Substrate with raised edge pads

Abstract

A separable electrical connection may be provided with a landside pad on one of two electrical components to be joined. The landside pad may be made up of two parts, including a flat portion and a raised edge formed on the flat portion. In some embodiments, the raised edge may have a closed geometric shape. Then, a socket contact engaging the junction between the flat portion and the raised edge is prevented from sliding off of the landside pad by the raised edge. In addition, dual areas of electrical connection can be established between both the flat portion and raised edge of the landside pad and the correspondingly shaped pair of portions on the socket. This increases the electrical efficiency of the connection and its security.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an enlarged, cross-sectional view of one embodiment of the present invention;

FIG. 2 is an enlarged, cross-sectional view at an early stage of manufacture of the embodiment shown in FIG. 1 in accordance with one embodiment of the present invention;

FIG. 3 is an enlarged, cross-sectional view at a subsequent stage in accordance with one embodiment of the present invention;

FIG. 4 is an enlarged, cross-sectional view at a subsequent stage in accordance with one embodiment of the present invention;

FIG. 5 is an enlarged, cross-sectional view at a subsequent stage in accordance with one embodiment of the present invention;

FIG. 6 is an end view of a socket contact in accordance with one embodiment of the present invention;

FIG. 7 is a cross-sectional view taken generally along the line 7-7 in FIG. 1;

FIG. 8 is a vertical cross-section through a portion of a motherboard with a processor mounted thereon, in accordance with one embodiment; and

FIG. 9 is a system depiction for one embodiment.

Claims

1. A method comprising: forming an electrical connection between two electrical components using a contact on one component and a landside pad on the other component, said landside pad having a raised edge.

2. The method of claim 1 including providing a landside pad with a closed raised edge.

3. The method of claim 2 including providing a landside pad with a circular raised edge.

4. The method of claim 1 including providing a socket contact that has a shape that conforms to the shape of said landside pad raised edge.

5. The method of claim 4 including providing a circular raised edge and a circular contact.

6. The method of claim 5 including providing a raised edge and a contact with substantially the same radii of curvature.

7. The method of claim 1 including contacting the landside pad with said contact on two different surfaces.

8. The method of claim 7 including providing two transverse contacting surfaces between said pad and said contact.

9. The method of claim 1 including forming said landside pad by forming a first substantially planar landside pad portion and depositing a second layer to form said raised edge.

10. A method comprising: forming a substantially planar portion of a landside pad on an electrical component; andforming a raised edge on said portion by depositing a metal on said substantially planar portion.

11. The method of claim 10 including forming said raised edge in a closed geometric shape.

12. The method of claim 11 including forming said raised edge in a circular shape.

13. The method of claim 10 including forming the planar portion of said landside pad, patterning a mask over said planar portion and depositing a metal in the mask formed over said planar portion to form said raised edge.

14. The method of claim 13 including providing solder resist around the resulting landside pad.

15. A separable electrical connection comprising: a contact including a curved portion having a flat end; anda landside pad including a flat disc shaped portion and a raised edge around said flat disc shaped portion, such that said contact flat end to abut against said disc shaped portion and said curved portion abuts against said raised edge.

16. The connection of claim 15 wherein said curved portion is cylindrical.

17. The connection of claim 15 wherein said raised edge is ring shaped.

18. The connection of claim 17 wherein said the curved portion and said raised edge have substantially the same radii of curvature.

19. The connection of claim 15 including a first electrical component coupled to said landside pad and a second electrical component coupled to said contact.

20. The connection of claim 15 including a ring shaped raised edge surrounding a flat disc shaped flat portion on said landside pad, said contact including a cylindrical portion and a flat end, said cylindrical portion abutting said raised edge and said flat portion abutting said disc shaped portion.

21. A system comprising: a support;a socket electrically coupled to said support;a component electrically coupled to said socket, said socket including a contact including a curved portion having a flat end, and a landside pad including a flat disc shaped portion and a raised edge around said flat disc shaped portion, such that said contact flat end to abut against said disc shaped portion and said curved portion abuts against said raised edge;a processor coupled to said support; anda dynamic random access memory coupled to said support.

22. The system of claim 21 wherein said support is a motherboard.

23. The socket of claim 21 wherein said curved portion is cylindrical.

24. The socket of claim 21 wherein said raised edge is ring shaped.

25. The socket of claim 21 wherein said the curved portion and said raised edge have substantially the same radii of curvature.