The present invention relates to a substrate and, more particularly, to a loader for loading a substrate as thin as 200 micrometers or thinner.
Various pieces of equipment are used to execute tasks on a substrate such as inspection, imaging, printing, irradiation with laser, and cutting. Each piece of equipment is used to execute only one of the tasks. Hence, the substrate is moved from one piece of equipment to another piece of equipment. The substrate will suffer grave and irreparable defects and must be disposed of if any misalignment occurs in the movement.
A loader is often used to load and unload the substrate. The loader includes a transporter and a pre-aligner. The transporter is used to move the substrate between load/unload ports of the pieces of equipment, the pre-aligner and a workbench.
The substrate is often a composite substrate made of various types of metal that exhibit different values of ductility. Hence, the substrate often suffers warpage after grinding and polishing when the thickness of the substrate is smaller than 200 μm, 100 μm or even 50 μm and the diameter of the substrate is larger than 8, 12 or even more inches.
Referring to
The present invention is therefore intended to obviate or at least alleviate the problems encountered in the prior art.
It is an objective of the present invention to provide a loader for firmly holding a substrate.
It is another objective of the present invention to provide a loader for firmly holding a substrate without any risk of damaging the substrate.
It is another objective of the present invention to provide a loader for flattening a substrate for effective pre-alignment.
To achieve the foregoing objectives, the loader includes a pre-aligner and a transporter. The pre-aligner includes a base, a moving mechanism, a platform and a sensing unit. The moving mechanism includes an axle inserted in the base. The platform is coaxially connected to the axle and formed with a fetching face operable for generating an electrostatic field to attract a substrate. The sensing unit is located on the base and operable for sensing an orienting portion of the substrate. The transporter includes a fork formed with a fetching face operable for generating an electrostatic field to attract the substrate.
Other objectives, advantages and features of the present invention will be apparent from the following description referring to the attached drawings.
The present invention will be described via detailed illustration of the preferred embodiment referring to the drawings wherein:
Referring to
Referring to
The base 11 is a hollow element located in the machine 500. The moving mechanism 12 is inserted in the base 11. The sensing unit 15 is supported on the base 11. The translating unit of the moving mechanism 12 moves the platform 20 relative to the sensing unit 15.
The platform 20 includes a fetching face 21 at an upper end. The fetching face 21 is used to contact the substrate 100. Electrodes are arranged on the fetching face 21. The electrodes enable the fetching face 21 to attract the substrate 100 electrostatically, thereby keeping the substrate 100 in position relative to the fetching face 21. A diameter of the platform 20 is smaller than a diameter of the substrate 100 and is larger than one third of the diameter of the substrate 100. The platform 20 does not reach the orienting portion 105 of the substrate 100 as the substrate 100 rests coaxially on the platform 20. However, the platform 20 adequately attracts and flattens the entire substrate 100, including the orienting portion 105.
The moving mechanism 12 includes a rotating unit, a lifting unit and a translating unit. The rotating unit rotates the platform 20. The lifting unit is coaxial with the platform 20. Moreover, the lifting unit is movable up and down relative to the platform 20.
The rotating unit includes an axle 13 driven by a motor (not numbered). The axle 13 is coaxially connected to the platform 20. Thus, the motor rotates the platform 20 via the axle 13. A slip ring can be used to keep the electrodes electrically connected to the electrostatic generator in the rotation of the platform 20.
The lifting unit includes a support 24 driven by a pneumatic cylinder (not numbered). The pneumatic cylinder can be replaced with a hydraulic cylinder in another embodiment.
The support 24 preferably includes a single rod coaxially inserted in the axle 13, which is a hollow element. The support 24 can include three rods in another embodiment. The support 24 includes a fetching face 25 at an upper end. Electrodes (not numbered) are arranged on the fetching face 25. The electrodes enable the fetching face 25 to attract the substrate 100 electrostatically. The support 24 is extensible through an aperture centrally made in the platform 20 so that the fetching face 25 is movable between a lower position and an upper position without interfering with the rotation of the platform 20. In the lower position, the fetching face 25 is coplanar with or lower than the fetching face 21 (
The sensing unit 15 senses the substrate 100. The sensing unit 15 can be an optical, imagery or mechanical sensing unit.
Referring to
As discussed above, the fetching face 32 and the contact 21 can fetch the substrate 100 that is as thin as 200 micrometers or thinner. Thus, the machine 500 can firmly handle the substrate 100. Moreover, the fetching face 21 can keep the substrate 100 flat to allow proper processing on the substrate 100.
To align the substrate 100, the machine 500 executes a process to be described referring to
At S21, the substrate 100 is provided in the load/unload port 505 of the machine 500.
At S22, the fetching face 32 of the fork 31 electrostatically attracts the substrate 100.
At S23, the transporter 30 transfers the substrate 100 onto the platform 20 of the pre-aligner 10. In the beginning, the cylinder 33 moves the support 24 to the upper position. Then, the fork 31 moves the substrate 100 to a position above the support 24. Then, the fork 31 descends, thereby transferring the substrate 100 onto the support 24. Then, the fetching face 25 attracts the substrate 100 electrostatically. Then, the fork 31 leaves the pre-aligner 10. Then, the pneumatic cylinder 33 moves the support 24 to the lower position, thereby laying the substrate 100 onto the platform 20.
In another embodiment, while moving to the upper position, the support 24 moves beyond the fork 31. Thus, support 24 takes the substrate 100 from the fork 31 without having to lower the fork 31.
At S24, the fetching face 21 of the platform 20 electrostatically attracts and flattens the substrate 100. To this end, the electrodes 22 generate an electrostatic field on the fetching face 21 to attract the substrate 100. Moreover, the fetching face 21 flattens the substrate 100 (
At S25, the pre-aligner 10 aligns the substrate 100.
At S26, the fork 31 fetches the aligned substrate 100 from the pre-aligner 10.
At S27, the fork 31 transfers the aligned substrate 100 to the workbench 501 of the machine 500.
At S28, the machine 500 processes the aligned substrate 100.
At S29, the transporter 30 transfers the processed substrate 100 to the load/unload port 505.
Referring to
To transfer the substrate 100 onto the platform 20 from the fork 31, the fork 31 is moved to a position above the platform 20. Now, the substrate 100 is located above the platform 20. Then, the fork 31 is lowered to a position below the platform 20 as the prongs of the fork 31 are inserted in the slits 28. Thus, the substrate 100 is transferred onto the platform 20 from the fork 31. Then, the fork 31 is moved from the pre-aligner 10, i.e., the prongs of fork 31 are moved from the slits 28.
The foregoing process is reversed to transfer the substrate 100 to the fork 31 from the platform 20. Then, the substrate 100 can undergo other tasks.
The electrodes are used on the fetching faces 21, 25 and 32 to generate electrostatic fields to attract the substrate 100. Hence, the fetching faces 21, 25 and 32 properly attract the substrate 100 even if the substrate 100 suffers grave warpage. Furthermore, the fetching face 21 flattens the substrate 100 to allow effective alignment of the substrate 100. Moreover, there is substantially no risk of damaging the substrate 100 during the transfer and alignment of the substrate 100.
The present invention has been described via the illustration of the embodiments. Those skilled in the art can derive variations from the embodiments without departing from the scope of the present invention. Therefore, the embodiments shall not limit the scope of the present invention defined in the claims.
Number | Date | Country | Kind |
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111101956 | Jan 2022 | TW | national |