Claims
- 1. Coating composition comprising: at least one organic binder; and at least one of organic or inorganic, fine grained substances in an amount from 0.1-20 weight percent, wherein said inorganic fine grained substances are selected from the group consisting of silica, talcum, untreated mica, surface-treated mica, and mixtures thereof, and wherein the surface of the fine grained inorganic substances are covered with organic resins or polymers; wherein said coating composition is to be used as a bonding layer for a substrate to be laser printed.
- 2. Coating composition according to claim 1, wherein the organic fine grained substances are organic particles which are polymers selected from the group consisting of polyamides and polyurethanes.
- 3. Coating composition according to claim 1, wherein the organic substances on the surface of the inorganic particles are from the same substances making up the organic binder.
- 4. Coating composition according to claim 1, wherein the particles do not dissolve in the organic layer.
- 5. Coating composition according to claim 1, including from 0.3-10 weight percent of fine grained particles.
- 6. Coating composition according to claim 1, wherein the organic binder is at least one of melamine, polyesters that are cross-linkable with urea resins, polystyrene-acrylates, and cellulose nitrates.
- 7. Coating composition according to claim 1, wherein the organic binder is at least one of isocyanate and isocyanurate cured organic coatings based on polyester and polyacrylate.
- 8. Coating composition according to claim 1, wherein the organic binder includes non-curable fractions.
- 9. Coating composition according to claim 1, wherein the organic layer has a thickness of 1-2 microns.
- 10. Coating composition according to claim 1, wherein said coating composition is prepared with a solvent.
Priority Claims (1)
| Number |
Date |
Country |
Kind |
| 96810154 |
Mar 1996 |
EP |
|
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a divisional of U.S. patent application Ser. No. 09/182,697, filed Oct. 29, 1998, which in turn is a continuation of U.S. patent application Ser. No. 08/807,475, filed Feb. 27, 1997, now abandoned.
US Referenced Citations (6)
Foreign Referenced Citations (2)
| Number |
Date |
Country |
| 158619 |
Dec 1975 |
JP |
| 8178417 |
Nov 1983 |
JP |
Continuations (1)
|
Number |
Date |
Country |
| Parent |
08/807475 |
Feb 1997 |
US |
| Child |
09/182697 |
|
US |