed into the cavity.
In some implementations, the cavity is cylindrical.
In some implementations, the first heater forms a gap that is configured to receive a flange portion extending from a workpiece when the workpiece is placed into the cavity.
In some implementations, the cavity is open at the proximal end and closed at the distal end. The first heater may form a vertical sidewall defining at least a portion of the cavity. An upper surface of the second heater may define at least a portion of a closed bottom of the cavity.
In some implementations, the sublimation device includes an outer casing and an insulative layer disposed between the second heater and the outer casing. The insulative layer may be disposed below the second heater.
In some implementations, the second heater is disposed within the cavity.
In some implementations, the first heater at least partially surrounds the second heater.
Another aspect of the disclosure provides a method of sublimating ink on a workpiece. The method may include activating a first heater. The method may also include transmitting, in a first direction, a first heat flow from the first heater during a first time period. The method may further include activating a second heater. The method may also include transmitting, in a second direction, a second heat flow from the second heater during at least a portion of the first time period.
Implementations of this aspect of the disclosure may include one or more of the following optional features. In some implementations, the first direction is orthogonal to the second direction. The first direction may extend radially, and the second direction may extend axially. The first heater may at least partially define a cavity. The method may further include disposing a workpiece within the cavity. The method may further include transmitting, in the second direction, a third heat flow from the first heater during the first time period. A first portion of the third heat flow may be disposed on a first axial side of the second heater, and a second portion of the third heat flow may be disposed on a second axial side of the second heater.
The details of one or more implementations of the disclosure are set forth in the accompanying drawings and the description below. Other aspects, features, and advantages will be apparent from the description and drawings, and from the claims.
Each of the above independent aspects of the present disclosure, and those aspects described in the detailed description below, may include any of the features, options, and possibilities set out in the present disclosure and figures, including those under the other independent aspects, and may also include any combination of any of the features, options, and possibilities set out in the present disclosure and figures.
Additional features and advantages of exemplary aspects of the disclosure will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of such exemplary aspects. The features and advantages of such aspects may be realized and obtained by means of the instruments and combinations particularly pointed out in the appended claims. These and other features will become more fully apparent from the following description and appended claims or may be learned by the practice of such exemplary aspects as set forth hereinafter.
In order to describe the manner in which the above-recited and other advantages and features of the present disclosure can be obtained, a more particular description of the present disclosure briefly described above will be rendered by reference to specific implementations thereof which are illustrated in the appended drawings. Understanding that these drawings depict only typical implementations of the present disclosure and are not therefore to be considered to be limiting of its scope, the present disclosure will be described and explained with additional specificity and detail through the use of the accompanying drawings in which:
Corresponding reference numerals indicate corresponding parts throughout the drawings.
The present disclosure relates generally to sublimation systems and devices and methods for using the same. In some instances, a workpiece (e.g., a mug) is removably-secured within a cavity of a sublimation device (e.g., a heat press) described in the present disclosure for transferring a sublimation ink from a sheet to the workpiece. Implementations of the present disclosure provide technical solutions to a number of technical problems in the art.
In some configurations, the sublimation device includes one or more heating devices. The one or more heating devices may work in conjunction to evenly distribute heat across an outer side surface of the workpiece.
In some implementations, exemplary configurations of the sublimation device may evenly distribute heat across the outer surface of the workpiece regardless of one or more sources of heat loss. In some instances, the heat loss may arise from, for example, conductive heat losses or convective heat losses. Such losses may arise from, for example, the configuration of the workpiece itself, or by, for example, airflow of the ambient air surrounding the sublimation device during a workpiece sublimation process.
Example configurations will now be described more fully with reference to the accompanying drawings. Example configurations are provided so that this disclosure will be thorough, and will fully convey the scope of the disclosure to those of ordinary skill in the art. Specific details are set forth such as examples of specific components, devices, and methods, to provide a thorough understanding of configurations of the present disclosure. It will be apparent to those of ordinary skill in the art that specific details need not be employed, that example configurations may be embodied in many different forms, and that the specific details and the example configurations should not be construed to limit the scope of the disclosure.
With reference to
Referring to
The plurality of differently sized workpieces W may include any desirable configuration that provides any desirable function. In some instances, the body portion WB of the plurality of differently sized workpieces W may be shaped to retain, for example, a liquid, solid, or semi-solid. Accordingly, the plurality of differently sized workpieces W may be a vase, bowl, beverage container, or the like. In this regard, while the workpieces W are generally shown and described herein as being mugs, it will be appreciated that the sublimation device 10 may utilize other workpieces W within the scope of the present disclosure. The plurality of differently sized workpieces W may include any desirable material such as, for example, a ceramic material. Although the plurality of differently sized workpieces W are shown and described to include the flange portion WF, the plurality of differently sized workpieces W may be configured to not include the flange portion WF.
Referring to
In some configurations, the sublimation device 10 may be actuated or powered on upon pressing a button 12 (see, e.g.,
With reference to
With reference to
Also, in some implementations, the workpiece-engaging device 18 may not entirely form a cylindrical configuration, providing an axial gap 22 that also extends radially though the outer housing 14. As seen at
With reference to
As seen at
The sublimation of the infusible sublimation ink I that forms the design A onto the outer side surface WO of one of the workpieces W1, W2 of the plurality of differently sized workpieces W may include the transfer of the infusible sublimation ink I from the transfer sheet S onto or into the outer side surface WO of one of the workpieces W1, W2 of the plurality of differently sized workpieces W. With reference to
In some implementations, a predetermined amount and/or a predetermined duration of pressure P and heat H applied to the outer side surface WO of one of the workpieces W1, W2 of the plurality of differently sized workpieces W during the sublimation process achieves sufficient transfer of the infusible sublimation ink I from transfer sheet S to the outer side surface WO of one of the workpieces W1, W2 of the plurality of differently sized workpieces W. Variations in one or more of temperature associated with the H, the pressure P, or time between different portions of the outer side surface WO of one of the workpieces W1, W2 of the plurality of differently sized workpieces W may result in inconsistent transfers of infusible sublimation ink I, thereby causing faded, dimmed, or otherwise insufficient transfer of the infusible sublimation ink I to certain portions of the outer side surface WO of one of the workpieces W1, W2 of the plurality of differently sized workpieces W. Faded and dimmed portions of the infusible sublimation ink I to certain portions of the outer side surface WO of one of the workpieces W1, W2 of the plurality of differently sized workpieces W may appear, for example, where lower or insufficient temperatures associated with the applied heat H occurs on the outer side surface WO of one of the workpieces W1, W2 of the plurality of differently sized workpieces W. Accordingly, the sublimation device 10 is configured to provide consistent transfer of the heat H with sufficient pressure P around the entire outer side surface WO of the workpieces W1, W2 of the plurality of differently sized workpieces W where the infusible sublimation ink I is to be sublimated thereon.
In some instances, the inner cylindrical wall 18′ of the workpiece-engaging device 18 or one or more other components of the sublimation device 10 proximate the inner cylindrical wall 18′ of the workpiece-engaging device 18 is configured to maintain a temperature of approximately above about 180° C. in order to sublimate the infusible sublimation ink I on the transfer sheet S to the outer side surface WO of one of the workpieces W1, W2 of the plurality of differently sized workpieces W. In other configurations, the inner cylindrical wall 18′ of the workpiece-engaging device 18 or one or more other components of the sublimation device 10 proximate the inner cylindrical wall 18′ of the workpiece-engaging device 18 is configured to maintain a temperature of approximately above about 190° C.±5° C. in order to sublimate the infusible sublimation ink I on the transfer sheet S to the outer side surface WO of one of the workpieces W1, W2 of the plurality of differently sized workpieces W. In some implementations, the inner cylindrical wall 18′ of the workpiece-engaging device 18 or one or more other components of the sublimation device 10 proximate the inner cylindrical wall 18′ of the workpiece-engaging device 18 is configured to maintain a temperature of approximately about 193ºC for approximately about 40 seconds.
As will be described in the following disclosure, a base heater 28 (see, e.g.,
In some instances, the sublimation device 10 may impart heat H to the outer side surface WO of one of the workpieces W1, W2 of the plurality of differently sized workpieces W for about 4-to-5 minutes. Furthermore, as will described in the following disclosure at
During sublimation, the transfer of heat H may be affected by either convective or conductive heat losses. Even if, hypothetically, heat H was transferred evenly from the inner cylindrical wall 18′ of the workpiece-engaging device 18 to the outer side surface WO of one of the workpieces W1, W2, certain areas of the outer side surface WO of one of the workpieces W1, W2 may be cooler than others due to these heat losses, which may affect certain areas of the outer side surface WO of one of the workpieces W1, W2 more than others. For example, because the cavity 20 is open at a top end thereof, the upper end surface WF of one of the workpieces W1, W2 of the plurality of differently sized workpieces W may be exposed to airflow or ambient air, and, as a result, is cooled due to convective heat loss; this may also occur at or around the edges of gap 22 (that may be at least partially formed by the upper trim surface 14r that may trim the outer housing 14) where the flange portion WF of one of the workpieces W1, W2 of the plurality of differently sized workpieces W is arranged.
Additionally, one of the workpieces W1, W2 may functionally act as a heat sink to conductively transfer the heat H away from the outer side surface WO of one of the workpieces W1, W2 of the plurality of differently sized workpieces W to different extents at different areas of the outer side surface WO of one of the workpieces W1, W2 of the plurality of differently sized workpieces W. For example, some workpieces W1, W2 are formed such that the thickness of the material of the workpieces W1, W2 may not be the same, and, as a result, varies. In some instances, the lower end surface WL of one of the workpieces W1, W2 may be thicker than a sidewall portion of the workpieces W1, W2 that forms the outer side surface WO. In some examples, the thickness of the sidewall portion of the workpieces W1, W2 that forms the outer side surface WO may vary around or vertically up and down the cylindrical sidewalls of the workpieces W1, W2. Thicker portions of the workpieces W1, W2 may, for example, be found at the lower end surface WL of one of the workpieces W1, W2 where the outer side surface WO meets the lower end surface WL. Thick portions of material forming the workpieces W1, W2 may be commonly found at or around the flange portion WF of one of the workpieces W1, W2 or where the flange portion WF of one of the workpieces W1, W2 meets the body portion WB of one of the workpieces W1, W2. Accordingly, lower surface temperatures, and, thus, less effective transfer of the infusible sublimation ink I from the transfer sheet S to the outer side surface WO of one of the workpieces W1, W2 are more likely to occur at areas on the outer side surface WO of one of the workpieces W1, W2 of the plurality of differently sized workpieces W that coincide with these thicker “heat-sink portions” or other areas of the workpieces W1, W2 that are susceptible to conductive and convective heat losses.
Exemplary sublimation devices 10 that are described in the present disclosure provide a heat source that enables consistent transfer of heat H to the outer side surface WO of one of the workpieces W1, W2 of the plurality of differently sized workpieces W such that the entirety of the body portion WB of one of the workpieces W1, W2 of the plurality of differently sized workpieces W is available for sublimation as a result of the outer side surface WO of one of the workpieces W1, W2 being heated to a sufficient temperature, and, with sufficient consistency, for successful transfer of the infusible sublimation ink I from the transfer sheet S to the outer side surface WO of one of the workpieces W1, W2 of the plurality of differently sized workpieces W without dimmed or faded areas of the design A on the outer side surface WO of one of the workpieces W1, W2 of the plurality of differently sized workpieces W. In some implementations, the entirety of the body portion WB that is available for sublimation may include the outer side surface WO of one of the workpieces W1, W2 extending from the upper end surface WF of one of the workpieces W1, W2 of the plurality of differently sized workpieces W to the lower end surface WL of one of the workpieces W1, W2 of the plurality of differently sized workpieces W. Furthermore, the entirety of the body portion WB of one of the workpieces W1, W2 of the plurality of differently sized workpieces W that is available for sublimation may also include some of the body portion WB of one of the workpieces W1, W2 of the plurality of differently sized workpieces W that extend from either side of the flange portion WF of one of the workpieces W1, W2 of the plurality of differently sized workpieces W.
Referring to
In some configurations, the heating assembly 24 includes the heater 26 and/or the base heater 28. In some implementations, the heater 26 forms a pad and may include, for example, one or more layers of material (see, e.g., layers 44a-44c, 46a-46d, and 48 at
In some implementations, the top surface of base heater 28 may be arranged perpendicular to the central axis A20-A20 of the substantially cylindrical cavity 20. In this way, when one of the workpieces W1, W2 of the plurality of differently sized workpieces W is placed within the cavity 20, the top surface of base heater 28 contacts the lower end surface WL of one of the workpieces W1, W2 of the plurality of differently sized workpieces W to provide a transfer of heat H to one of the workpieces W1, W2 of the plurality of differently sized workpieces W from below in addition to a transfer of heat H to the outer side surface WO of one of the workpieces W1, W2 of the plurality of differently sized workpieces W from the heater 26. The base heater 28 provides heat H to the lower end surface WL of one of the workpieces W1, W2 of the plurality of differently sized workpieces W so that the lower end surface WL does not act as a heat sink that draws heat away from the lower end surface WL of one of the workpieces W1, W2 of the plurality of differently sized workpieces W where the lower end surface WL meets the outer side surface WO during sublimation. In other words, the base heater 28 heats the lower end surface WL of one of the workpieces W1, W2 of the plurality of differently sized workpieces W during sublimation to minimize a temperature difference or temperature gradient between the lower end surface WL and a portion edge of the outer side surface WO that is near or extends from the lower end surface WL. As such, a transfer of heat H from the portion edge of the outer side surface WO that is near or extends from the lower end surface WL into the lower end surface WL of one of the workpieces W1, W2 of the plurality of differently sized workpieces W, which would otherwise reduce the temperature at the portion edge of the outer side surface WO that is near or extends from the lower end surface WL is minimized or eliminated.
In some instances, the base heater 28 may be configured to heat H the lower end surface WL of one of the workpieces W1, W2 of the plurality of differently sized workpieces W such that the lower end surface WL is hotter than the outer side surface WO of one of the workpieces W1, W2 of the plurality of differently sized workpieces W during sublimation, causing the portion edge of the outer side surface WO that is near or extends from the lower end surface WL to increase in temperature relative to the rest of the outer side surface WO. This increased temperature at the portion edge of the outer side surface WO that is near or extends from the lower end surface WL may offset any potential convective heat losses introduced by ambient airflow into the cavity 20 that travels near the lower end surface WL.
Accordingly, while the user may not be transferring the infusible sublimation ink I from the transfer sheet S to the lower end surface WL of one of the workpieces W1, W2 of the plurality of differently sized workpieces W, the heat H provided to the lower end surface WL enables the heater 26 to heat the portion edge of the outer side surface WO that is near or extends from the lower end surface WL without the lower end surface WL reducing the surface temperature of the portion edge of the outer side surface WO that is near or extends from the lower end surface WL due to conductive heat losses and/or convective heat losses. Thus, temperatures at or near the portion edge of the outer side surface WO that is near or extends from the lower end surface WL may be maintained consistent with the rest of the outer side surface WO of one of the workpieces W1, W2 of the plurality of differently sized workpieces W so that the infusible sublimation ink I transferred thereto is not faded or dimmed at one or more regions at or near the portion edge of the outer side surface WO that is near or extends from the lower end surface WL during the sublimation process.
With reference to
Referring to
In some configurations, the lower insulative barrier 36 and the pedestal 34 may be separated by a distance D35 to allow an air gap 35 to form therebetween. This air gap 35 improves the insulation between the pedestal 34 and the lower insulative barrier 36, and, furthermore, between the base heater 28 and the outer housing 14 or any surface (e.g., the table 125) on which the sublimation device 10 rests. In some configurations, at least a portion of the insulative barrier 36 may also be separated from outer housing 14 at a distance D35 to form another air gap 37 for further enhancing insulation properties between the base heater 28 and the outer housing 14.
With continued reference to
As the frustoconical portion 342 extends in a substantially radial direction toward the central axis A20-A20 of the cavity 20 from the upper end of the axially-extending portion 341, some of the frustoconical portion 342 may be arranged axially below or under a lower opening 26LO formed by a lower end 26LE of the heater 26. However, as the frustoconical portion 342 further extends in the substantially radial direction toward the central axis A20-A20 of the cavity 20, the frustoconical portion 342 also extends in a substantially axial direction away from the insulative barrier 36 such that some of the frustoconical portion 342 of the pedestal 34 extends axially through the lower opening 26LO of the heater 26 and into the cavity 20 at a distance D34. Accordingly, some of the pedestal 34 (e.g., the outer axially-extending portion 341 and some of the frustoconical portion 342) is not arranged within the cavity 20 while another portion of the pedestal 34 (e.g., the portion of the frustoconical portion 342 that extends axially through the lower opening 26LO of the heater 26 and into the cavity 20 at the distance D34) is arranged within the cavity 20.
With further reference to
As also seen at
Because the frustoconical portion 342 of the pedestal 34 extends axially through the lower opening 26LO of the heater 26 and into the cavity 20 at the distance D34, the pedestal 34 is configured to correspondingly axially raise, axially elevate, or axially position the base heater 28 within the cavity 20. For example, as seen at
As a result of the arrangement of the heater 26, which may be alternatively referred to as a first heater, and the base heater 28, which may be alternatively referred to as a second heater, at least two unique flows (see, e.g., arrows F1, F2) of heat H within the cavity 20 may be achieved. For example, as seen at
In some instances, the first direction associated with the first heat flow F1 is orthogonal the second direction associated with the second heat flow F2. In some examples, upon activating the heater 26, heat H may transmit therefrom in the second direction, toward the base heater 28 and an upper end (opposite the lower end 26LE) of the heater 26, resulting in a third heat flow F3 during at least a portion of the first time period. In particular, a first portion of the third heat flow F3 may be disposed on a first (e.g., lower) axial side of the base heater 28, and a second portion of the third heat flow F3 may be disposed on a second (e.g., upper) axial side of the base heater 28. Accordingly, at least a portion of the heat flow F2 and/or the heat flow F3 may be transferred to the lower end surface WL of one of the workpieces W1, W2 during use of the sublimation device 10, due in part to the pedestal 34. The heat H associated with the first, second, and/or third heat flows F1, F2, F3 may be insulated by, for example, one or more of the air gaps 35, 37 and/or material that forms one or both of the pedestal 34 and the insulative barrier 36.
Referring to
Referring to
With reference to
With continued reference to
With reference to
The thicknesses of each layer of the plurality of first material type layers 44a-44c, the plurality of second material type layers 46a-46d, and the heat-generating element 48 of the heater 26 shown in
In some implementations, a total thickness of the heater 26 may be between approximately about 1.5 mm and 1.9 mm. An exemplary thickness of each layer of the plurality of first material type layers 44a-44c, which may include a fiberglass material may be approximately about 0.1 mm. An exemplary thickness of each layer of the plurality of second material type layers 46a-46d, which may include a silicone material may be approximately about 0.5 mm. An exemplary thickness of the heat-generating element 48 may be approximately about 0.06 mm.
Referring to
With continued reference to
When the heater 26 of
Accordingly, a comparatively higher temperature produced at the first heat-generating zone 50a and the third heat-generating zone 50c achieves the same surface temperature of outer side surface WO of one of the workpieces W1, W2 of the plurality of differently sized workpieces W as provided by the second heat-generating zone 50b where the likelihood of a heat loss or heat sink is lower or non-existent. As such, the exemplary configuration of the heater 26 of
Although the heat-generating element 48 may be correspondingly “zoned” as described above, other configurations of the heater 26 may include a plurality of separate heat-generating elements 48; in such configurations, the plurality of separate heat-generating elements 48 may be arranged in one layer, or, alternatively, the plurality of separate heat-generating elements 48 may be arranged between the various layers of the plurality of layers defined by the plurality of first material type layers 44a-44c and the plurality of second material type layers 46a-46d. In some implementations, one heat-generating element 48 may heat one or more zones of the plurality of distinct heat-generating zones 50a, 50b, 50c and another heat-generating element 48 may heat the other zones of the plurality of distinct heat-generating zones 50a, 50b, 50c. In other configurations, a single heat-generating element 48 may include multiple heating zones that may correspond to each zone of the plurality of distinct heat-generating zones 50a, 50b, 50c, which can be controlled by the processor 1501 in order to produce different temperatures at each zone of the plurality of distinct heat-generating zones 50a, 50b, 50c.
With reference to
Furthermore, the exemplary heaters 26 of
Referring to
Furthermore, the base heater 28 may include one or more protrusions 60 and/or one or more cavities 62 into which connection hardware, such as, for example, screws or the like, may be inserted in order to secure the base heater 28 within outer housing 14. In some configurations, the 30) connection hardware may be used to secure the base heater 28 to the outer housing 14 through the insulative barrier 36, with the insulative barrier 36 being disposed beneath the base heater 28 and between the base heater 28 and the outer housing 14. Accordingly, the insulative barrier 36 may include one or more openings through which protrusions 60 and/or connection hardware may extend there through in order to secure the base heater 28 to the outer housing 14.
In some configurations, the insulative barrier 36 may include one or more openings through which one or more terminals 58a, 58b or electrical wires in communication with terminals 58a, 58b may extend such that the heating coil(s) of the base heater 28 may be connected to an electrical power. In this way, the power supply, other electronics, or other components of the sublimation device 10 that may power the heating coil(s) of the base heater 28 are separated from the heated body 54 of the base heater 28 by the insulative barrier 36 in order to protect such components from the heat H.
Referring to
As seen at
Referring to
Then, as seen at
The sublimation device 10 may include electronics (see, e.g., the processor 1501 of the CPU 150 at
After the processor 1501 determines that the heater 26 should no longer provide heat H, the processor 1501 may electrically deactivate the heater 26 and/or provide an indication (e.g., a sound and/or a flashing light) to a user that the sublimation process is complete. Thereafter, as seen at
Then, referring to
Referring to
As seen at
When the heat H is removed from the transfer sheet S and the outer side surface WO of one of the workpieces W1, W2 of the plurality of differently sized workpieces W, the infusible 20 sublimation ink I that transitioned from a solid state (as seen at, e.g.,
Once the heat H and pressure P is released, the infusible sublimation ink I that is “gassed” into the outer side surface WO of one of the workpieces W1, W2 of the plurality of differently sized workpieces W returns to the solid state, and, as seen at
The computing device 150 includes a processor 1501, memory 1502, a storage device 1503, a high-speed interface/controller 1504 connecting to the memory 1502 and high-speed expansion ports 1505, and a low speed interface/controller 1506 connecting to a low speed bus 1507 and a storage device 1503. Each of the components 1501, 1502, 1503, 1504, 1505, and 1506, are interconnected using various busses, and may be mounted on a common motherboard or in other manners as appropriate. The processor 1501 can process instructions for execution within the computing device 150, including instructions stored in the memory 1502 or on the storage device 1503 to display graphical information for a graphical user interface (GUI) on an external input/output device, such as display 1508 coupled to high speed interface 1504. In other implementations, multiple processors and/or multiple buses may be used, as appropriate, along with multiple memories and types of memory. Also, multiple computing devices 150 may be connected, with each device providing portions of the necessary operations (e.g., as a server bank, a group of blade servers, or a multi-processor system).
The memory 1502 stores information non-transitorily within the computing device 150. The memory 1502 may be a computer-readable medium, a volatile memory unit(s), or non-volatile memory unit(s). The non-transitory memory 1502 may be physical devices used to store programs (e.g., sequences of instructions) or data (e.g., program state information) on a temporary or permanent basis for use by the computing device 150. Examples of non-volatile memory include, but are not limited to, flash memory and read-only memory (ROM)/programmable read-only memory (PROM)/erasable programmable read-only memory (EPROM)/electronically erasable programmable read-only memory (EEPROM) (e.g., typically used for firmware, such as boot programs). Examples of volatile memory include, but are not limited to, random access memory (RAM), dynamic random access memory (DRAM), static random access memory (SRAM), phase change memory (PCM) as well as disks or tapes.
The storage device 1503 is capable of providing mass storage for the computing device 150. In some implementations, the storage device 1503 is a computer-readable medium. In various different implementations, the storage device 1503 may be a floppy disk device, a hard disk device, an optical disk device, or a tape device, a flash memory or other similar solid state memory device, or an array of devices, including devices in a storage area network or other configurations. In additional implementations, a computer program product is tangibly embodied in an information carrier. The computer program product contains instructions that, when executed, perform one or more methods, such as those described above. The information carrier is a computer- or machine-readable medium, such as the memory 1502, the storage device 1503, or memory on processor 1501.
The high speed controller 1504 manages bandwidth-intensive operations for the computing device 150, while the low speed controller 1506 manages lower bandwidth-intensive operations. Such allocation of duties is exemplary only. In some implementations, the high-speed controller 1504 is coupled to the memory 1502, the display 1508 (e.g., through a graphics processor or accelerator), and to the high-speed expansion ports 1505, which may accept various expansion cards (not shown). In some implementations, the low-speed controller 1506 is coupled to the storage device 1503 and a low-speed expansion port 1509. The low-speed expansion port 1509, which may include various communication ports (e.g., USB, Bluetooth, Ethernet, wireless Ethernet), may be coupled to one or more input/output devices, such as a keyboard, a pointing device, a scanner, or a networking device such as a switch or router, e.g., through a network adapter.
The computing device 150 may be implemented in a number of different forms, as shown in the figure. For example, it may be implemented in one or a combination of the sublimating device 10 and a laptop computer CP.
Various implementations of the systems and techniques described herein can be realized in digital electronic and/or optical circuitry, integrated circuitry, specially designed ASICs (application specific integrated circuits), computer hardware, firmware, software, and/or combinations thereof. These various implementations can include implementation in one or more computer programs that are executable and/or interpretable on a programmable system including at least one programmable processor, which may be special or general purpose, coupled to receive data and instructions from, and to transmit data and instructions to, a storage system, at least one input device, and at least one output device.
These computer programs (also known as programs, software, software applications or code) include machine instructions for a programmable processor, and can be implemented in a high-level procedural and/or object-oriented programming language, and/or in assembly/machine language. As used herein, the terms “machine-readable medium” and “computer-readable medium” refer to any computer program product, non-transitory computer readable medium, apparatus and/or device (e.g., magnetic discs, optical disks, memory, Programmable Logic Devices (PLDs)) used to provide machine instructions and/or data to a programmable processor, including a machine-readable medium that receives machine instructions as a machine-readable signal. The term “machine-readable signal” refers to any signal used to provide machine instructions and/or data to a programmable processor.
The processes and logic flows described in this specification can be performed by one or more programmable processors, also referred to as data processing hardware, executing one or more computer programs to perform functions by operating on input data and generating output. The processes and logic flows can also be performed by special purpose logic circuitry, e.g., an FPGA (field programmable gate array) or an ASIC (application specific integrated circuit). Processors suitable for the execution of a computer program include, by way of example, both general and special purpose microprocessors, and any one or more processors of any kind of digital computer. Generally, a processor will receive instructions and data from a read only memory or a random access memory or both. The essential elements of a computer are a processor for performing instructions and one or more memory devices for storing instructions and data. Generally, a computer will also include, or be operatively coupled to receive data from or transfer data to, or both, one or more mass storage devices for storing data, e.g., magnetic, magneto optical disks, or optical disks. However, a computer need not have such devices. Computer readable media suitable for storing computer program instructions and data include all forms of non-volatile memory, media and memory devices, including by way of example semiconductor memory devices, e.g., EPROM, EEPROM, and flash memory devices; magnetic disks, e.g., internal hard disks or removable disks; magneto optical disks; and CD ROM and DVD-ROM disks. The processor and the memory can be supplemented by, or incorporated in, special purpose logic circuitry.
To provide for interaction with a user, one or more aspects of the disclosure can be implemented on a computer having a display device, e.g., a CRT (cathode ray tube), LCD (liquid crystal display) monitor, or touch screen for displaying information to the user and optionally a keyboard and a pointing device, e.g., a mouse or a trackball, by which the user can provide input to the computer. Other kinds of devices can be used to provide interaction with a user as well; for example, feedback provided to the user can be any form of sensory feedback, e.g., visual feedback, auditory feedback, or tactile feedback; and input from the user can be received in any form, including acoustic, speech, or tactile input. In addition, a computer can interact with a user by sending documents to and receiving documents from a device that is used by the user; for example, by sending web pages to a web browser on a user's client device in response to requests received from the web browser.
A software application (i.e., a software resource) may refer to computer software that causes a computing device to perform a task. In some examples, a software application may be referred to as an “application,” an “app,” or a “program.” Example applications include, but are not limited to, system diagnostic applications, system management applications, system maintenance applications, word processing applications, spreadsheet applications, messaging applications, media streaming applications, social networking applications, and gaming applications.
The non-transitory memory may be physical devices used to store programs (e.g., sequences of instructions) or data (e.g., program state information) on a temporary or permanent basis for use by a computing device. The non-transitory memory may be volatile and/or non-volatile addressable semiconductor memory. Examples of non-volatile memory include, but are not limited to, flash memory and read-only memory (ROM)/programmable read-only memory (PROM)/erasable programmable read-only memory (EPROM)/electronically erasable programmable read-only memory (EEPROM) (e.g., typically used for firmware, such as boot programs). Examples of volatile memory include, but are not limited to, random access memory (RAM), dynamic random access memory (DRAM), static random access memory (SRAM), phase change memory (PCM) as well as disks or tapes.
As noted above, each of the implementations described in the detailed description above may include any of the features, options, and possibilities set out in the present disclosure, including those under the other independent implementations, and may also include any combination of any of the features, options, and possibilities set out in the present disclosure and figures. Further examples consistent with the present teachings described herein are set out in the following numbered clauses:
The following Clauses provide an exemplary configuration for a mug press and/or related systems or methods described above.
Clause 1: A mug press, comprising: a heater at least partially defining a receptacle; and a base heater disposed at the bottom of the receptacle.
Clause 2: The mug press of clause 1, wherein: the base heater comprises a top surface; and the top surface of the base heater is disposed perpendicular to a major axis of the receptacle.
Clause 3: The mug press of clause 1 or 2, wherein the heater comprises two or more distinct heat zones.
Clause 4: The mug press of clause 3, wherein at least one of the two or more distinct heat zones extends vertically along a side edge of the heater such that the at least one of the two or more heat zones is configured to contact a portion of an outer surface of a mug adjacent to a handle of the mug when the mug is placed into the receptacle during use of the mug press.
Clause 5: The mug press of clause 3 or 4, the heater comprising: a first side heat zone
extending vertically along a first side edge of the heater; a second side heat zone extending vertically along a second side edge of the heater; and a middle heat zone disposed between the first and second heat zones.
Clause 6: The mug press of clause 5, wherein the first and second side heat zones are configured to make contact with portions of an outer surface of a mug adjacent to either side of a handle of the mug when the mug is placed into the receptacle during use of the mug press.
Clause 7: The mug press of clause 5 or 6, further comprising a lower heat zone disposed at a bottom edge of the heater and extending between the first and second side heat zones below the middle heat zone.
Clause 8: The mug press of any of clauses 5 through 7, further comprising an upper heat zone disposed at a top edge of the heater and extending between the first and second side heat zones above the middle heat zone.
Clause 9: The mug press of any of clauses 1 through 8, wherein the base heater is configured to contact a bottom surface of a mug when the mug is placed into the receptacle during use.
Clause 10: The mug press of any of clauses 1 through 9, wherein the receptacle is cylindrical.
Clause 11: The mug press of any of clauses 1 through 10, the receptacle comprising a gap through which a handle of a mug can extend when the mug is placed in the receptacle during use of the mug press.
Clause 12: The mug press of any of clauses 1 through 11, wherein the receptacle comprises a cylindrical space that is open at a top thereof and closed at a bottom thereof.
Clause 13: The mug press of clause 12, wherein: the heater forms vertical sidewalls defining at least a portion of the cylindrical space; and an upper surface of the base heater forms a lower surface of the receptacle and defines at least a portion of closed bottom of the cylindrical space.
Clause 14: The mug press of any of clauses 3 through 13, wherein: the heater comprises: two or more layers; and a heating element disposed between two adjacent layers, and the heating element is configured to heat the two or more distinct heat zones separately.
Clause 15: The mug press of clause 14, further comprising two or more heating elements, each heating element configured to heat at least one of the two or more distinct heat zones.
Clause 16: The mug press of any of clauses 1 through 15, further comprising: an outer casing; and an insulative layer disposed between the base heater and the outer casing.
Clause 17: The mug press of clause 16, wherein the insulative barrier is disposed below the base heater.
Clause 18: The mug press of clause 16 or 17, insulative barrier comprising one or more openings through which one or more base heater electrical terminals, connection mechanisms, or electric wires may pass.
Clause 19: The mug press of any of clauses 16 through 18, wherein a power supply or other electronic components in communication with the base heater within the mug press are separated from the base heater by the insulative barrier.
Clause 20: The mug press of clause 1, wherein a diameter of the receptacle is configured to be expanded and contracted to release and clamp down, respectively, onto a mug during use of the mug press.
Clause 21: A sublimation device comprising: a first heater including a proximal end, a distal end disposed opposite the proximal end, and an inner surface extending between the proximal end and the distal end, the inner surface at least partially forming a cavity; and a second heater disposed proximate the distal end of the first heater.
Clause 22: The sublimation device of clause 1, wherein the cavity includes a major axis surrounded by the inner surface of the first heater, wherein the second heater includes a top surface disposed perpendicular to the major axis.
Clause 23: The sublimation device of any of clauses 21 through 22, wherein the first heater includes two or more distinct heat zones.
Clause 24: The sublimation device of clause 23, wherein at least one of the two or more distinct heat zones extend vertically along a side edge of the first heater such that the at least one of the two or more heat zones is configured to contact a portion of an outer surface of a workpiece adjacent to a flange of the workpiece when the workpiece is placed into the cavity.
Clause 25: The sublimation device of any of clauses 23 through 24, wherein the two or more distinct heat zones include: a first side heat zone extending vertically along a first side edge of the first heater; a second side heat zone extending vertically along a second side edge of the first heater; and a middle heat zone disposed between the first side heat zone and the second side heat zone.
Clause 26: The sublimation device of any of clauses 21 through 25, wherein the second heater is configured to face a bottom surface of a workpiece when the workpiece is placed into the cavity.
Clause 27: The sublimation device of any of clauses 21 through 26, wherein the cavity is cylindrical.
Clause 28: The sublimation device of any of clauses 21 through 27, wherein the first heater forms a gap that is configured to receive a flange portion extending from a workpiece when the workpiece is placed into the cavity.
Clause 29: The sublimation device of any of clauses 21 through 28, wherein the cavity is open at the proximal end and closed at the distal end.
Clause 30: The sublimation device of clause 29, wherein: the first heater forms a vertical sidewall defining at least a portion of the cavity; and an upper surface of the second heater defines at least a portion of a closed bottom of the cavity.
Clause 31: The sublimation device of any of clauses 21 through 30, further comprising: an outer casing; and an insulative layer disposed between the second heater and the outer casing.
Clause 32: The sublimation device of clause 31, wherein the insulative layer is disposed below the second heater.
Clause 33: The sublimation device of any of clauses 21 through 32, wherein the second heater is disposed within the cavity.
Clause 34: The sublimation device of any of clauses 21 through 33, wherein the first heater at least partially surrounds the second heater.
Clause 35: A method of sublimating ink on a workpiece, the method comprising: activating a first heater; transmitting, in a first direction, a first heat flow from the first heater during a first time period; activating a second heater; and transmitting, in a second direction, a second heat flow from the second heater during at least a portion of the first time period.
Clause 36: The method of clause 35, wherein the first direction is orthogonal to the second direction.
Clause 37: The method of clause 36, wherein the first direction extends radially, and the second direction extends axially.
Clause 38: The method of any of clauses 36 through 37, wherein the first heater at least partially defines a cavity, the method further comprising disposing a workpiece within the cavity.
Clause 39: The method of any of clauses 36 through 38, further comprising transmitting, in the second direction, a third heat flow from the first heater during the first time period.
Clause 40: The method of clause 39, wherein a first portion of the third heat flow is disposed on a first axial side of the second heater, and a second portion of the third heat flow is disposed on a second axial side of the second heater.
The articles “a,” “an,” and “the” are intended to mean that there are one or more of the elements in the preceding descriptions. The terms “comprising,” “including,” and “having” are intended to be inclusive and mean that there may be additional elements other than the listed elements. Additionally, it should be understood that references to “one implementation” or “an implementation” of the present disclosure are not intended to be interpreted as excluding the existence of additional implementations that also incorporate the recited features. Numbers, percentages, ratios, or other values stated herein are intended to include that value, and also other values that are “about” or “approximately” the stated value, as would be appreciated by one of ordinary skill in the art encompassed by implementations of the present disclosure. A stated value should therefore be interpreted broadly enough to encompass values that are at least close enough to the stated value to perform a desired function or achieve a desired result. The stated values include at least the variation to be expected in a suitable manufacturing or production process, and may include values that are within 5%, within 1%, within 0.1%, or within 0.01% of a stated value.
A person having ordinary skill in the art should realize in view of the present disclosure that equivalent constructions do not depart from the spirit and scope of the present disclosure, and that various changes, substitutions, and alterations may be made to implementations disclosed herein without departing from the spirit and scope of the present disclosure. Equivalent constructions, including functional “means-plus-function” clauses are intended to cover the structures described herein as performing the recited function, including both structural equivalents that operate in the same manner, and equivalent structures that provide the same function. It is the express intention of the applicant not to invoke means-plus-function or other functional claiming for any claim except for those in which the words ‘means for’ appear together with an associated function. Each addition, deletion, and modification to the implementations that falls within the meaning and scope of the claims is to be embraced by the claims.
The terms “approximately,” “about,” and “substantially” as used herein represent an amount close to the stated amount that still performs a desired function or achieves a desired result. For example, the terms “approximately,” “about,” and “substantially” may refer to an amount that is within less than 5% of, within less than 1% of, within less than 0.1% of, and within less than 0.01% of a stated amount. Further, it should be understood that any directions or reference frames in the preceding description are merely relative directions or movements. For example, any references to “up” and “down” or “above” or “below” are merely descriptive of the relative position or movement of the related elements.
The present disclosure may be embodied in other specific forms without departing from its spirit or essential characteristics. The described implementations are to be considered in all respects only as illustrative and not restrictive. Accordingly, other implementations are within the scope of the following claims, and all changes that come within the meaning and range of equivalency of the claims are to be embraced within their scope.
This U.S. patent application is a continuation of, and claims priority under 35 U.S.C. § 120 from, U.S. patent application Ser. No. 17/809,499, filed on Jun. 28, 2022, which is a continuation of U.S. patent application Ser. No. 17/177,965, filed on Feb. 17, 2021, now U.S. Pat. No. 11,407,245. The disclosures of these prior applications are considered part of the disclosure of this application and are hereby incorporated by reference in their entireties.
| Number | Date | Country | |
|---|---|---|---|
| Parent | 17809499 | Jun 2022 | US |
| Child | 18440536 | US | |
| Parent | 17177965 | Feb 2021 | US |
| Child | 17809499 | US |
