Embodiments of the invention relate generally to electronic device manufacturing including chemical mechanical planarization (CMP), and more particularly to substrate holder apparatus adapted for cleaning substrates after CMP.
After a chemical mechanical planarization (CMP) process is performed on a substrate (otherwise referred to as a “substrate”), the substrate typically is cleaned to remove unwanted debris and particles therefrom. For example, slurry, polished substrate material, or other residue may cling to the substrate, including the edge bevel of the substrate. Following CMP, substrates may be post-cleaned in a cleaning module such as a scrubber brush box, a megasonic tank, or the like to remove such unwanted material. Prior to the post-clean, and even after the post-clean, a rinse in a rinse tank may be used in some embodiments.
During the rinsing operations, the substrates may be dried upon being removed from the rinsing tank. Such drying is typically accomplished by use of an air knife, such as a Marangoni knife. However, some bath residue may be difficult to remove using conventional drying methods.
In some embodiments, a substrate holder apparatus for cleaning a substrate is provided. The substrate holder apparatus includes a frame having multiple substrate contact supports configured to contact and support a substrate, and one or more vacuum ports arranged along the frame and operable to apply a vacuum at one or more locations along a bottom edge of a substrate.
In some embodiments, a substrate holder assembly of a cleaning module adapted to clean a substrate is provided. The substrate cleaning module includes a substrate holder apparatus including: multiple substrate contact supports configured to support a substrate in an upright orientation, and one or more vacuum ports configured to apply a vacuum at one or more locations along a bottom edge of a substrate; and a vacuum apparatus coupled to the substrate holder apparatus and configured to apply a vacuum at the one or more vacuum ports.
In some embodiments, a method of cleaning a substrate is provided. The method includes supporting a substrate on multiple substrate contact supports on a frame of a substrate holder apparatus, providing one or more vacuum ports on the frame, and removing liquid from a bottom edge of the substrate by applying a vacuum to the one or more vacuum ports.
Other features and aspects of embodiments of the invention will become more fully apparent from the following detailed description of example embodiments, the appended claims, and the accompanying drawings.
Various embodiments of the invention are disclosed in the following detailed description and accompanying drawings.
In one or more embodiments of the present invention, a substrate holder assembly including a substrate holder apparatus is provided. Substrate holder apparatus is configured and adapted to hold a substrate during cleaning and drying (e.g., substrate rinsing and drying) and, as will be appreciated from the following, may aid in removal of residue from the substrate. The substrate holder apparatus may aid especially in cleaning the lower edges of the substrate, as well as around the substrate contact locations, and may therefore avoid residue buildup on a lower edge of the substrate, and/or around the substrate contact locations.
In some embodiments, following CMP, substrates may be rinsed in a first post-CMP rinse, and then may be transferred directly to a post-cleaning module, such as a scrubber brush box, a megasonic tank, or the like, for further cleaning. However, during a rinsing and drying process, even with the use of an air-knife or a Marangoni dryer to dry the substrate as it is retracted from the rinse bath, some adhered particles and/or residues may still remain, especially on contact points, and along a bottom edge of the substrate. Thus, embodiments of the present invention provide substrate holder assemblies, substrate holder apparatus, and operational methods that may provide improved residue removal as a substrate is removed from a rinsing bath.
In some embodiments, the substrate holder apparatus includes a frame having multiple substrate contact supports configured to contact and support a substrate, and one or more vacuum ports arranged along the frame. The one or more vacuum ports are operable (i.e., capable of being operated) to apply a vacuum at one or more locations along the bottom edge of a substrate.
In some embodiments, the one or more vacuum ports comprises one or more vacuum ports located substantially at a same location as the one or more substrate contact supports, which may include V-notches. As such, residue, which formerly would collect at such substrate contact support locations, is removed by the operation of one or more embodiments of the invention.
In one or more embodiments, the substrate holder apparatus may include one or more vacuum ports that are located on the frame of the substrate holder apparatus and positioned proximate to a lower edge of the substrate. The vacuum ports are operated to aid in residue removal along the lower edge, as the substrate is withdrawn from the rinsing bath. In some embodiments, the vacuum ports are operated in synchronism with an air knife or Marangoni dryer to assist in a substantially complete removal of the rinse liquid from the lower edge. In some embodiments, the one or more vacuum ports comprise one or more slots.
As used herein unless otherwise specified, the term “clean” is intended to mean the removal of liquid, residue, or other particles that have become adhered to a substrate. The substrate holder apparatus may be used to hold a substrate as it undergoes a cleaning method, such as a post-CMP cleaning method.
These and other features and embodiments of the invention will be described in more detail with reference to
Substrate holder apparatus 102 includes a frame 106, which may include a connecting portion 108 configured to attach to a lift 110 by suitable fasteners (e.g., bolts, screws or the like). Lift 110 may be a part of a robot (not shown) that is adapted to, lower, lift and/or position the substrate holder apparatus 102 within a tank (see
In the embodiment shown, the substrate 112 is held in a vertical orientation by multiple substrate contact supports 114A-114D. Multiple substrate contact supports 114A-114D are configured to contact and support the substrate 112. The multiple substrate contact supports 114A-114D may comprise the four substrate contact supports, as shown, but may also comprise three or more substrate contact supports in some embodiments. Substrate contact supports 114A, 114D (e.g., upper substrate contact supports) may be positioned at a first angle 115A of between about 0° and about 50° below the horizontal as shown, with the first angle 115A being about 25° in some embodiments. Substrate contact supports 114B, 114C (e.g., lower substrate contact supports) may be positioned at a second angle 115B of between about 0° and about 50° from the vertical as shown, and second angle 115B may be about 25° in some embodiments. Substrate contact supports 114A-114D may each comprise v-grooves. V-groove 418, as best shown in
As shown in
Substrate holder apparatus 102 includes one or more vacuum ports along the frame 106. Examples of vacuum ports 316, 416 are shown in
As shown in
These vacuum ports 416 may be connected to a first vacuum outlet 140. Connection to the first vacuum outlet 140 may be formed by the internal passage 244 (
Some portions of the internal passage 244 may be formed by the interaction of a cover 246 and the body 148 of the frame 106 (see broken-out section in
The vacuum port 316 may span along the lower end of the substrate 112. For example, the vacuum port 316 may extend entirely between the substrate contact support 114B and substrate contact support 114C. One vacuum port 316 (e.g., slot) is shown, but the distance could be serviced (e.g., aiding in drawing off drips, liquid film, and residue from the substrate 112) by using multiple side-by-side oriented slots. For example, one slot may be provided between substrate contact supports 114B, 114C, and an additional slot may be provided between substrate contact support 114A and 114B, or between substrate contact support 114C and 114D, or both.
Vacuum port 316, as shown in
As shown in
As shown, the vacuum port 316 (e.g., slot shown) may extend into or penetrate partway into the substrate contact support 114B, such that some air flow may be supplied at substrate contact support 114B proximate the contact location with the substrate 112. The left lower substrate contact support 114C may be identical in construction as the substrate contact support 114B in some embodiments.
Vacuum port 316 may be interconnected to a second vacuum outlet 142. Connection may be formed by second internal passage 335 (
As should be recognized, each of the first vacuum source 141 and the second vacuum source 143 may be turned on and operated separately and independently from one another. Control may be provided via control signals from a vacuum controller 147. Vacuum controller 147 may communicate with a robot controller (not shown) in order to coordinate activities during the process of lifting the substrate holder apparatus 102 and applying vacuum to the vacuum ports 316, 416. Thus, it should be apparent that at least two vacuum ports (e.g., 316 and 416) may include individually-controllable flow rates thereat. Vacuum pressure levels and thus airflow rates at the vacuum ports (e.g., 316 and 416) may vary in amount and/or time of application.
The various methods described herein may be implemented by, or under the control of, the vacuum controller 147, which may be, for example, an appropriately programmed computer, work station, or other computing or processing device. Typically a processor (e.g., one or more microprocessors) will receive instructions from a memory or like device, and execute those instructions, thereby performing one or more methods defined by those instructions. Further, programs that implement such methods may be stored and transmitted using a variety of media (e.g., computer readable media) in any manner. In some embodiments, hard-wired circuitry or custom hardware may be used in place of, or in combination with, software instructions for implementation of the processes of various embodiments. Thus, embodiments of the vacuum controller 147 are not limited to any specific combination of hardware and software. The vacuum controller 147 may include various components and devices (e.g., a processor, input and output devices, sensor(s), and the like) appropriate to provide the desired airflow rates.
As shown in
With reference again to
As the substrate 112 exits the tank 630, it again passes by the sprayer assembly 636 where the substrate 112 may optionally receive a spray of cleaning liquid 631. The substrate 112 may then be pulled through a dryer assembly 638. Dryer assembly 638 may be any suitable device that enables a flow of drying gas at the sides of the substrate 112, such as an air knife or Marangoni dryer, such as taught in U.S. Pat. Nos. 8,869,422 and 8,322,045, for example. Other configurations of the dryer assembly 638 may be used. After the substrate contact supports 114A, 114D exit the cleaning liquid 631 (or pass through the sprayer assembly 636, if used), the first vacuum source 141 may be turned on by a control signal received from the vacuum controller 147 based on the coordination with the position of the substrate holder apparatus 102 from robot controller (not shown).
In some embodiments, the vacuum provided at the first vacuum outlet 140 and second vacuum outlet 142 may be provided by a vacuum apparatus 704 including a single vacuum source 741. Single vacuum source 741 may be fluidly coupled to a diversion valve 750, which is fluidly coupled to first conduit 752 and second conduit 754 connected to each of the first vacuum outlet 140 and second vacuum outlet 142, as is shown in
Optionally, as shown in
For example, opening the first valve 850A via signals from the vacuum controller 847, while keeping second valve 850B closed, may to apply vacuum to, and thus air outflow at the first vacuum outlet 140, but no vacuum or outflow to the second vacuum outlet 142. Likewise, opening the second valve 850B via signals from the vacuum controller 847, while keeping first valve 850A closed, may to apply vacuum to, and thus air outflow at the second vacuum outlet 142, but no vacuum or outflow at the first vacuum outlet 140. In this embodiment, both may be opened at the same time, thus providing vacuum and air outflow to both the first vacuum outlet 140 and the second vacuum outlet 142 simultaneously.
The application of air outflow into the vacuum ports 316, 416 assists the dryer assembly 638 in removing liquid and/or residue that may accumulate next to the substrate contact supports 114A, 114D due to, for example, low pressure areas and/or vortex or eddy flows created by the operation of the dryer assembly 638 around the physical structure of the frame 106 and the substrate contact supports 114A, 114D.
As the substrate continues an upward path out of the tank 630, the substrate 112 may continue to be subjected to the spray from the sprayer assembly 636 (if used) and drying from the dryer assembly 638. After the substrate contact supports 114B, 114C pass out of the cleaning liquid 631 and through the sprayer assembly 636 (if used), the second vacuum source 143 may be turned on by a control signal received from the vacuum controller 147. This provides a vacuum along the vacuum port 316 that assists in removing cleaning liquid and residue that may accumulate next to the substrate contact supports 114B, 114C, as well as along the bottom edge of the substrate 112, such as between the substrate contact supports 114B, 114C.
It should be understood that the first vacuum source 141 may be turned off (or valves 750 or 850A may be closed) after the substrate contact supports 114A, 114D pass through the dryer assembly 638 (e.g., air knife). Likewise, the second vacuum source 143 may be turned off (or valves 750 or 850B may be closed) as the substrate contact supports 114B, 114C and lower edge of the substrate 112 pass though the dryer assembly 638. Optionally, both vacuum ports 316, 416 may continue to receive vacuum and provide air outflow until the entire substrate passes through the dryer assembly 638.
In some embodiments, vacuum, and thus air outflow, may be provided to the vacuum ports 316, 416 as they actually pass through the sprayer assembly 636. In this manner, cleaning liquid 631 may be stripped from the surfaces of the substrate 112 and around the substrate contact supports 114A-114D in mass, sort of as an entrained sheet of liquid, which may improve drying.
With reference to
The method 1000 includes, in 1004, providing one or more vacuum ports (e.g., vacuum ports 316, 416) on the frame (e.g., frame 106), and, in 1006, removing liquid (e.g., cleaning liquid 631 from the tank 630, and/or liquid from a sprayer assembly 636 (if used)) from a bottom edge of the substrate (e.g., substrate 112) by applying a vacuum (e.g., from the first and second vacuum source 141, 143 or a single vacuum source 741 or 841) to the one or more vacuum ports (e.g., vacuum ports 316, 416).
In some embodiments, the first vacuum (e.g., vacuum applied by the first vacuum source 141 or the single vacuum source 741, 841) may be applied to a first one of the one or more vacuum ports (e.g., to vacuum ports 416), and a second vacuum (e.g., vacuum applied by the second vacuum source 143 or the single vacuum source 741 or 841) may be applied to a second one of the one or more vacuum ports (e.g., to vacuum port 316). Thus, the first vacuum may be applied at a different time than the second vacuum, i.e., the vacuum may be applied sequentially. Vacuum may be shut off to the first vacuum outlet 140 and the second vacuum outlet 142 once the respective vacuum ports 416, 316 have passed through the dryer assembly 638. Shutoff may be sequential or simultaneous. Once the substrate 112 has completed the cleaning operation, it may be moved on to a next processing operation.
The foregoing description discloses only example embodiments of the invention. Modifications of the above-disclosed assemblies, apparatus, and methods which fall within the scope of the invention will be readily apparent to a person of ordinary skill in the art. While embodiments of the invention have been described primarily with regard to cleaning (e.g., rinsing) a substrate after CMP, it will be understood that embodiments of the invention may be employed for other substrate cleaning and/or pre-cleaning applications.
Accordingly, while the invention has been disclosed in connection with example embodiments thereof, it should be understood that other embodiments may fall within the scope of the invention, as defined by the following claims.