BRIEF DESCRIPTION OF THE DRAWINGS
The invention is illustrated by the drawings in which FIG. 1 is an electrical schematic diagram of a miniature power/data connector plug, and a mating socket having integrated over-voltage and over-current protection elements in accordance with principles of the present invention.
FIG. 2 is an orthogonal view in upward projection of one embodiment of a Micro-B USB connector socket incorporating principles of the present invention and showing the plug entry end, bottom side segments and right side of an outer shell.
FIG. 3 is an orthogonal view in upward projection, showing a contact pin array molded into a plastic body of the FIG. 2 socket structure.
FIG. 4 is a downward orthogonal view showing one preferred form of a pin, connector and lead array of the FIG. 2 socket structure.
FIG. 5 is an upward orthogonal view of the FIG. 4 pin, connector and lead array.
FIG. 6 is a top plan view of the FIGS. 4 and 5 pin, connector and lead array, showing an over-voltage protection element mounted on one side of a transverse heat spreading plate, and an over-current protection element mounted on an opposite side of the transverse heat spreading plate.
FIG. 7 is a right side view in elevation of the FIGS. 4 and 5 pin, connector and lead array showing relative placements of the over-voltage protection element, the transverse pin-array plate, and the over-current protection element.
FIG. 8 is a side view in elevation and section of the FIG. 2 assembled socket structure taken along a section line 7-7 in FIG. 2.
FIG. 9 is an orthogonal view in upward projection, showing the bottom side segments, right side and rear side of the outer shell of the FIG. 2 socket structure together with surface mount contact pin extensions.
FIG. 10 is a cutaway side assembly view in elevation of an alternative preferred Micro-B USB connector socket structure in accordance with principles of the present invention, wherein the over-current protection element is sandwiched between the transverse heat spreading plate and the over-voltage protection element.
FIG. 11 is an enlarged rear view in elevation of the molded plastic body of the FIG. 10 alternative socket structure.
FIG. 12 is an enlarged rear view in elevation of an alternative preferred Micro-B USB connector socket structure in accordance with principles of the present invention, wherein the over-current protection element is in a side-by-side arrangement with the over-voltage protection element, and wherein both protection elements are mounted to a common heat transfer plate and are electrically connect at edge connection pads to aligned pads of the socket structure.
DETAILED DESCRIPTION OF THE INVENTION
With reference to FIG. 1, an exemplary electrical connector assembly including a socket 10 and a mating plug 12 is shown diagrammatically. In this preferred example the socket 10 and plug 12 are in accordance with the Micro-B USB connector specification and provide power supply and return lines, differential data signal lines and an extra line, provided for example to identify the peripheral device of which the socket 10 is a part. The exemplary plug 12 extends from a distal end of a shielded electrical multi-conductor cable 14 and includes a molded plug housing comprising an electrical shield 16 forming a cable shield connection 18 connected to the electrical shield of the cable, and five connector pins 20, 22, 24, 26 and 27. In this particular arrangement, cable shield connection 18 interconnects the cable shield and the plug electrical shield 16, connector pin 20 connects to an electrical power supply wire, connector pins 22 and 24 connect to a differential data signal twisted pair, connector pin 26 connects to a power and signal ground return reference wire, and connector pin 27 connects to an optional ID wire. A non-illustrated other end of the cable 14 typically connects to a power and signal source, either through another USB plug, or directly.
The exemplary Micro-B USB socket 10 includes an electrical shield 30 and shield connection 32 for electrically connecting to the cable shield connection 18 of a compatible plug 12. The socket 10 also includes a power supply pin 34 for connecting to pin 22, two differential signal pins 36 and 38 for connecting to the data pin pair 22 and 24, a data signal and power return pin 40 for connecting to plug pin 26, and a peripheral ID pin 41 for connecting to the connector pin 27. While FIG. 1 diagrams the plug 12 as having pins and the socket as having receptacles, in practice both plug and socket contacts include aspects of pins and receptacles, as is well known and understood in the USB art.
In accordance with aspects of the present invention, an over-current device 42 and an over-voltage device 44 are integrated into and included within the plug 10. The over-current device 42 is connected in series between the power supply pin 34 and a socket connection lead 46. The over-voltage device 44 is connected in shunt across the connection lead 46 and a ground return lead 52 which in turn extends from the data signal and power return pin 40. Most preferably, the over-current device 42 is a PPTC thermistor, and the over-voltage device 44 is a high speed electronic device, most preferably a zener diode (as used herein “zener diode” includes a reverse breakdown avalanche diode). While a zener diode is presently preferred, other voltage-limiting electronic circuit elements are clearly within the contemplation of the present invention. Because the over-voltage device 44 responds to over-voltage conditions very rapidly, on the order of microseconds or faster, heat is quickly generated in the electronic device 44. This heat is thermally coupled via a heat transfer medium 54, denoted by the arrow labeled T in FIG. 1, to the PPTC thermistor 42 in order to raise its temperature and accelerate its trip to a high resistance state. The socket 10 also includes connection leads 48 and 50 respectively connecting to the two differential signal pins 36 and 38 and a connection lead 55 connecting to the peripheral ID pin 41. When a zener diode implements the over-voltage device 44, additional circuit protection is provided against reversed polarity of the power supply, since in the event of reversed polarity of the supply and return leads 34 and 40, the zener diode 44 will rapidly conduct and generate heat to aid tripping of the PPTC thermistor 42 in accordance with the diode's forward conduction characteristic.
FIG. 2 sets forth one presently preferred embodiment of the socket 10 in accordance with the present invention. In this embodiment the socket 10 includes a molded plastic body 28 (FIG. 3) incorporating a pin, connector and lead array 90 (FIGS. 4 and 5) held in place by the formed metal shield 30. A metal structure forming the shield 30 is most preferably formed by stamping and bending from a sheet of suitably thin sheet metal. As formed, the shell 30 includes a top wall 56 a left side wall 58, a right side wall 60, a left bottom wall segment 62, a right bottom wall segment 64 and a back wall 82. As formed the left bottom wall segment 62 and the right bottom wall segment 64 define complementary interlocking features 66 in the nature of a dove tail or puzzle piece arrangement for locking the two complementary bottom wall segments 62 and 64 together to form a locked, continuous bottom wall. The top wall 56 includes an outer flanged lip 68. The left side wall has an outer flanged lip 70 and surface mounting tab 72. The right side wall 60 in similar fashion includes an outer flanged lip 74 and a surface mounting tab 76. The bottom wall segments 62 and 64 respectively include outer flanged lip segments 78 and 80. The outer flanged lips 68, 70, 74 and lip segments 78 and 80 act to guide insertion of a compatible connector plug into mechanical and electrical engagement within the socket 10. Slot features 84 defined in side walls 58 and 60 function to receive protrusions or bosses 86 of the molded plastic body 28, thereby aiding in aligning and securing the plastic body 28 and its contact array 90 inside the shell 30.
As shown in FIG. 2, the pins 34, 36, 3840, and 41, and the corresponding connection leads 46, 48, 50, 52, and 55, are formed within, and are positioned in the formed metal shell 30 by the plastic body 28. The leads 46, 48, 50, 52 and 55 are flattened and aligned to be parallel with a plug-insertion axis of the connector socket 10 to facilitate surface mounting and connection to aligned connection pads of a printed circuit substrate of electronic circuitry (not shown) to be protected against over-current and over-voltage conditions in accordance with the present invention. While a surface mounting arrangement with a plug-insertion axis parallel to the aligned circuit board connection leads 46, 48, 50, 52 and 55 is presently preferred, those skilled in the art will understand that the principles of the present invention are equally applicable to a miniaturized socket having thru-hole pins and mounting tabs, or other known mounting arrangements and orientations including ones normal to the facing surface of an underlying printed circuit board substrate.
FIG. 3 illustrates one presently preferred form of the molded plastic body 28. The body 28 includes an elongated neck portion 29 extending from a generally rectangular body portion 31. Features such as recesses 33 and the bosses 86 enable the plastic body 28 to be securely and properly registered to and mounted within the metal shell 30 of the socket 10. Exposed portions of the pin, connector and lead array 90 (FIG. 4) define contact pins 34, 36, 38, 41 and 40, and also define flattened mounting tab ends of leads 46, 48, 50, 55 and 52 as shown in FIG. 3. The plastic body 28 is most preferably formed by injection molding over the pin, connector and lead array 90 in suitable thermoplastic molding apparatus. The body 28 is most preferably formed from a dielectric thermoplastic material, such as a minimum UL 94-V0 rated, 30 percent glass-filled polybutylene terephthalate (PBT) or polyethylene terephthalate (PET), or better, material.
FIGS. 4, 5, 6 and 7 illustrate an example of a pin, connector and lead array 90 as including segments defining pins 34, 36, 38, 41 and 40, and also defining a transverse heat spreading and transfer plate 92 which connects directly to lead 46, a ground return plate segment 94 extending from the pin 40 and lead 52, and a connection segment 96 extending from the pin 34. As shown in the FIGS. 4 and 5 embodiment, the over-voltage protection element 44 is sandwiched between (and connected to) the ground plate segment 94 and a front side of the transverse heat spreading plate 92, whereas the over-current protection element 42 is mounted and connected to a back side of the transverse heat spreading plate 92 and is also connected to the connection segment 96. The plate segment 94 includes a portion aligned with ground return lead 52, while the connection segment 96 is formed as part of, and is aligned with, pin 34 (as seen in FIG. 5). Transverse plate 92 is formed with and is directly connected to the lead 46, thus electrically connecting the PPTC thermistor current protection element 42 in series between pin 34 and lead 46 (as diagrammed in FIG. 1). In the present example the transverse heat spreading and transfer plate 92 forms the heat transfer medium 54 directly between the over-voltage element 44 and the adjacent portion of the over-current element 42. In this particular arrangement, the plate 92 also functions to spread the heat over a greater area of the over-current PPTC thermistor element 42, thereby facilitating more rapid tripping to its high resistance, circuit protective state.
A sacrificial bridging web (not shown in FIGS. 4 and 5) most preferably connects the pins 34-41 along the front of the lead pin array 90, and another sacrificial bridging web interconnects the leads 46-55 at the rear end of the array 90 in order to maintain alignment of the pin, connector and lead array 90 prior to overmolding of the plastic body 28. These sacrificial bridging webs of a lead frame forming the contact pin array 90 are sheared off and discarded as part of the manufacturing process after injection molding of the plastic body is complete. The connector pin array 90 is most preferably die formed or stamped from a suitable metal substrate, such as 0.3 mm phosphor bronze, nickel silver, or other suitable metal sheet material, and then coated with a suitable coating material such as tin.
FIG. 7 and the FIG. 8 sectional view show a peripheral space 98 that is provided between the edges of the over-current element 42 and the adjacent molded plastic body 28. This peripheral space 98 enables the over-current element 42, particularly when implemented as a PPTC thermistor, to expand in the tripped state without being impeded by the plastic body 28. FIG. 9 shows the completed socket assembly 10 and illustrates the back wall 82 and other features of the shell 30 and plastic body 28.
FIGS. 10 and 11 illustrate an alternative form of Micro-B USB connector socket 10A embodying principles of the present invention. Elements which are the same as described for socket 10 have the same reference numerals and description. In this alternative arrangement, the over-current and over-voltage protection elements 42A and 44A are formed as an integrated hybrid electronics circuit module which is premade and tested, and then attached to the back side of the lead pin array plate 92. FIG. 10 also illustrates the peripheral channel or space 98 separating the PPTC thermistor 42 from the adjacently facing inside walls of the molded plastic body 28A. In this arrangement the over-voltage protection element 44A is in direct thermal and electrical contact with the PPTC thermistor element 42A, thereby providing thermal transfer to accelerate trip of the PPTC thermistor 42A during an over-voltage/over-current event. Details concerning fabrication and assembly of a hybrid electronic circuit module comprising a zener diode in thermal and electrical contact with a PPTC thermistor are set forth in commonly assigned U.S. patent application Ser. No. 11/392,974 (Montoya et al.) filed on Mar. 27, 2006, and entitled “Surface Mount Multi-layer Electrical Circuit Protection Device With Active Element Between PPTC Layers” (Now U.S. Publication No. 2006/0215342A1 published on Sep. 28, 2006), the disclosure thereof being expressly incorporated herein by reference thereto.
Following formation of the plastic body 28A, the hybrid electronic circuit module comprising elements 42A and 44A is inserted into the recess space at the back and electrically connected thereto as by bonding a terminal electrode of the PPTC thermistor component 42A to form the connection to pin 34 to the transverse plate 92, and then bending connection segments 96 and 100 respectively over and into contact position with aligned connection regions of the PPTC thermistor component 42A and the zener diode component 44A, respectively, as shown in FIG. 11. The connection section 96 is then electrically connected to the PPTC thermistor component 42A by a suitable bonding agent, such as low temperature solder, and forms the common node connection between the PPTC thermistor 42 and the cathode of the zener diode 44A leading to the connection lead 46. The connection section 100 is likewise electrically connected to e.g. an anode electrode connection of the zener diode 44 and internally connected to the ground return lead 52. The completed plastic body assembly 28A is then ready for insertion into and inclusion within the outer metal shell 30 of the socket 10A. After the body assembly 28A is inserted into the formed metal shell 30, the back side 82 is folded down to lock the assembly 28 in place within the completed socket, as shown in FIG. 8, for example.
Alternatively, as shown in the FIG. 12 embodiment of a socket 10B in accordance with principles of the present invention, the over-voltage protection element 44A and the over-current protection element 42B are arranged in a side-by-side configuration and mounted to a heat transfer and mounting plate 93 providing a lateral heat transfer medium 54 and providing a hybrid subassembly. In this embodiment of the present invention the molded plastic body 28B is formed to provide conductor segments 96A and 100A extending inwardly from an inside face of a molded top wall region 105 of the plastic body 28B defining the recess for receiving the over-current and over-voltage protection hybrid subassembly. A third conductor segment 102 extends inwardly from an inside face of a molded bottom wall region 107 of the plastic body 28B. The conductor segment 96A is aligned with, and connected to, pin 34; and the conductor segment 102 is aligned with, and connected to, lead 46. The conductor segment 100A is aligned and connected in common with ground return pin 40 and lead 52. Edge connector pads 97 and 103 are formed at opposite edges of the over-current protection element 42B, with pad 97 aligning with conductor segment 96A, and with pad 103 aligning with conductor segment 102. A pad 101 formed at an edge of the over-voltage protection element 44A enables a ground return connection to be made, e.g. to an anode electrode of a zener diode. The arrangement shown in FIG. 12 enables the assembled hybrid electronics circuit module to be inserted into the recess defined by molded plastic body 28B and electrically connected by solder bridges between segment 96A and pad 97, between segment 100A and pad 101, and between segment 102 and pad 103, without any need for bending pins as was used in the FIGS. 10 and 11 example. In the example of FIG. 12, pad 103 is also connected to the heat transfer and mounting plate 93 which forms a common electrical connection between elements 42B and 44A.
Advantageously, the alternative sockets 10A and 10B enable usage of a circuit protection module comprising e.g. a PPTC thermistor element and e.g. a zener diode. The module may be separately made, assembled and pretested as a hybrid electronics circuit module prior to inclusion within the structure of the socket 10A or socket 10B.
In making the miniaturized socket of the present invention, the pin, connector and lead array 90 is formed out a sheet of suitable contact material by stamping or die forming. In the case of the first preferred embodiment, the over-voltage protection element, e.g. zener diode 44, is then positioned between and respective surface electrode terminals secured to plates 92 and 94, as shown in FIGS. 4 and 5. Then, the over-current protection element, e.g. PPTC thermistor 42 may be secured to an opposite face of the elongate transverse plate 92 forming the common node connection between the cathode of the zener diode 44 and the PPTC thermistor 42. The connection segment 96 may then be secured to and bonded to the non-common electrode of the PPTC thermistor 42. The plastic body 28 is then formed by injection-molding over the completed lead frame 90, with mold features ensuring the provision of the peripheral channel 98 to accommodate dimensional expansion of the PPTC thermistor 42 when operating in its tripped and thermally expanded state. Any sacrificial alignment features of the lead frame connector pin array 90 remaining following the molding step are then cut off, e.g., by a shearing operation. Also, the completed plastic body assembly 28 may then receive a thin protective corrosion-resistant overcoat. After the sheet metal shell 30 is stamped out and partially folded into its final shape, the completed plastic body 28 assembly is inserted into the shell and locked in place by folding down the rear wall 82 thereof.
The alternative embodiment connector socket 10A is similarly made with the exception that the lead frame 90A is formed with connection segments extending laterally to enable the over-current/over-voltage circuit module to be separately attached. The plastic body 28A is injection-molded around the lead frame 90A and any sacrificial alignment features are removed. Then, the electronic module is installed by connecting the non-common one of the PPTC thermistor's electrodes to the plate 92A. Then connection segments 96 and 100 are bent around the hybrid electronics module and connected to the common electrode between the PPTC thermistor component 42A and the cathode of the zener diode component 44A, and the anode electrode of the zener diode component 44A, respectively. The completed plastic body assembly 28A may then receive a thin protective corrosion-resistant overcoat and is then ready for insertion into the partially completed metal shell 30, and completion of the socket 10A as described above.
The alternative embodiment connector socket 10B employs edge connection pads formed on the zener diode 44A and the PPTC thermistor 42A and connected directly to pins, as shown in the referenced U.S. Publication No. 2006/0215342A1, without the need for bending over the connection segments 96 and 100 as shown in FIG. 10. In this particular example, the pin, connector and lead array is formed without the transverse heat spreading plate 92, since that function is provided by the heat transfer and mounting plate 93 of the hybrid electronics circuit module.
Those skilled in the art will appreciate that connection segment 96 is aligned vertically with connection lead 46, and connection segment 100 is aligned vertically with connection lead 52 as shown in the elevational view of FIG. 11. This geometric arrangement efficiently utilizes the space within the available footprint or envelope of the standard connector socket, so that the sockets 10, 1 OA and 10B affording over-voltage and over-current protection element, may be directly substituted for compliant standard sockets without these circuit protection capabilities.
While the present invention has been illustrated as embodied in an exemplary Micro-B, USB, connector socket, those skilled in the art will appreciate that over-current/over-voltage circuit protection elements and modules may be included in other forms of connectors, whether plugs, sockets, or both, and whether conforming to a standard or being a unique design. In particular, the present invention is directly applicable to the standardized Mini-B USB connector socket and enables a fully compatible, drop-in replacement or substitution for a Mini-B USB connector socket not including integrated over-voltage and over-current protection elements. Moreover, the present invention may employ a variety of over-voltage circuit protection elements beyond zener diodes, and may employ a variety of over-current circuit protection elements, including for example ceramic positive temperature coefficient thermistor devices, as well as polymeric positive temperature coefficient thermistor devices, for example.
Having thus described preferred embodiments of the invention, it will now be appreciated that the objects of the invention have been fully achieved, and it will be understood by those skilled in the art that many changes in construction and widely differing embodiments and applications of the invention will suggest themselves without departing from the spirit and scope of the invention. Therefore, the disclosures and descriptions herein are purely illustrative and are not intended to be in any sense limiting.
Patent Application
20080096429
