Claims
- 1. A vinyl polymer paint composition containing substantially flat surfaced vinyl polymer emulsion particles having a concavity in at least one of the flat surfaces, a diameter D of from 0.1 to 5.0 .mu.m, a particle diameter to thickness d ratio (D/d) of 1.2 to 5.0, wherein the polymer of the vinyl polymer emulsion particles is a polymer of at least one monomer selected from the group consisting of aromatic vinyl compounds, acrylate or methacrylate compounds and vinyl cyanides.
- 2. A paper coating composition containing substantially flat surfaced vinyl polymer emulsion particles having a concavity in at least one of the flat surfaces, a diameter D of from 0.1 to 5.0 .mu.m, a particle diameter to thickness d ratio (D/d) of 1.2 to 5.0, wherein the polymer of the vinyl polymer emulsion particles is a polymer of at least one monomer selected from the group consisting of aromatic vinyl compounds, acrylate or methacrylate compounds and vinyl cyanides.
- 3. The vinyl polymer paint composition of claim 1, wherein the substantially flat surfaced vinyl emulsion particles are obtained by a method comprising the steps of:
- (a) aqueous emulsion polymerizing a first vinyl monomer or mixture of monomers to form vinyl polymer seed particles; and
- (b) aqueous emulsion polymerizing a second vinyl monomer or mixture of monomers in the presence of the vinyl polymer seed particles produced in step (a) and a non-aqueous organic solvent having a surface tension to water at 20.degree. C. of 48 dyne/cm or more, in a weight ratio of the monomer or monomers employed in Step (a) to the monomer or monomers employed in Step (b) of from 0.5:99.5 to 50:50.
- 4. The vinyl polymer paper coating composition of claim 2, wherein the substantially flat surfaced vinyl emulsion particles are obtained by a method comprising the steps of:
- (a) aqueous emulsion polymerizing a first vinyl monomer or mixture of monomers to form vinyl polymer seed particles; and
- (b) aqueous emulsion polymerizing a second vinyl monomer or mixture of monomers in the presence of the vinyl polymer seed particles produced in step (a) and a non-aqueous organic solvent having a surface tension to water at 20.degree. C. of 48 dyne/cm or more, in a weight ratio of the monomer or monomers employed in Step (a) to the monomer or monomers employed in Step (b) of from 0.5:99.5 to 50:50.
Priority Claims (2)
Number |
Date |
Country |
Kind |
63-162591 |
Jul 1988 |
JPX |
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63-221844 |
Sep 1988 |
JPX |
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Parent Case Info
This application continuation of application Ser. No. 07/507,818, filed Apr. 12, 1990, now abandoned, which is a divisional of Ser. No. 07/373,427, filed Jun. 30, 1989, now U.S. Pat. No. 4,948,772.
US Referenced Citations (8)
Foreign Referenced Citations (6)
Number |
Date |
Country |
0022633 |
Jan 1981 |
EPX |
2459707 |
Jun 1975 |
DEX |
57-116692 |
Jul 1982 |
JPX |
59-59741 |
Apr 1984 |
JPX |
0115670 |
Jun 1985 |
JPX |
2207680 |
Feb 1989 |
GBX |
Non-Patent Literature Citations (2)
Entry |
English summary of C. Ueda, "Physical Properties and Applications of Composite Fine Powders," Powder and Industry, vol. 9, pp. 33-41 (1989). |
WPI AN-80-24207c, Derwent Publications & JP-A-55 023 126 Feb. 19, 1980. |
Divisions (1)
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Number |
Date |
Country |
Parent |
373427 |
Jun 1989 |
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Continuations (1)
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Number |
Date |
Country |
Parent |
507818 |
Apr 1990 |
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