SUBSTRATE STRUCTURE AND METHOD FOR FORMING PATTERNED LAYER ON SUBSTRATE STRUCTURE

Abstract

A substrate structure includes a substrate and a number of banks formed on the substrate. The banks and the substrate cooperatively define a number of accommodating rooms. The accommodating rooms are configured for accommodating ink. A spread-control layer is formed on the substrate beneath the accommodating rooms. The spread-control layer enables the ink applied on the spread-control layer to spread at a lower spreading rate than the rate on the substrate without the spread-control layer formed thereon.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present substrate structure and the present method can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present invention.

FIG. 1 is a schematic cross-sectional view of a substrate structure in accordance with a first embodiment;

FIG. 2 is a schematic cross-sectional view of a substrate structure in accordance with a second embodiment;

FIG. 3 is a schematic cross-sectional view of a substrate structure in accordance with a third embodiment;

FIG. 4 is a schematic cross-sectional view of a substrate structure in accordance with a fourth embodiment;

FIG. 5 is a schematic cross-sectional view of a substrate structure in accordance with a fifth embodiment;

FIG. 6 is a flow chart of a method for forming a patterned layer on the substrate structure;

FIGS. 7 and 8 are schematic cross-sectional views illustrating successive stages of a method for manufacturing the substrate structure of the first embodiment;

FIGS. 9 to 11 are schematic cross-sectional views illustrating successive stages of a method for manufacturing the substrate structure of the second embodiment;

FIGS. 12 to 14 are schematic cross-sectional views illustrating successive stages of another method for manufacturing the substrate structure of the second embodiment;

FIGS. 15 to 18 are schematic cross-sectional views illustrating successive stages of a method for forming a patterned layer on the substrate structure of the first embodiment;

FIG. 19 is a schematic cross-sectional view of a typical substrate structure.

Claims

1. A substrate structure, comprising: a substrate;a plurality of banks formed on the substrate, the banks and the substrate cooperatively defining a plurality of accommodating rooms, the accommodating rooms being configured for accommodating ink; anda spread-control layer formed on the substrate beneath the accommodating rooms, the spread-control layer enabling the ink applied on the spread-control layer to spread at a lower spreading rate than the rate on the substrate without the spread-control layer formed thereon.

2. The substrate structure as claimed in claim 1, wherein the material of the spread-control layer is selected from the group consisting of surfactants and polymer material.

3. The substrate structure as claimed in claim 1, wherein the material of the substrate is selected from the group consisting of glass, quartz glass, silicon, metal and plastic.

4. The substrate structure as claimed in claim 1, wherein the spread-control layer is formed covering the banks.

5. A substrate structure, comprising: a substrate;a plurality of banks formed on the substrate, the banks and the substrate cooperatively defining a plurality of accommodating rooms, the accommodating rooms being configured for accommodating ink; anda spread-control layer formed on the substrate beneath the accommodating rooms, the spread-control layer enabling the ink applied on the spread-control layer to spread over a smaller spreading area than the area on the substrate without the spread-control layer formed thereon.

6. The substrate structure as claimed in claim 5, wherein the material of the spread-control layer is selected from the group consisting of surfactants and polymer material.

7. The substrate structure as claimed in claim 5, wherein the material of the substrate is selected from the group consisting of glass, quartz glass, silicon, metal and plastic.

8. The substrate structure as claimed in claim 5, wherein the spread-control layer is formed covering the banks.

9. A method for forming a patterned layer on the substrate structure, comprising the steps of: providing a substrate structure as claimed in claim 1;jetting ink into the accommodating rooms using an ink jet device; andsolidifying the ink in the accommodating rooms to form the patterned layer on the substrate structure.

10. The method as claimed in claim 9, wherein the substrate structure is made by a method comprising the steps of: providing a substrate;forming a spread-control layer on the substrate using a method selected from the group consisting of dry film lamination, wet spin coating and wet slit coating;solidifying the spread-control layer;forming a photoresist film on the spread-control layer;exposing the photoresist film using a photomask with a predetermined pattern; anddeveloping the photoresist film to form a plurality of banks on the spread-control layer.

11. The method as claimed in claim 10, wherein the spread-control layer is solidified using a device selected from the group consisting of heating devices and light-exposure devices.

12. The method as claimed in claim 9, wherein the substrate structure is made by a method comprising the steps of: providing a substrate;forming a spread-control layer on the substrate by screen printing;solidifying the spread-control layer;forming a photoresist film on the substrate covering the spread-control layer;exposing the photoresist film using a photomask with a predetermined pattern; anddeveloping the photoresist film to form a plurality of banks on the substrate.

13. The method as claimed in claim 12, wherein the spread-control layer is solidified using a device selected from the group consisting of heating devices and light-exposure devices.

14. The method as claimed in claim 9, wherein the substrate structure is made by a method comprising the steps of: providing a substrate;forming a photoresist film on the substrate;exposing the photoresist film using a photomask with a predetermined pattern;developing the photoresist film to form a plurality of banks on the substrate, the banks and the substrate cooperatively defining a plurality of accommodating rooms; andforming a spread-control layer on the substrate in the accommodating rooms.

15. The method as claimed in claim 9, wherein the inkjet device is selected from the group consisting of a thermal bubble ink jet device and a piezoelectric ink jet device.

16. The method as claimed in claim 9, wherein the ink is solidified using at least one solidifying device selected from the group consisting of the vacuumizing devices, heating devices and light-exposure devices.

17. The method as claimed in claim 16, wherein the light-exposure devices comprise ultraviolet light-exposure devices.

18. The method as claimed in claim 9, further comprising the following step after the ink is solidified: removing portions of the banks which extend beyond the patterned layer through grinding or etching.

19. The method as claimed in claim 14, wherein the spread-control layer is formed using a method selected from the group consisting of: dry film lamination, wet spin coating, wet slit coating, and screening printing.

20. The method as claimed in claim 14, further comprising the following step after the spread-control layer is formed: solidifying the spread-control layer using a device selected from the group consisting of heating devices and light-exposure devices.

21. A substrate structure, comprising: a substrate with a plurality of grooves defined in a surface, the grooves being used as accommodating rooms for accommodating ink; anda spread-control layer formed on the substrate at the bottom of the accommodating rooms, the spread-control layer enabling the ink applied on the spread-control layer to spread at a lower spreading rate than the rate on the substrate without the spread-control layer formed thereon.

22. A method for forming a patterned layer on the substrate structure, comprising the steps of: providing a substrate structure as claimed in claim 21;jetting ink into the accommodating rooms using an ink jet device; andsolidifying the ink in the accommodating rooms to form a patterned layer on the substrate structure.