SUBSTRATE STRUCTURE AND METHOD FOR FORMING PATTERNED LAYER ON THE SAME

Abstract

A substrate structure includes a substrate and a plurality of unitary layer partition walls with ink repellent characteristic provided on and connected with the substrate, the partition walls cooperatively defining a plurality of separated first accommodating rooms configured for containing ink therein, at least one of the partition walls includes at least a second accommodating room configured for receiving excessive amount of ink overflowing from the first accommodating rooms. A method for manufacturing a patterned layer includes the steps of: preparing a substrate structure; applying ink into first accommodating rooms; solidifying the ink in the first accommodating rooms to form a patterned layer on the substrate structure.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present invention can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present invention. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is a schematic, plan view of a substrate structure according to a first preferred embodiment;

FIG. 2 is a schematic, cut-away view of the substrate structure of FIG. 1;

FIG. 3 is a schematic, cut-away view of an alternative substrate structure;

FIG. 4 is a schematic, plan view of a substrate structure according to a second preferred embodiment; and

FIG. 5 to FIG. 12 are side views showing stages of a method and procedures for manufacturing a substrate structure in accordance with a third preferred embodiment.

FIG. 13 is a schematic view of a conventional substrate structure.

Claims

1. A substrate structure, comprising: a substrate;a plurality of unitary layer partition walls with ink repellent characteristic provided on and connected with the substrate, the partition walls cooperatively defining a plurality of separated first accommodating rooms configured for containing ink therein, at least one of the partition walls includes at least a second accommodating room configured for receiving excess amount of ink overflowing from the first accommodating rooms;a patterned layer formed in the first accommodating rooms.

2. The substrate structure of claim 1, wherein the partition walls are made from one of resin, carbon black photoresist.

3. The substrate structure of claim 1, wherein a material of the substrate is selected from a group of glass, silicon wafer, metal and plastics.

4. The substrate structure of claim 1, wherein the substrate and the partition walls are formed from a single process.

5. The substrate structure of claim 1, wherein at least some of the second accommodating rooms are in communication with each other.

6. The substrate structure of claim 1, wherein at least some of the second accommodating rooms cooperatively form a closed channel surrounding the corresponding first accommodating room therein.

7. The substrate structure of claim 1, wherein the ink repellent characteristic of the partition walls is refer that a contact angle between the ink and the partition wall is lager than 15 degrees and less than 90 degrees.

8. The substrate structure of claim 1, wherein the ink repellent characteristic of the partition walls is refer that a contact angle between the ink and the partition wall is lager than 20 degrees and less than 68 degrees.

9. A method for forming a patterned layer on a substrate structure, comprising the steps of: preparing a substrate structure of claim 1;depositing ink into the first accommodating rooms; andsolidifying the ink in the first accommodating rooms to form the patterned layer on the substrate structure.

10. The method of claim 9, wherein a procedure for preparing the substrate structure comprising the steps of: providing a substrate;applying a first photoresist film on the substrate;exposing the first photoresist film using a first mask which has a pattern corresponding to the first accommodating rooms and the second accommodating rooms; anddeveloping the first photoresist film to form a patterned first photoresist film on the substrate serving as the partition walls.

11. The method of claim 10, wherein the first mask is a gray-level mask.

12. The method of claim 10, wherein the substrate structure is a color filter substrate and the patterned layer is a color strips.

13. The method of claim 9, wherein a procedure for preparing the substrate structure comprising the steps of: providing a substrate;applying a first photoresist film on a surface of the substrate;exposing the first photoresist film using a second mask which has a pattern corresponding to the first accommodating rooms and second accommodating roomexposing the first photoresist film using a third mask which has a pattern corresponding to the first accommodating rooms;developing unexposed portions of the first photoresist film;removing remaining portions of the first photoresist film to form the partition walls on the substrate.

14. The method of claim 9, wherein a procedure for preparing the substrate structure comprising the steps of: providing a mold having a pattern corresponding to the partition walls;injecting a material of the substrate structure into the mold by an injection machine; andmolding a substrate structure having the partition walls thereon.

15. The method of claim 9, wherein the step of solidifying the ink in the first accommodating rooms is performed by a device selected from a group consisting of a vacuumizing device, a heating device, a light-exposure device and any combination thereof.