Claims
- 1. A substrate coated with a powder coating composition comprisinga film-forming blend of: a) at least one non crystalline epoxy resin; b) from about 5% to about 15% by weight of at least one crystalline epoxy resin in an amount sufficient amount to reduce or eliminate bubble entrapment within the cured coating film formed from the powder coating composition; and, c) at curing agent to facilitate curing of said composition to a thermoset state, wherein incorporation of said crystalline epoxy resin reduces or eliminates bubble entrapment within the cured coating film formed from the powder coating composition when said composition is cured to a thermoset state at temperatures of below about 350° F.
- 2. A substrate coated with a powder coating composition comprisinga film-forming blend of: a) at least one non-crystalline epoxy resin having a Tg of greater than about 40° C.; b) from about 5% to about 15% by weight of at least one crystalline epoxy resin having a Tm of greater than about 90° C. in an amount sufficient to reduce or eliminate bubble entrapment within the cured coating film formed from the powder coating composition; and c) a curing agent to facilitate curing of said composition to a thermoset state; wherein incorporation of said crystalline epoxy resin reduces or eliminates bubble entrapment within the cured coating film formed from the powder coating composition when said composition is cured to a thermoset state at temperatures below 350° F.
- 3. A brass substrate clear coated with the powder coating of claim 1, and wherein the coated brass substrate resulting contains trapped bubbles in an amount insufficient to produce a visible haze in the cured coating film formed from said powder coating.
Parent Case Info
This application is a division of application Ser. No. 09/307,541 filed May 7, 1999, U.S. Pat. No. 6,140,430.
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