SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING PATTERNED LAYER THEREON

Abstract

A substrate structure includes a substrate and a plurality of banks formed on the substrate. A substrate structure includes a substrate and a plurality of banks formed on the substrate. The banks and the substrate cooperatively define a plurality of accommodating rooms. The accommodating rooms are configured for accommodating ink. A width W of the bank is a function of a height H of the bank. A plot of the function W=f (H) has at least one discontinuity point. A left hand limit at the at least one discontinuity point being greater than a right hand limit at the at least one discontinuity point.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present substrate structure and the present method can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present substrate structure and the present method.

FIG. 1 is a schematic, cross-sectional view of a substrate structure in accordance with a first embodiment;

FIG. 2 is a schematic, plan view of the substrate structure of FIG. 1;

FIG. 3 is a chart of a function W=f (H) in accordance with the first embodiment;

FIG. 4 is a schematic, plan view of a substrate structure in accordance with a second embodiment;

FIG. 5 is a schematic, cross-sectional view of a substrate structure in accordance with a third embodiment;

FIG. 6 is a chart of a function W=f (H) in accordance with the third embodiment;

FIG. 7 is a schematic, cross-sectional view of a substrate structure in accordance with a fourth embodiment;

FIG. 8 is a chart of a function W=f (H) in accordance with the fourth embodiment;

FIG. 9 is a schematic, cross-sectional view of a substrate structure in accordance with a fifth embodiment;

FIG. 10 is a chart of a function W=f (H) in accordance with the fifth embodiment;

FIG. 11 is a schematic, plan view of a substrate structure in accordance with a sixth embodiment;

FIGS. 12 and 13 are schematic cross-sectional views illustrating successive stages of a method for manufacturing the substrate structure of FIG. 1;

FIGS. 14 to 18 are schematic cross-sectional views illustrating successive stages of another method for manufacturing the substrate structure of FIG. 1;

FIGS. 19 to 22 are schematic cross-sectional views illustrating successive stages of a method for forming a patterned layer using the substrate structure of FIG. 1; and

FIG. 23 is a schematic cross-sectional view of a typical substrate structure.

Claims

1. A substrate structure, comprising: a substrate; anda plurality of banks formed on the substrate, the banks and the substrate cooperatively defining a plurality of accommodating rooms, the accommodating rooms being configured for accommodating ink,wherein a width W of the bank is a function of a height H of the bank, a plot of the function W=f (H) comprising at least one discontinuity point, a left hand limit at the at least discontinuity point being greater than a right hand limit at the at least one discontinuity point.

2. The substrate structure as claimed in claim 1, wherein the ink is selected from the group consisting of colored ink and black ink.

3. The substrate structure as claimed in claim 1, wherein a material of the substrate is selected from the group consisting of glass, quartz, silicon, metal and plastic.

4. A substrate structure, comprising: a substrate; anda plurality of banks formed on the substrate, each of the banks comprising an upper portion having a width less than that of a lower portion, the banks and the substrate cooperatively defining a plurality of accommodating rooms, the accommodating rooms being configured for accommodating ink.

5. The substrate structure as claimed in claim 4, wherein the upper portion of each of the banks is a protrusion protruding from the lower portion.

6. The substrate structure as claimed in claim 5, wherein a cross-section of the protrusion has a shape selected from the group consisting of rectangle, triangle, convex, and trapezoid.

7. The substrate structure as claimed in claim 5, wherein the upper portions of the banks are a plurality of rows of protrusions.

8. The substrate structure as claimed in claim 7, wherein the protrusions are discrete protrusions and arranged in a staggered fashion.

9. A method for manufacturing a patterned layer, comprising the steps of: providing a substrate structure as claimed in claim 1;depositing ink into the accommodating rooms using a dispenser; andsolidifying the ink in the accommodating rooms to form a patterned layer on the substrate structure.

10. The method as claimed in claim 9, wherein the substrate structure is made by a method comprising the steps of: providing a substrate;applying a photoresist film on the substrate;exposing the photoresist film using a photomask with a predetermined pattern; anddeveloping the photoresist film to form a plurality of banks.

11. The method as claimed in claim 10, wherein the photomask is a gray-scale photomask.

12. The method as claimed in claim 9, wherein the substrate structure is made by a method comprising the steps of: providing a substrate;applying a first photoresist film on the substrate;exposing the first photoresist film using a first photomask with a predetermined pattern;developing the first photoresist film;applying a second photoresist film on the first photoresist film;exposing the second photoresist film using a second photomask with a predetermined pattern; anddeveloping the second photoresist film to form a plurality of banks.

13. The method as claimed in claim 9, wherein the substrate structure is made by a method comprising the steps of: providing a substrate;applying a first photoresist film on the substrate;exposing the first photoresist film using a first photomask with a predetermined pattern;applying a second photoresist film on the first photoresist film;exposing the second photoresist film using a second photomask with a predetermined pattern; anddeveloping the first photoresist film and the second photoresist film to form a plurality of banks.

14. The method as claimed in claim 9, wherein the dispenser is an ink jet device.

15. The method as claimed in claim 9, wherein the ink is solidified using at least one solidifying device selected from the group consisting of the vacuumizing devices, heating devices and light-exposure devices.

16. The method as claimed in claim 15, wherein the light-exposure devices comprise ultraviolet light-exposure devices.

17. The method as claimed in claim 9, further comprising the following step after the ink is solidified: removing portions of the banks which extend beyond the patterned layer through grinding or etching.

18. The method as claimed in claim 14, wherein the ink jet device is selected from the group consisting of a thermal bubble ink jet device and a piezoelectric ink jet device.

19. A method for manufacturing a patterned layer, comprising the steps of: providing a substrate structure as claimed in claim 4;depositing ink into the accommodating rooms using a dispenser; andsolidifying the ink in the accommodating rooms to form the patterned layer on the substrate structure.