This application claims priority of Taiwanese Patent Application No. 109121297, filed on Jun. 23, 2020.
The disclosure relates to a dual-polarized patch antenna, and more particularly to a substrate-integrated-waveguide-fed cavity-backed dual-polarized patch antenna.
Because of highly advanced development of dual-polarized antenna technology, it is possible to implement a dual-polarized antenna, which has a high gain and uses only one radiation surface, in the millimeter band or in bands with even higher frequencies. For example, Chinese Patent Application Publication No. 108550981A discloses a dual-polarized slot antenna that includes, from top to bottom, a metal radiator, a feeding structure for horizontal polarization and a feeding structure for vertical polarization. That is, feeding ports for different polarizations are respectively located on substrates of different layers to achieve dual-polarized operation. As such, the dual-polarized slot antenna requires at least two substrates to implement its feeding network, resulting in high material costs and integration difficulty. In addition, slots of the dual-polarized slot antenna are limited to a length of about ½ wavelength, so the dual-polarized slot antenna has difficulty radiating a radio frequency signal with a frequency deviated from its operating frequency, and has a narrow bandwidth.
Therefore, an object of the disclosure is to provide a substrate-integrated-waveguide-fed cavity-backed dual-polarized patch antenna that can alleviate the drawbacks of the prior art.
According to the disclosure, the dual-polarized patch antenna includes a first insulating substrate, a plurality of conductive connections, a first metal layer, a second metal layer, a second insulating substrate and four radiation patch units. The first insulating substrate has a first surface, and a second surface that is opposite to the first surface of the first insulating substrate. Each of the conductive connections passes through the first insulating substrate from the first surface thereof to the second surface thereof. The conductive connections are spaced apart from one another, and are arranged to form a resonant cavity, a first feeding port that is connected to the resonant cavity, and a second feeding port that is connected to the resonant cavity and that is perpendicular to the first feeding port. The first metal layer is disposed on the first surface of the first insulating substrate. The second metal layer is disposed on the second surface of the first insulating substrate, and is formed with a cross-shaped slot that corresponds in position to the resonant cavity. The second insulating substrate is disposed on the second metal layer, and has a first surface that faces the second metal layer, and a second surface that is opposite to the first surface of the second insulating substrate. The radiation patch units are disposed at intervals and symmetrically on the second surface of the second insulating substrate, and correspond in position and respectively to four regions that are on the second metal layer and that are spaced apart by the cross-shaped slot.
Other features and advantages of the disclosure will become apparent in the following detailed description of the embodiment with reference to the accompanying drawings, of which:
Referring to
The first insulating substrate 1 has a first surface 11, and a second surface 12 that is opposite to the first surface 11 of the first insulating substrate 1.
Each of the conductive connections 13 passes through the first insulating substrate 1 from the first surface 11 thereof to the second surface 12 thereof. The conductive connections 13 are spaced apart from one another, and are arranged to form a resonant cavity 131, a first feeding port 132 that is connected to the resonant cavity 131, and a second feeding port 133 that is connected to the resonant cavity 131 and that is perpendicular to the first feeding port 132. Each of the conductive connections 13 may be a solid metal rivet (e.g., a copper post) that fills a respective through hole of the first insulating substrate 1, or may be a conductive channel that is formed by coating a wall which defines the respective through hole of the first insulating substrate 1 with conductive material.
As shown in
where
“Leff” denotes an effective side length of the resonant cavity 131, “Lcav” denotes an actual side length of the resonant cavity 131, “d” denotes a diameter of each of the conductive connections 13, “p” denotes a center-to-center distance between two adjacent ones of the conductive connections 13, “h1” denotes a thickness of the first insulating substrate 1, “ε” denotes a dielectric constant of the first insulating substrate 1, “μ” denotes a permeability of the first insulating substrate 1, “m” denotes a number of changes of a horizontal electric field, “n” denotes a number of changes of a vertical electric field,
and “w” denotes a width of each of the first and second feeding ports 132, 133 (i.e., w=Wp1=Wp2).
As shown in
The first metal layer 2 is disposed on the first surface 11 of the first insulating substrate 1, and is, for example, a copper foil.
The second metal layer 3 is disposed on the second surface 12 of the first insulating substrate 1, and is formed with a cross-shaped slot 31 that corresponds in position to the resonant cavity 131. As shown in
It should be noted that the first insulating substrate 1, the conductive connections 13 and the first and second metal layers 2, 3 can be implemented using a double-sided printed circuit board. The double-sided printed circuit board includes a substrate layer, which is, for example, a prepreg made of halogen free IT-88GMW and which corresponds to the first insulating substrate 1, and two copper layers, which are respectively on both sides of the substrate layer and which respectively correspond to the first and second metal layers 2, 3. First, the double-sided printed circuit board is drilled with a plurality of through holes that cooperatively define the shapes of the resonant cavity 131 and the first and second feeding ports 132, 133. Then, each of the through holes is lined with a solid metal rivet (e.g., a copper post) that serves as a respective one of the conductive connections 13, or a wall defining the through hole is coated with copper to form a conductive channel that serves as the respective one of the conductive connections 13. Finally, both sides of the double-sided printed circuit board are leveled with gel material (e.g., copper paste, resin, etc.). In this way, the resonant cavity 131 and the first and second feeding ports 132, 133 are formed, and there are no holes in the first and second metal layers 2, 3.
The second insulating substrate 4 is disposed on the second metal layer 3, and has a first surface 41 that faces the second metal layer 3, and a second surface 42 that is opposite to the first surface 41 of the second insulating substrate 4. The second insulating substrate 4 is, for example, a laminate made of halogen free IT-88GMW.
As shown in
where εr denotes a dielectric constant of the second insulating substrate 4, and λ0 denotes the wavelength that corresponds to the operating frequency of the dual-polarized patch antenna. Therefore, the shorter the side length (L2), the shorter the wavelength (λ0) (i.e., the higher the operating frequency). On the contrary, the longer the side length (L2), the longer the wavelength (λ0) (i.e., the lower the operating frequency). In other words, the dimensions of the radiation patch units 5 influence the operating frequency of the dual-polarized patch antenna. In addition, parasitic capacitances, each of which exists between two adjacent ones of the radiation patch units 5 and is related to a distance (Wd) between the two radiation patch units 5, influence a bandwidth of the dual-polarized patch antenna. Therefore, the bandwidth of the dual-polarized patch antenna can be increased by properly designing the distance (Wd)).
It should be noted that, referring to
Referring back to
In this embodiment, the operating frequency of the dual-polarized patch antenna is 28 GHz (i.e., the dual-polarized patch antenna radiates or receives radio frequency signals each with a frequency approximating or equal to 28 GHz), and example values for various dimensions of the dual-polarized patch antenna are given in the table below.
Referring to
Referring back to
1. Since two radio frequency signals with different polarizations can be fed to the resonant cavity 131 respectively via two substrate integrated waveguides (i.e., the first and second feeding ports 132, 133) that are formed using the same substrate (i.e., the first insulating substrate 1), and can be coupled to the radiation patch units 5 through the cross-shaped slot 31 that is formed on the second metal layer 3, dual-polarized operation can be achieved.
2. Since the two substrate integrated waveguides are formed using the same substrate, the dual-polarized patch antenna can have reduced material costs, and can be easily integrated with other feeding elements (e.g., the microstrips 6 shown in
3. By properly designing the parasitic capacitances of the radiation patch units 5, the bandwidth of the dual-polarized patch antenna can be increased.
4. By virtue of the concave structure 134 that is formed between the first and second feeding ports 132, 133, the isolation between the first and second feeding ports 132, 133 can be enhanced, and the insertion loss can be reduced.
In the description above, for the purposes of explanation, numerous specific details have been set forth in order to provide a thorough understanding of the embodiment. It will be apparent, however, to one skilled in the art, that one or more other embodiments may be practiced without some of these specific details. It should also be appreciated that reference throughout this specification to “one embodiment,” “an embodiment,” an embodiment with an indication of an ordinal number and so forth means that a particular feature, structure, or characteristic may be included in the practice of the disclosure. It should be further appreciated that in the description, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of various inventive aspects.
While the disclosure has been described in connection with what is considered the exemplary embodiment, it is understood that the disclosure is not limited to the disclosed embodiment but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements.
Number | Date | Country | Kind |
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109121297 | Jun 2020 | TW | national |
Number | Name | Date | Kind |
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20160365638 | Luk | Dec 2016 | A1 |
20170040703 | Cheng et al. | Feb 2017 | A1 |
Number | Date | Country |
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101242027 | Aug 2008 | CN |
203760675 | Aug 2014 | CN |
104934702 | Sep 2015 | CN |
103943963 | Jan 2016 | CN |
108550981 | Sep 2018 | CN |
209232965 | Aug 2019 | CN |
Entry |
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Z. Chen, H. Liu, J. Yu, and X. Chen, “High gain, broadband and dual-polarized substrate integrated waveguide cavity-backed slot antenna array for 60 GHz band,” IEEE Access., vol. 6, pp. 31012-31022,2018. |
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S. Mukherjee and A. Biswas, “Substrate integrated waveguide (SIW) cavity backed slot antenna for polarization diversity application,” in Proc. IEEE Appl. Electromagn. Conf., 2015, pp. 1-2. |
Search Report appended to an Office Action, which was issued to Taiwanese counterpart Application No. 109121297 by the TIPO dated May 17, 2021 with an English translation thereof (2 pages). |