SUBSTRATE PLATING APPARATUS INCLUDING HYBRID PADDLE THAT SIMULTANEOUSLY CIRCULATES AND STIRS PLATING SOLUTION AND REMOVES AIR BUBBLES

Abstract

Provided is a substrate plating apparatus capable of simultaneously circulating and stirring a plating solution and removing air bubbles. The plating apparatus includes a hybrid paddle disposed in front of a substrate in a plating bath to stir the plating solution. Here, the hybrid paddle includes a spray assembly for spraying the plating solution toward the substrate and a suction assembly for suctioning air bubbles formed on the substrate during plating, and the spray assembly and the suction assembly are coupled into one body and perform a reciprocating movement along a surface of the substrate to stir the plating solution.

Description

BACKGROUND

The present invention relates to a substrate plating apparatus, and more particularly, to a substrate plating apparatus that simultaneously circulates and stirs a plating solution and removes air bubbles.

A substrate plating apparatus necessarily has a force of stirring a plating solution to realize a constant plating quality. To this end, the related art discloses various stirring units for performing a reciprocating movement of a substrate, supplying the plating solution to the substrate through a spray device, or stirring the plating solution by using a paddle.

Here, a feature of effectively removing air bubbles generated from the substrate during plating is important to realize the constant plating quality. However, the typical stirring unit may not effectively remove air bubbles attached to the substrate although exhibiting an effect of distributing a portion of the air bubbles. Also, a typical vertical-type plating apparatus attempts to apply an impact or a vibration to the substrate for removing the air bubbles, which causes damages or deviation of the substrate. The typical horizontal-type plating apparatus also attempts to incline or rotate the substrate for removing the air bubbles, which requires a separate driving device.

SUMMARY

The present invention provides a substrate plating apparatus capable of simultaneously circulating and stirring a plating solution and removing air bubbles.

The object of the present invention is not limited to the aforesaid, but other objects not described herein will be clearly understood by those skilled in the art from descriptions below.

An embodiment of the present invention provides a plating apparatus for a substrate, which plates a substrate, including: a plating bath for accommodating a plating solution; and a hybrid paddle disposed in front of the substrate in the plating bath to stir the plating solution. Here, the hybrid paddle includes a spray assembly for spraying the plating solution toward the substrate and a suction assembly for suctioning air bubbles formed on the substrate during plating, and the spray assembly and the suction assembly are coupled into one body and perform a reciprocating movement along a surface of the substrate to stir the plating solution.

In an embodiment, the spray assembly may include: a plurality of spray tubes spaced in parallel to each other to spray the plating solution; and a supply tube connected to one end of each of the plurality of spray tubes to transfer the plating solution, and the suction assembly may include: a plurality of suction tubes arranged alternately with the plurality of spray tubes to suction the air bubbles; and a discharge tube connected to one end of each of the plurality of suction tubes to transfer the air bubbles.

In an embodiment, each of the spray tubes may spray the plating solution through a plurality of spray nozzles formed toward the substrate, and each of the suction tubes may suction the air bubbles through a plurality of suction holes formed toward the substrate.

In an embodiment, the plating apparatus may further include a pump and a venturi tube, which circulate the plating solution and supply the plating solution to the hybrid paddle. Here, the pump may collect the plating solution accommodated in the plating bath and discharge the collected plating solution to the venturi tube, the venturi tube may supply the plating solution discharged from the pump to the spray assembly, and an acceleration section in which a flow velocity in the venturi tube is accelerated may be connected to the suction assembly through a circulation flow path to provide a suction force to the suction assembly.

Particularities of other embodiments are included in the detailed description and drawings.

BRIEF DESCRIPTION OF THE FIGURES

The accompanying drawings are included to provide a further understanding of the inventive concept, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the inventive concept and, together with the description, serve to explain principles of the inventive concept. In the drawings:

FIG. 1 is a schematic longitudinal cross sectional view illustrating a substrate plating apparatus according to an embodiment of the present invention;

FIG. 2 is an exploded perspective view illustrating a state in which components of a hybrid paddle in FIG. 1 are functionally separated;

FIG. 3 is a perspective view illustrating the hybrid paddle and a substrate in FIG. 1;

FIG. 4 is a longitudinal cross-sectional view illustrating the hybrid paddle in FIG. 3;

FIG. 5 is a transversal cross-sectional view illustrating the hybrid paddle and the substrate in FIG. 3;

FIG. 6 is a longitudinal cross-sectional view illustrating the hybrid paddle and the substrate in FIG. 3;

FIG. 7 is a cross-sectional view illustrating a venturi tube in FIG. 1;

FIG. 8 is a schematic longitudinal cross sectional view illustrating a substrate plating apparatus according to another embodiment of the present invention;

FIG. 9 is a transversal cross-sectional view illustrating a hybrid paddle and a substrate in FIG. 8;

FIG. 10 is a longitudinal cross-sectional view illustrating the hybrid paddle and the substrate in FIG. 8; and

FIG. 11 is a schematic longitudinal cross sectional view illustrating a substrate plating apparatus according to another embodiment of the present invention.

DETAILED DESCRIPTION

Advantages and features of the present disclosure, and implementation methods thereof will be clarified through following embodiments described with reference to the accompanying drawings. The present invention may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art. Further, the present disclosure is only defined by scopes of claims. Like reference numerals refer to like elements throughout.

Hereinafter, a substrate plating apparatus according to an embodiment of the present invention will be described with reference to FIGS. 1 to 7.

FIG. 1 is a schematic longitudinal cross sectional view illustrating the substrate plating apparatus according to an embodiment of the present invention.

Referring to FIG. 1, a plating apparatus 100 according to the present invention, which is a substrate plating apparatus for plating a substrate W, includes: a plating bath 10 for accommodating a plating solution 15 therein; a substrate holder (not shown) for supporting the substrate W that is an object to be plated in a detachable manner; an anode 20 disposed at a position opposite to the substrate W in the plating bath 10; a hybrid paddle 50 disposed parallel to a surface of the substrate W between the substrate W and the anode 20; and a pump 30 and a venturi tube 40 for circulating the plating solution.

The substrate W and the anode 20 are electrically connected through a power 25. A current flows between the substrate W and the anode 20 so that a plated layer or a metal layer is formed on the surface of the substrate W. The plating apparatus 100 according to the present invention may process a circular substrate such as a wafer. However, the embodiment of the present invention is not limited thereto. For example, the plating apparatus 100 according to the present invention may process substrates having various shapes such as a rectangular substrate. The plating apparatus 100 according to the embodiment is a vertical type plating apparatus, in which the substrate W and the anode 20 are submerged into the plating solution 15 in a vertical direction.

FIG. 2 is an exploded perspective view illustrating a state in which components of the hybrid paddle in FIG. 1 are functionally separated. FIG. 3 is a perspective view illustrating the hybrid paddle and the substrate in FIG. 1. FIG. 4 is a longitudinal cross-sectional view illustrating the hybrid paddle in FIG. 3. FIG. 5 is a transversal cross-sectional view illustrating the hybrid paddle and the substrate in FIG. 3. FIG. 6 is a longitudinal cross-sectional view illustrating the hybrid paddle and the substrate in FIG. 3.

Referring to FIGS. 2 to 6, the hybrid paddle 50 is disposed in front of the substrate W in the plating bath 10 to stir the plating solution 15. The hybrid paddle 50 includes a spray assembly 52a and 54a for spraying the plating solution 15 toward the substrate W and a suction assembly 52b and 54b for suctioning air bubbles formed on the substrate W during plating. The spray assembly 52a and 54a and the suction assembly 52b and 54b are physically coupled into one body to perform a reciprocating movement along the surface of the substrate W and stir the plating solution 15. A driving unit (not shown) for driving the reciprocating movement of the hybrid paddle 50 may be provided.

The spray assembly 52a and 54a includes a plurality of spray tubes 54a spaced in parallel to each other and a supply tube 52a connected to one end of each of the plurality of spray tubes 54a. In other words, the supply tube 52a extends in a first direction, and each of the plurality of spray tubes 54a is branched from the supply tube 52a in a second direction that is substantially perpendicular to the first direction. The plurality of spray tubes 54a are spaced a constant gap from each other. Each of the spray tubes 54a sprays the plating solution through a plurality of spray nozzles 56a formed toward the substrate W. The plurality of spray nozzles 56a may be spaced a predetermined gap from each other along a longitudinal direction of the spray tube 54a.

The suction assembly 52b and 54b includes a plurality of suction tubes 54b arranged alternately with the plurality of spray tubes 54a and a discharge tube 52b connected to one end of each of the plurality of suction tubes 54b. In other words, the discharge tube 52b extends in parallel to the supply tube 52a in the first direction, and each of the plurality of suction tubes 54b is branched from the discharge tube 52b in the second direction to extend while the plurality of suction tubes 54b are spaced in parallel to each other. Each of the suction tubes 54b suctions the plating solution and air bubbles 2 around the substrate W through a plurality of suction holes 56b formed toward the substrate W. The plurality of suction holes 56b may be spaced a predetermined gap from each other along a longitudinal direction of the suction tube 54b. Although the air bubbles 2 are formed around a via hole 3 of the substrate W, the air bubbles 2 may be effectively removed through the suction holes 56b.

Since the plurality of spray tubes 54a and the plurality of suction tubes 54b are alternately arranged, the hybrid paddle 50 has a ladder shape. As described above, the spray assembly 52a and 54a and the suction assembly 52b and 54b are coupled into one body to perform a reciprocating movement, thereby stirring the plating solution. The hybrid paddle 50 performs a reciprocating movement in the first direction, i.e., the longitudinal direction of the supply tube 52a or the discharge tube 52b, or a direction perpendicular to the longitudinal direction of each of the plurality of spray tubes 54a or each of the suction tubes 54b. This reciprocating movement may effectively circulate and stir the plating solution around the substrate W.

Plating solution flow paths respectively formed in the spray assembly 52a and 54a and the suction assembly 52b and 54b may be separated from each other. In terms of a plating solution circulation, since the supply tube 52a of the spray assembly 52a and 54a is connected to the venturi tube 40, the plating solution supplied from the venturi tube 40 passes the spray tube 54a through the supply pipe 52a and is sprayed toward the substrate W through the spray nozzles 56a. Also, since the discharge tube 52b of the suction assembly 52b and 54b is connected to the venturi tube 40, the plating solution and the air bubbles 2 around the substrate W, which are suctioned through the suction holes 56b, pass the discharge tube 52b through the suction tubes 54b and are transferred to the venturi tube 40.

FIG. 7 is a cross-sectional view illustrating the venturi tube in FIG. 1.

Referring to FIGS. 1 and 7, the pump 30 and the venturi tube 40 circulate and stir the plating solution and remove air bubbles in conjunction with the hybrid paddle 50. Specifically, the pump 30 is connected to the plating bath 10 and collects the plating solution 15 accommodated in the plating bath 10 to discharge the plating solution 15 to the venturi tube 40.

The venturi tube 40 supplies the plating solution 15 discharged from the pump 30 to the spray assembly 52a and 54a. An inlet 41 connected to the pump 30 is formed at one side of the venturi tube 40, and an outlet 42 connected to the spray assembly 52a and 54a or the supply tube 52a is formed at the other side of the venturi tube 40. An acceleration section 43 having an internal diameter less than that of each of the inlet 41 and the outlet 42 is formed between the inlet 41 and the outlet 42. A circulation flow path 44 is formed in the acceleration section 43 and connected to the suction assembly 52b and 54b or the discharge tube 52b.

The plating solution introduced from the pump 30 to the inlet 41 by the venturi effect has a flow velocity that increases while passing through the acceleration section 43 by a pressure difference. That is, as a pressure is reduced in the acceleration section 43, a suction force is generated in the suction assembly 52b and 54b connected through the circulation flow path 44.

Hereinafter, a substrate plating apparatus according to another embodiment of the present invention will be described with reference to FIGS. 8 to 10. FIG. 8 is a schematic longitudinal cross sectional view illustrating the substrate plating apparatus according to another embodiment of the present invention. FIG. 9 is a transversal cross-sectional view illustrating a hybrid paddle and a substrate in FIG. 8. FIG. 10 is a longitudinal cross-sectional view illustrating the hybrid paddle and the substrate in FIG. 8. For convenience of description, a member having the same function as that shown in the drawings (FIGS. 1 to 7) of the previous embodiment is designated by the same reference numeral, and a description thereof will be omitted. Hereinafter, different points will be mainly described.

Referring to FIG. 8, a plating apparatus 200 according to the embodiment is a vertical type plating apparatus, in which one pair of anodes 20 are disposed at both sides of a substrate W, and a hybrid paddle 50 is disposed between the substrate W and each of the anodes 20.

Referring to FIGS. 9 and 10, the hybrid paddles 50 are disposed at both the sides of the substrate W so that spray tubes 54a and the suction tubes 54b of the hybrid paddles 50 face each other with the substrate W disposed therebetween. When air bubbles 2 are formed around a through hole 4 of the substrate W, a plating solution sprayed from a spray nozzle 56a of the spray tube 54a disposed at one side of the substrate W may pass through a through-hole 4 and be suctioned to a suction hole 56b of the suction tube 54b disposed at the other side of the substrate W together with the air bubbles 2, so that the plating solution and the air bubbles 2 are removed.

Hereinafter, a substrate plating apparatus according to another embodiment of the present invention will be described with reference to FIG. 11. FIG. 11 is a schematic longitudinal cross sectional view illustrating the substrate plating apparatus according to another embodiment of the present invention. For convenience of description, a member having the same function as that shown in the drawings (FIGS. 1 to 7) of the previous embodiment is designated by the same reference numeral, and a description thereof will be omitted. Hereinafter, different points will be mainly described.

Referring to FIG. 11, a substrate plating apparatus 300 according to the embodiment is a vertical type plating apparatus, in which a hybrid paddle 50 is disposed below a substrate W. A pump 30 collects a plating solution accommodated in a plating bath 10 and discharges the collected plating solution to a venturi tube 40, and the venturi tube 40 supplies the plating solution to a hybrid paddle 50 and an inner bath 12.

In this embodiment, the hybrid paddle 50 may also spray the plating solution toward the substrate W and simultaneously suction the plating solution and air bubbles around the substrate W to circulate and stir the entire plating solution, thereby removing the air bubbles around the substrate W.

Although the technical idea of the hybrid paddle and/or the venturi tube is applied to the electroplating apparatus as an example in the above-described embodiments of the present invention, the embodiment of the present invention is not limited thereto. The embodiments of the present invention may be applied to an electroless plating apparatus in the substantially same manner.

As described above, the substrate plating apparatus according to the present invention may improve the plating quality through excellent effects stated below by using the hybrid paddle including the spray assembly and the suction assembly, which are coupled into one body.

First, the spray assembly of the hybrid paddle may supply the constant plating solution or metal ions to the surrounding of the substrate through the circulation of the plating solution by collecting the plating solution accommodated in the plating bath and re-supplying the plating solution to the substrate. Furthermore, the force of stirring the plating solution may be improved by the spraying force of the spray assembly.

Second, the suction assembly of the hybrid paddle may maintain the constant state of the plating solution or the metal ions at the surrounding of the substrate by collecting the plating solution remained around the substrate after the plating. Also, the suction assembly may effectively remove the air bubbles generated during the plating while the plating solution is collected. Furthermore, the force of stirring the plating solution may be improved by the suction force of the suction assembly.

Third, the spray assembly and the suction assembly, which are alternately arranged, may be coupled into one body to perform the reciprocating movement along the surface of the substrate, and this physical movement may improve the force of stirring the plating solution.

Fourth, the pump may collect the plating solution accommodated in the plating bath and then supply the plating solution to the spray assembly of the hybrid paddle through the venturi tube. The circulation flow path is formed in the acceleration section in which the pressure in the venturi tube increases and connected to the suction assembly of the hybrid paddle. Thus, when the plating solution discharged from the pump is sprayed through the spray assembly, the suction force of the suction assembly connected to the circulation flow path increases by the pressure difference in the venturi tube, and the overall force of circulating the plating solution in the plating bath increases.

The description of the present invention is intended to be illustrative, and those with ordinary skill in the technical field of the present invention will be understood that the present invention can be carried out in other specific forms without changing the technical idea or essential features. Thus, the above-disclosed embodiments are to be considered illustrative and not restrictive.

Claims

1. A plating apparatus for a substrate, which plates a substrate, comprising: a plating bath configured to accommodate a plating solution; anda hybrid paddle disposed in front of the substrate in the plating bath to stir the plating solution,wherein the hybrid paddle comprises a spray assembly configured to spray the plating solution toward the substrate and a suction assembly configured to suction air bubbles formed on the substrate during plating, andthe spray assembly and the suction assembly are coupled into one body and perform a reciprocating movement along a surface of the substrate to stir the plating solution.

2. The plating apparatus of claim 1, wherein the spray assembly comprises: a plurality of spray tubes spaced in parallel to each other to spray the plating solution; and a supply tube connected to one end of each of the plurality of spray tubes to transfer the plating solution, and the suction assembly comprises: a plurality of suction tubes arranged alternately with the plurality of spray tubes to suction the air bubbles; and a discharge tube connected to one end of each of the plurality of suction tubes to transfer the air bubbles.

3. The plating apparatus of claim 2, wherein each of the spray tubes sprays the plating solution through a plurality of spray nozzles formed toward the substrate, and each of the suction tubes suctions the air bubbles through a plurality of suction holes formed toward the substrate.

4. The plating apparatus of claim 1, further comprising a pump and a venturi tube, which circulate the plating solution and supply the plating solution to the hybrid paddle, wherein the pump collects the plating solution accommodated in the plating bath and discharges the collected plating solution to the venturi tube,the venturi tube supplies the plating solution discharged from the pump to the spray assembly, and